1. A motorcycle attachment system attachable to a motorcycle having a frame to safely transport musical instruments comprising:
an instrument case;
a first bracket attached to said instrument case at a back side thereof;
a second bracket attached to said instrument case at a point spaced forward from said first bracket;
a first and a second spaced mounting post, each having a free end, said first post mounted forward of second post, said mounting posts being mounted to said motorcycle in the vicinity of the upper portion of the rear tire thereof;
a mounting spool having a free end, said mounting spool being mounted to the frame of said motorcycle at a point in the vicinity of the rear wheel of said motorcycle;
said first bracket having a forward opening groove for receiving said first mounting post;
said first bracket having a downward opening groove for receiving said second mounting post;
said second bracket having an upward opening groove for receiving said mounting spool;
said second bracket having a spring-biased latch so located on said second bracket as to removably retain said mounting spool within said upward opening groove.
2. The motorcycle attachment system of claim 1, wherein said first and said second spaced mounting posts are mounted on a rear portion of said frame.
3. The motorcycle attachment system of claim 1, wherein said first and said second spaced mounting posts are mounted by means of mounting screws extending through corresponding apertures in the rear fender of said motorcycle.
4. The motorcycle attachment system of claim 1, wherein said first and said second spaced mounting posts are mounted on the rear fender of said motorcycle.
5. The motorcycle attachment system of claim 1, wherein said motorcycle has a fender rail attached to a portion of said frame, said fender rail extending along the upper portion of a rear fender, said first and said second mounting posts being mounted on said fender rail.
6. The motorcycle attachment system of claim 1, wherein said mounting spool is mounted to said frame by means of a spacing front bracket support extending between the said frame and said spool mounting point.
7. The motorcycle attachment system of claim 6, wherein said front bracket support is a steel flat member having a forward end and a rearward end, said forward end being removably bolted to said frame at a point to the rear and in the vicinity of the transmission of said motorcycle, said rearward end bearing said mounting spool.
8. The motorcycle attachment system of claim 1, wherein said first and second spaced mounting posts have circumferential attachment grooves spaced from their free ends, respectively.
9. The motorcycle attachment system of claim 8, wherein said first mounting bracket has a retaining rim at the inward side of said forward opening groove, said retaining rim engaging said circumferential groove of said first mounting post.
10. The motorcycle attachment system of claim 9, wherein said first mounting bracket has a retaining rim at the inward side of said downward opening groove, said retaining rim engaging said circumferential groove of said second mounting post.
11. The motorcycle attachment system of claim 1, wherein said case is a rigid case having a removable liner bag for receiving an instrument therein.
12. The motorcycle attachment system of claim 11, wherein said liner bag comprises cushioning foam.
13. The motorcycle attachment system of claim 12, wherein said instrument case is adapted for carrying a guitar.
14. The motorcycle attachment system of claim 1, wherein said spring-biased docking latch of said second mounting bracket is rotatively mounted between an open position and a closed position and on the inward side of said second mounting bracket adjacent said upward opening mounting spool receiving groove such that said spring-biased latch may releasably engage and retain said mounting spool within said upward opening groove.
15. The motorcycle attachment system of claim 14, wherein said docking latch has an upward opening groove having a spring-biased latch member for retaining said spool when said latch member is rotated to said closed position and releasing said spool when said latch body is rotated to and open position.
16. The motorcycle attachment system of claim 15, wherein said latch member has a release crank extending below said second bracket for rotating said docking latch between a closed position and an open position.
17. The motorcycle attachment system of claim 16, wherein said release crank is knurled for ease in hand disengagement of said mounting spool by the user.
18. The motorcycle attachment system of claim 17, wherein said mounting spool and said second mounting post are so located relative to said first bracket and said second bracket such that when said case is supported on said first mounting post by said first bracket and within said forward end opening groove, said second mounting post engages said downward opening groove of said first bracket and said mounting post engages said upward opening groove of said second bracket while being retained by said upward opening latch of said spring-biased docking latch.
The claims below are in addition to those above.
All refrences to claims which appear below refer to the numbering after this setence.
1. A spin clean method, comprising:
providing pressurized cleaning liquid onto a wafer while spinning the wafer,
wherein vertical jet pressure on the wafer and wafer spin speed are substantially maintained in inverse proportion.
2. The method as claimed in claim 1, wherein vertical jet pressure is 120 KPa to 0.05 KPa, and wafer spin speed is 0 to 1200 rpm.
3. The method as claimed in claim 1, wherein vertical jet pressure is 0 KPa to 120 KPa, and the wafer spin speed is 0 To 1200 rpm.
4. The method as claimed in claim 1, wherein the cleaning liquid consists essentially of de-ionized water.
5. The method as claimed in claim 1, further comprising scrubbing the wafer with at least one brush and the spin speed of the at least one brush is 50 to 2500 rpm.
6. A spin clean method for removing particles from a wafer, the method comprising:
positioning a wafer onto a chuck, the wafer having a plurality of particles thereon;
providing pressurized cleaning liquid onto the wafer from a nozzle positioned above the wafer; and
spinning the chuck about an axis to remove the particles,
wherein vertical jet pressure on the wafer and wafer spin speed are substantially maintained in inverse proportion and a particle removal rate is no less than 95%.
7. The method as claimed in claim 6, wherein vertical jet pressure is 0 KPa to 120 KPa, and wafer spin speed is 0 to 1200 rpm.
8. The method as claimed in claim 6, wherein vertical jet pressure is 0 KPa to 120 KPa, and wafer spin speed is 0 to 1200 rpm.
9. The method as claimed in claim 6, wherein the cleaning liquid consists essentially of de-ionized water.
10. The method as claimed in claim 6, further comprising scrubbing the wafer with at least one brush and the spin speed of the at least one brush is 50 to 2500 rpm.
11. The method as claimed in claim 6, wherein the nozzle is positioned 5 to 300 millimeters from the wafer surface.
12. A spin clean method, comprising:
positioning a wafer onto a chuck, the wafer having a plurality of particles thereon;
providing pressurized cleaning liquid onto the wafer from a nozzle positioned above the wafer; and
spinning the chuck about an axis, whereby the cleaning liquid spreads out over the wafer;
wherein vertical jet pressure on the wafer and wafer spin speed follows the equation:
Jet pressure(Kpa)*spin speed(rpm)<12000 Kpa*rpm
13. The method as claimed in claim 12, wherein vertical jet pressure is 100 KPa to 0.05 KPa, and wafer spin speed is 50 to 1200 rpm.
14. The method as claimed in claim 12, wherein vertical jet pressure is 0 KPa to 120 KPa, and the wafer spin speed is 0 to 120 rpm.
15. The method as claimed in claim 12, wherein the cleaning liquid consists essentially of de-ionized water.
16. The method as claimed in claim 12, further comprising scrubbing the wafer with at least one brush and the spin speed of,the at least one brush is 500 to 2500 rpm.
17. The method as claimed in claim 12, wherein the nozzle is positioned 50 to 300 millimeters from the wafer surface.