1. A device for anchoring a ladder onto a ground surface comprising a first anchoring member having a front side and a back side and a second anchoring member having a front side and a back side, said ladder having a first leg and a second leg, said each of the first and second anchoring member comprising:
a channel bracket having a bottom, a first sidewall and a second sidewall, said bottom having an undersurface and an oversurface;
a ground-engaging member having a first end, a second end and a length portion, said first end of said ground-engaging member being attached to the bottom of said channel bracket, said second end and said length portion being adapted for engagement with the ground;
a pivot rod having a first end and a second end, said first end being affixed to a spot on the first sidewall of the channel bracket and a second end being affixed to the second sidewall of the channel bracket, said pivot rod traversing an inside portion of the channel bracket from the first sidewall of the channel bracket to the second sidewall of the channel bracket; and
a brace member having a first sidewall, a second sidewall, an open bottom, a front wall and a back wall, said pivot rod being threaded though an opening in the first sidewall and an opening in the second sidewall in a manner that said pivot rod supports the brace member and in a manner that said brace member is adapted for pivoting around the pivot rod in a direction from the front side of the anchoring member toward the back side of the anchoring member and vice versa,
said ground-engaging member of the first anchoring member and the around-engaging member of the second anchoring member each comprises a straight post adapted for insertion into the ground,
wherein the device for anchoring a ladder onto a ground surface, in a position of the ground-engaging member of the first anchoring member being engaged with the ground, the brace member of the first anchoring member is adapted for containing the first leg of the ladder and further adapted for pivoting from at least a position wherein the front wall of the brace member is substantially parallel with the ground at the front side of the first anchoring member to a position wherein the back wall of the brace member of the first anchoring member is substantially parallel with the ground at the backside of the first anchoring member, said first leg of the ladder being placed onto the pivot rod of the first anchoring member, said pivot rod of the first anchoring member is guiding and supporting the first leg of the ladder in the course of said first ladder leg moving from the position wherein the front wall of the brace member is substantially parallel with the ground at the front side of the first anchoring member to the position wherein the back wall of the brace member of the first anchoring member is substantially parallel with the ground at the backside of the first anchoring member.
2. The device of claim 1 wherein, in a position of the ground-engaging member of the second anchoring member being engaged with the ground, the brace member of the second anchoring member is adapted for containing the second leg of the ladder and further adapted for pivoting from at least a position wherein the front wall of the brace member is substantially parallel with the ground at the front side of the second anchoring member to a position wherein the back wall of the brace member of the second anchoring member is substantially parallel with the ground at the backside of the second anchoring member, said second leg of the ladder being placed onto the pivot rod of the second anchoring member, said pivot rod of the second anchoring member guiding and supporting the second leg of the ladder in the course of said second ladder leg moving from the position wherein the front wall of the brace member is substantially parallel with the ground at the front side of the second anchoring member to the position wherein the back wall of the brace member of the second anchoring member is substantially parallel with the around at the backside of the second anchoring member.
3. A device for anchoring a ladder onto a ground surface comprising a first anchoring member having a front side and a back side and a second anchoring member having a front side and a back side, said ladder having a first rung, said ladder also having a first vertical side attached to a side of the first rung and a second vertical side attached to an opposite side of the first rung, said each of the first and second anchoring member comprising:
a channel bracket having a bottom, a first side and a second side, said bottom having an undersurface and an oversurface;
a ground-engaging member having a first end, a second end and a length portion, said first end of said ground-engaging member being attached to the bottom of said channel bracket, said second end and said length portion being adapted for engagement with the ground;
a pivot rod having a first end and a second end, said first end being affixed to a spot on the first side of the channel bracket and the second end being affixed to the second side of the channel bracket;
a brace member having a first sidewall, a second sidewall, an open bottom, a front wall and a back wall, said pivot rod being threaded though an opening in the first sidewall and an opening in the second sidewall in a manner that said pivot rod supports the brace member and in a manner that said brace member is adapted for pivoting around the pivot rod in a direction from the front side of the anchoring member toward the back side of the anchoring member and vice versa, said brace member being adapted for supporting the first rung of a ladder;
a lateral extension tab attached to an upper portion of the brace member front wall; and
a lateral extension tab attached to an upper portion of the brace member back wall.
4. The device of claim 3, wherein the first sidewall of the brace member is notched and the second sidewall of the brace member is notched.
5. The device of claim 3, wherein the first rung is adapted to fit inside the brace member of the first anchoring member and the second anchoring member.
6. The device of claim 3, wherein the first vertical side of the ladder is adapted to fit between the lateral extension tab attached to the upper portion of the front wall of the brace member of the first anchoring member and the lateral extension tab attached to the upper portion of the back wall of the brace member of the first anchoring member.
7. The device of claim 3, wherein the second vertical side of the ladder is further adapted to fit between the lateral extension tab attached to the upper portion of the front wall of the brace member of the second anchoring member and the lateral extension tab attached to the upper portion of the back wall of the brace member of the first anchoring member.
The claims below are in addition to those above.
All refrences to claims which appear below refer to the numbering after this setence.
1. A multi-chip package, comprising:
a substrate having a grounding structure;
two semiconductor elements disposed on and electrically connected to the substrate;
an encapsulant formed on the substrate and encapsulating the semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and
an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure.
2. The multi-chip package of claim 1, wherein the encapsulant further has at least one strip hole, and the at least one strip hole and the round holes are spaced at an interval.
3. The multi-chip package of claim 2, wherein the electromagnetic shielding structure is further formed in the at least one strip hole.
4. The multi-chip package of claim 1, further comprising a heat dissipating element formed on the encapsulant.
5. A multi-chip package, comprising:
a substrate having a grounding layer;
two semiconductor elements disposed on and electrically connected to the substrate;
an encapsulant formed on the substrate and encapsulating the semiconductor elements, wherein the encapsulant has a plurality of round holes penetrating the encapsulant and substrate and formed between the semiconductor elements; and
an electromagnetic shielding structure formed in each of the round holes and connected to the grounding layer.
6. The multi-chip package of claim 5, wherein the encapsulant further has at least one strip hole, and the at least one strip hole and the round hole are spaced at an interval.
7. The multi-chip package of claim 6, wherein the electromagnetic shielding structure is further formed in the at least one strip hole.
8. The multi-chip package of claim 5, further comprising a heat dissipating element formed on the encapsulant.
9. A method for manufacturing a multi-chip package, comprising:
forming an encapsulant on a substrate having two semiconductor elements disposed thereon such that the semiconductor elements are embedded in the encapsulant, wherein the substrate has a grounding structure;
forming a plurality of round holes disposed between the semiconductor elements and penetrating the encapsulant; and
forming an electromagnetic shielding structure in each of the round holes and connecting the electromagnetic shielding structure to the grounding structure.
10. The method of claim 9, further comprising forming at least one strip hole in the encapsulant, and the at least one strip hole and the round hole are spaced at an interval.
11. The method of claim 10, wherein the electromagnetic shielding structure is further formed in the at least one strip hole.
12. The method of claim 9, further comprising forming a heat dissipating element on the encapsulant.
13. The method of claim 9, wherein the round holes are formed by a laser drilling method.
14. A method for manufacturing a multi-chip package, comprising:
forming an encapsulant on a substrate having two semiconductor elements disposed thereon such that the semiconductor elements are embedded in the encapsulant, wherein the substrate has a grounding layer;
forming a plurality of round holes disposed between the semiconductor elements and penetrating the encapsulant and substrate; and
forming an electromagnetic shielding structure in each of the round holes and connecting the electromagnetic shielding structure to the grounding layer.
15. The method of claim 14, further comprising forming at least one strip hole in the encapsulant, and the at least one strip hole and the round hole are spaced at an interval.
16. The method of claim 15, wherein the electromagnetic shielding structure is further formed in the at least one strip hole.
17. The method of claim 14, further comprising forming a heat dissipating element on the encapsulant.
18. The method of claim 14, wherein the round holes are formed by a laser drilling method.