1. A method of analyzing a semiconductor test process comprising:
determining characteristics of a plurality of probe marks; and
identifying one or more test process errors based on said characteristics.
2. The method of claim 1 wherein said determining includes analyzing images of selected probe marks to obtain one or more of said characteristics.
3. The method of claim 1 wherein, said determining includes acquiring one or more measurements of selected probe marks, the one or more measurements including length, width, size, angle, orientation, center, depth.
4. The method of claim 1 wherein said identifying includes analyzing a die pattern.
5. The method of claim 1 wherein said identifying includes analyzing a wafer pattern.
6. The method of claim 1 wherein said identifying includes calculating a prober set up error.
7. The method of claim 6 wherein said prober set up error is representative of a prober fixturing error.
8. The method of claim 7 wherein said prober fixturing error comprises a probe card pitch error.
9. The method of claim 7 wherein said prober fixturing error comprises a probe card roll error.
10. The method of claim 6 wherein said prober set up error comprises a probe-to-pad alignment error.
11. The method of claim 10 wherein said probe-to-pad alignment error comprises an X-axis setup error.
12. The method of claim 10 wherein said probe-to-pad alignment error comprises a Y-axis setup error.
13. The method of claim 10 wherein said probe-to-pad alignment error comprises a probe card yaw error.
14. The method of claim 1 wherein said identifying comprises calculating a prober performance error.
15. The method of claim 14 wherein said prober performance error comprises a prober stage error.
16. The method of claim 14 wherein said prober performance error comprises an X-axis alignment error.
17. The method of claim 14 wherein said prober performance error comprises a Y-axis alignment error.
18. The method of claim 14 wherein said prober performance error comprises a wafer alignment error.
19. The method of claim 14 wherein said prober performance error comprises an orthogonality error.
20. The method of claim 14 wherein said prober performance error comprises a prober scaling error.
21. The method of claim 14 wherein said prober performance error comprises variation in probe card pin overtravel.
22. The method of claim 14 wherein said prober performance error comprises a deflection error.
23. The method of claim 1 wherein said identifying comprises calculating residual error.
24. The method of claim 1 wherein said identifying comprises calculating variations in probe card yaw.
25. The method of claim 1 wherein said identifying comprises calculating probe card accuracy.
26. The method of claim 1 wherein said identifying comprises calculating probe card repeatability.
27. A computer readable medium for analyzing semiconductor test process error and interaction, said medium encoded with data and instructions causing an apparatus executing said instructions to:
determine characteristics of a plurality of probe marks; and
identify one or more test process errors based on said characteristics.
28. The computer readable medium of claim 27, wherein determination of said characteristics includes analyzing images of selected probe marks to obtain one or more of said characteristics.
29. The computer readable medium of claim 27, wherein determination of said characteristics includes acquiring one or more measurements of selected probe marks, the one or more measurements including length, width, size, angle, orientation, center, depth.
30. The computer readable medium of claim 27, wherein identification includes analyzing a die pattern.
31. The computer readable medium of claim 27, wherein identification includes analyzing a wafer pattern.
32. The computer readable medium of claim 27, wherein identification includes calculating a prober set up error.
33. The computer readable medium of claim 32 wherein said prober set up error is representative of a prober fixturing error.
34. The computer readable medium of claim 33 wherein said prober fixturing error comprises a probe card pitch error.
35. The computer readable medium of claim 33 wherein said prober fixturing error comprises a probe card roll error.
36. The computer readable medium of claim 32 wherein said prober set up error comprises a probe-to-pad alignment error.
37. The computer readable medium of claim 36 wherein said probe-to-pad alignment error comprises an X-axis setup error.
38. The computer readable medium of claim 36 wherein said probe-to-pad alignment error comprises a Y-axis setup error.
39. The computer readable medium of claim 36 wherein said probe-to-pad alignment error comprises a probe card yaw error.
40. The computer readable medium of claim 27 wherein identification includes calculating a prober performance error.
41. The computer readable medium of claim 40 wherein said prober performance error comprises a prober stage error.
42. The computer readable medium of claim 40 wherein said prober performance error comprises an X-axis alignment error.
43. The computer readable medium of claim 40 wherein said prober performance error comprises a Y-axis alignment error.
44. The computer readable medium of claim 40 wherein said prober performance error comprises a wafer alignment error.
45. The computer readable medium of claim 40 wherein said prober performance error comprises an orthogonality error.
46. The computer readable medium of claim 40 wherein said prober performance error comprises a prober scaling error.
47. The computer readable medium of claim 40 wherein said prober performance error comprises variation in probe card pin overtravel.
48. The computer readable medium of claim 40 wherein said prober performance error comprises a deflection error.
49. The computer readable medium of claim 27 wherein identification includes calculating residual error.
50. The computer readable medium of claim 27 wherein identification includes calculating variations in probe card yaw.
51. The computer readable medium of claim 27 wherein identification includes calculating probe card accuracy.
52. The computer readable medium of claim 27 wherein identification includes calculating probe card repeatability.
53. A method of analysis comprising:
generating a merged data set, including the steps of:
acquiring measured data representing one or more wafer probe marks relative to a defined location;
acquiring measured data representing probe card pin overtravel;
merging said measured data representing wafer probe mark and said measured data representing probe card pin overtravel to obtain said merged data set;
optimizing said merged data set to minimize errors in said merged data set; and
identifying one or more component errors and interactions based upon said merged data set.
54. The method of claim 53, wherein acquiring measured data comprises analyzing images of selected probe marks to obtain one or more of said characteristics.
55. The method of claim 53, wherein acquiring measured data comprises acquiring one or more measurements of selected probe marks, the one or more measurements including length, width, size, angle, orientation, center, depth.
56. The method of claim 53, wherein identification includes one or more analysis including analyzing a die pattern and analyzing a wafer pattern.
57. The method of claim 53, wherein identification includes calculating one or more prober set up errors.
58. The method of claim 57 wherein said prober set up errors include a probe card pitch error, a probe card roll error, an X-axis setup error, a Y-axis setup error, and a probe card yaw error,
59. The method of claim 53 wherein identification includes calculating one or more prober performance error.
60. The method of claim 59 wherein said prober performance errors include a prober stage error, an X-axis alignment error, a Y-axis alignment error, a wafer alignment error, an orthogonality error, a prober scaling error, a variation in probe card pin overtravel, and a deflection error.
61. The method of claim 53 wherein identification includes calculating residual error.
62. The method of claim 53 wherein identification includes calculating variations in probe card yaw.
63. The method of claim 53 wherein identification includes calculating probe card accuracy.
64. The method of claim 53 wherein identification includes calculating probe card repeatability.
65. A computer readable medium encoded with data and instructions for analyzing semiconductor manufacturing component error and interaction; said data and said instructions causing an apparatus executing said instruction to:
generate a merged data set, including the steps of:
acquiring measured data representing one or more wafer probe marks relative to a defined location;
acquiring measured data representing probe card pin overtravel;
merging said measured data representing wafer probe mark and said measured data representing probe card pin overtravel to obtain said merged data set;
optimize said merged data set to minimize errors in said merged data set; and
identify one or more component errors and interactions based upon said merged data set.
66. The computer readable medium of claim 65, wherein acquiring measured data comprises analyzing images of selected probe marks to obtain one or more of said characteristics.
67. The computer readable medium of claim 65, wherein acquiring measured data comprises acquiring one or more measurements of selected probe marks, the one or more measurements including length, width, size, angle, orientation, center, depth.
68. The computer readable medium of claim 65, wherein identification includes one or more analysis including analyzing a die pattern and analyzing a wafer pattern.
69. The computer readable medium of claim 65, wherein identification includes calculating one or more prober set up errors.
70. The computer readable medium of claim 69 wherein said prober set up errors include a probe card pitch error, a probe card roll error, an X-axis setup error, a Y-axis setup error, and a probe card yaw error,
71. The computer readable medium of claim 65 wherein identification includes calculating one or more prober performance error.
72. The computer readable medium of claim 71 wherein said prober performance errors include a prober stage error, an X-axis alignment error, a Y-axis alignment error, a wafer alignment error, an orthogonality error, a prober scaling error, a variation in probe card pin overtravel, and a deflection error.
73. The computer readable medium of claim 65 wherein identification includes calculating residual error.
74. The computer readable medium of claim 65 wherein identification includes calculating variations in probe card yaw.
75. The computer readable medium of claim 65 wherein identification includes calculating probe card accuracy.
76. The computer readable medium of claim 65 wherein identification includes calculating probe card repeatability.
The claims below are in addition to those above.
All refrences to claims which appear below refer to the numbering after this setence.
1. A tool storage unit comprising a back plate which, in use, is attached to a supporting structure in such manner as to be disposed substantially vertically and a top plate which, in use, is disposed substantially horizontally, said top plate having an outer periphery and being so formed as to provide a plurality of spaced tool support formations of a plurality of configurations, some of the spaced tool support formations being in the form of arcuate rebates formed in the outer periphery of the plate and facing away from and towards the back plate.
2. A tool storage unit as claimed in claim 1, in which some of the spaced tool support formations are in the form of pins projecting from edges of the top plate.
3. A tool storage unit as claimed in claim 1, which includes additional support formations located beneath and spaced from the top plate.
4. A tool storage unit as claimed in claim 3, in which the additional support formations are afforded by pins secured to gussets that act between the back plate and the top plate.
5. A tool storage unit as claimed in claim 1, in which the top plate is in the form of a plastic moulding having a substantially flat upwardly presented surface and having a plurality of reinforcing ribs on its downwardly facing surface.
6. A tool storage unit comprising a back plate which, in use, is attached to a supporting structure in such manner as to be disposed substantially vertically and a top plate which, in use, is disposed substantially horizontally, said top plate having a plurality of outer edges and being so formed as to provide a plurality of spaced tool support formations of a plurality of configurations, some of the spaced tool support formations being in the form of arcuate rebates formed in the outer edges of the plate and some of the spaced tool support formations being in the form of circular apertures in the plate, some of the arcuate rebates facing towards the back plate and some of the arcuate rebates facing away form the back plate.