What is claimed is:
1. An image generation method for generating a two-dimensional image by texture mapping to three-dimensional polygons, comprising the steps of:
generating an overall pattern on said polygons by mapping of basic textures, and
executing by amplitude modulation mapping of modulation textures, amplitude modulation processing on patterns generated based on the mapping of said basic textures.
2. The image generation method as described in claim 1, wherein in said amplitude modulation processing, an amplitude is made smaller with increasing distance from the vicinity of a viewpoint.
3. The image generation method as described in claim 1, wherein a repetition period of said basic textures and a repetition period of said modulation textures are offset from each other.
4. The image generation method as described in claim 1, wherein said modulation textures are set to higher spatial frequencies than those of said basic textures, with color information removed from said basic textures.
5. The image generation method as described in claim 1, wherein said modulation textures consist of different patterns from said basic textures.
6. An image generation device for generating a two-dimensional image by texture mapping to dimensional polygons, comprising:
a memory means that stores basic textures to be mapped to generate the overall pattern on a polygon, and modulation textures used to amplitude-modulate the patterns generated by mapping of the basic textures; and
an image processing means that, by amplitude modulation mapping of modulation textures, executes amplitude modulation processing on the patterns generated based on mapping of the basic textures.
7. The image generation device as described in claim 6, wherein in said amplitude modulation processing, the amplitude is made smaller with increasing distance from the vicinity of a viewpoint.
8. The image generation device as described in claim 6, wherein a repetition period of said basic textures and a repetition period of said modulation textures are offset from each other.
9. The image generation device as described in claim 6, wherein said modulation textures are set to higher spatial frequencies than those of said basic textures, with color information removed from said basic textures.
10. The image generation device as described in claim 6, wherein said modulation textures consist of different patterns from said basic textures.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A polishing apparatus comprising:
a polishing table having an abrading tool thereon;
a top ring for holding a workpiece and pressing the workpiece against said abrading tool;
a transfer device for transferring a workpiece to be polished to said top ring; and
a film thickness measuring device located adjacent said transfer device for measuring a film thickness of a polished workpiece,
wherein said transfer device comprises a pusher, with said film thickness measuring device being located above said pusher.
2. The polishing apparatus according to claim 1, further comprising:
a feedback control device configured to adjust a polishing time for a next workpiece to be polished based on a film thickness of a polished workpiece as measured by said film thickness measuring device.
3. The polishing apparatus according to claim 1, further comprising:
a control device configured to rearrange a polishing schedule so as to repolish a polished workpiece based on a film thickness of the polished workpiece as measured by said film thickness measuring device.
4. A polishing apparatus comprising:
a polishing table having an abrading tool thereon;
a top ring for holding a workpiece and pressing the workpiece against said abrading tool;
a transfer device for transferring a workpiece to be polished to said top ring; and
a film thickness measuring device located adjacent said transfer device for measuring a film thickness of a polished workpiece,
wherein said film thickness measuring device includes an optical head for measuring the film thickness of the polished workpiece in a non-contact manner, and a positioning device for moving said optical head.
5. A polishing apparatus comprising:
a cassette for storing workpieces;
a polishing table having an abrading tool thereon;
a top ring for holding a workpiece and pressing the workpiece against said abrading tool;
a transfer mechanism disposed between said cassette and said top ring for transferring a workpiece to be polished to said top ring; and
a film thickness measuring device located adjacent said transfer mechanism for measuring a film thickness of a polished workpiece,
wherein said transfer mechanism comprises an inverter, a robot, and a pusher, with said film thickness measuring device being located above said pusher.
6. The polishing apparatus according to claim 5, further comprising:
a feedback control device configured to adjust a polishing time for a next workpiece to be polished based on a film thickness of a polished workpiece as measured by said film thickness measuring device.
7. The polishing apparatus according to claim 5, further comprising:
a control device configured to rearrange a polishing schedule so as to repolish a polished workpiece based on a film thickness of the polished workpiece as measured by said film thickness measuring device.
8. A polishing apparatus comprising:
a cassette for storing workpieces;
a polishing table having an abrading tool thereon;
a top ring for holding a workpiece and Pressing the workpiece against said abrading tool;
a transfer mechanism disposed between said cassette and said top ring for transferring a workpiece to be polished to said top ring; and
a film thickness measuring device located adjacent said transfer mechanism for measuring a film thickness of a polished workpiece,
wherein said film thickness measuring device includes an optical head for measuring the film thickness of the polished workpiece in a non-contact manner, and a positioning device for moving said optical head.
9. A polishing apparatus comprising:
a cassette for storing workpieces;
a polishing table having an abrading tool thereon;
a top ring for holding a workpiece and pressing the workpiece against said abrading tool;
a transfer mechanism for transferring a workpiece to be polished from said cassette to said top ring; and
a film thickness measuring device located adjacent said transfer mechanism for measuring a film thickness of a polished workpiece,
wherein said transfer mechanism comprises an inverter, a robot, and a pusher, with said film thickness measuring device being located above said pusher.
10. The polishing apparatus according to claim 9, further comprising:
a feedback control device configured to adjust a polishing time for a next workpiece to be polished based on a film thickness of a polished workpiece as measured by said film thickness measuring device.
11. The polishing apparatus according to claim 9, further comprising:
a control device configured to rearrange a polishing schedule so as to repolish a polished workpiece based on a film thickness of the polished workpiece as measured by said film thickness measuring device.
12. A polishing apparatus comprising:
a cassette for storing workpieces;
a polishing table having an abrading tool thereon;
a top ring for holding a workpiece and pressing the workpiece against said abrading tool;
a transfer mechanism for transferring a workpiece to be polished from said cassette to said top ring; and
a film thickness measuring device located adjacent said transfer mechanism for measuring a film thickness of a polished workpiece,
wherein said film thickness measuring device includes an optical head for measuring the film thickness of the polished workpiece in a non-contact manner, and a positioning device for moving said optical head.