1. A stick type cosmetic material feeding container in which a stick type cosmetic material is housed comprising:
a core chuck member having a cosmetic material retaining section for retaining the stick type cosmetic material and a spiral section which is coaxial with the cosmetic material retaining section; and
an elastic cylindrical body whose inner circumferential surface to be spirally engaged with the spiral section is an elastic deformational engagement section, wherein the stick type cosmetic material is fed out through the core chuck member due to relative rotations of the elastic cylindrical body and the core chuck member.
2. A stick type cosmetic material feeding container in which a stick type cosmetic material is housed comprising:
a front cylinder which feeds out the stick type cosmetic material through its tip opening hole;
a container body having means for rotatably connecting the container body to the front cylinder;
a core chuck member having a cosmetic material retaining section for retaining the stick type cosmetic material and a spiral section which is coaxial with the cosmetic material retaining section;
a rotation regulating mechanism for synchronously rotating the front cylinder and the core chuck member;
an elastic cylindrical body having a through hole whose diameter is smaller than an outside diameter of the spiral section of the core chuck member;
engagement means for synchronously rotating the elastic cylindrical body and the container body;
an engagement section which is provided on an inner circumferential surface of the through hole and can be deformed; and
a spiral engagement mechanism which is constituted by spiral engagement of the spiral section with the deformational engagement section.
3. A stick type cosmetic material feeding-container in which a stick type cosmetic material is housed comprising:
a front cylinder which feeds out the stick type cosmetic material through its tip opening hole;
a container body having means for rotatably connecting the container body to the front cylinder;
a core chuck member having a cosmetic material retaining section for retaining the stick type cosmetic material and a spiral section which is coaxial with the cosmetic material retaining section;
a rotation regulating mechanism for synchronously rotating the container body and the core chuck member;
an elastic cylindrical body having a through hole whose diameter is smaller than an outside diameter of the spiral section of the core chuck member;
engagement means for synchronously rotating the elastic cylindrical body and the front cylinder;
a deformational engagement section which is provided on an inner circumferential surface of the through hole; and
a spiral engagement mechanism which is constituted by spiral engagement of the deformational engagement section and the spiral section.
4. A stick type cosmetic material feeding container according to any one of claims 1 through 3, wherein the spiral section of the core chuck member is a multiple-threaded screw.
5. A stick type cosmetic material feeding container according to claim 4, wherein the spiral section of the core chuck member presses the engagement section, thereby forming a spiral engagement surface.
6. A stick type cosmetic material feeding container according to claim 4, wherein the engagement section is made by providing a plurality of projections on an inner circumferential surface of the through hole of the elastic cylindrical body.
7. A stick type cosmetic material feeding container according to claim 4, wherein the engagement section is made by providing a spiral groove on an inner circumferential surface of the through hole of the elastic cylindrical body.
8. A stick type cosmetic material feeding container according to claim 2 or claim 3, wherein when the front cylinder and the container body relatively rotate, the elastic cylindrical body synchronously rotates with either of the front cylinder and the container body, and also the elastic cylindrical body has means for giving resistance to relative rotations of the front cylinder and the container body.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1-5. (Cancelled).
6 A multi-layer printed circuit board comprising: a core substrate having through holes; and an interlayer resin insulating layer built up on said core substrate, wherein
said through holes are constituted by filling a first metal layer formed by electroplating, a metal film formed by electroless plating, sputtering or evaporation and a second metal layer formed by electroplating.
7 A method of manufacturing a multi-layer printed circuit board comprising at least the following steps (A) to (E):
(A) forming non-penetrating openings in a resin insulating layer incorporating a metal layer formed on either side thereof by applying laser beams such that said non-penetrating openings reach said metal layer;
(B) passing an electric current to each non-penetrating opening formed in said resin insulating layer through said metal layer to fill a first metal layer with electroplating;
(C) forming a metal film on the opposite surface of said resin insulating layer on which said metal layer is formed;
(D) passing an electric current to each non-penetrating opening formed in said resin insulating layer through said metal layer to fill a second metal layer with electroplating; and
(E) etching said metal layer and said metal film of said resin insulating layer to form lands of through holes.
8 A method of manufacturing a multi-layer printed circuit board according to claim 7, further comprising a step for forming a metal layer by electroless plating, sputtering or evaporation.
9 A method of manufacturing a multi-layer printed circuit board according to claim 7 or 8, wherein said step for forming said metal film on the opposite surface of said resin insulating layer on which said metal layer is formed is arranged to perform electroless plating, sputtering or evaporation.
10 A printed circuit board comprising: a core substrate; and through holes formed in said core substrate, wherein
said core substrate incorporates a core member and a resin insulating layer formed on each of two sides of said core member and having a roughened surface, and
each of said through holes is constituted by providing a metal film for a penetrating opening formed by a laser beam.
11 A printed circuit board according to claim 10, wherein said core member is constituted by causing said core material to be impregnated with resin.
12 A printed circuit board according to claim 10, wherein said resin insulating layer is formed by dispersing soluble particles in refractory resin.
13 A printed circuit board according to claim 10, wherein said resin insulating layer is considered by soluble resin and refractory resin.
14 A method of manufacturing a printed circuit board comprising at least the following steps (A) to (D):
(A) laminating a resin insulating layer on each of two sides of a core member to form a core substrate;
(B) forming penetrating openings in said core substrate by applying laser beams;
(C) forming a rough surface on said core substrate; and
(D) providing a metal film for each penetrating opening to form through holes.
15 A method of manufacturing a printed circuit board according to claim 14, wherein said core member is constituted by causing said core material to be impregnate with resin.
16 A method of manufacturing a printed circuit board according to claim 14, wherein said resin insulating layer is formed by dispersing soluble particles in refractory resin.
17 A multi-layer printed circuit board comprising: a core substrate having through holes for connecting the upper and lower surface to each other and having a structure that interlayer resin insulating layers and conductor circuits are alternately laminated on said core substrate, wherein
through holes having different diameters are formed in said core substrate.
18 A multi-layer printed circuit board comprising: a core substrate having through holes for connecting the upper and lower surface to each other and having a structure that interlayer resin insulating layers and conductor circuits are alternately laminated on said core substrate, wherein
through holes each having a small diameter are mainly formed in the central portion of said core substrate, and through holes each having a large diameter are mainly formed in the outer periphery.
19 A multi-layer printed circuit board according to claim 18, wherein said through holes each having the small diameter are mainly provided with power supply lines and ground lines, and said through holes each having the large diameter are mainly provided with signal lines.
20 A method of manufacturing a multi-layer printed circuit board comprising at least the following steps (A) and (B);
(A) providing penetrating openings which are formed into through holes and each of which has a small diameter for a core substrate; and
(B) providing penetrating openings which are formed into through holes each having a large diameter for said core substrate.
21 A method of manufacturing a multi-layer printed circuit board comprising at least the following steps (A) and (B):
(A) irradiating the central portion of a core substrate with laser beams or drilling the central portion to form penetrating openings which are formed into through holes and each of which has a small diameter; and
(B) irradiating the central portion of said core substrate with laser beams or drilling the central portion to form penetrating openings which are formed into through holes and each of which has a large diameter.
22 A method of manufacturing a multi-layer printed circuit board according to claim 21, wherein said through holes each having the small diameter are mainly provided with power supply lines and ground lines, and said through holes each having the large diameter are mainly provided with signal lines.
23 A printed circuit board and a method of manufacturing said printed circuit board comprising: a core substrate having the surface on which resin insulating layers and conductor circuits are alternately built up, wherein
said core substrate is constituted by forming openings in a resin plate by applying laser beams and by forming a sputtered layer on said resin plate by sputtering which is performed after said openings have been formed.
24 A printed circuit board and a method of manufacturing said printed circuit board comprising at least the following steps (A) to (F):
(A) forming openings in a resin plate which is formed into a core substrate by applying laser beams;
(B) performing sputtering to form a sputtered layer on said resin plate;
(C) performing electroless plating through said sputtered layer;
(D) forming a resist having a predetermined pattern after said electroless plating has been performed;
(E) performing electroplating to form an electroplated layer in a portion in which said resist is not formed; and
(F) performing etching after said resist has been removed to remove said sputtered layer and said electroless plated layer below said resist so as to form a conductor circuit.
25 A printed circuit board and a method of manufacturing said printed circuit board according to claim 23, wherein when said openings are formed in said resin plate by applying laser beams, and at least one type of laser process is employed which is selected from a carbon dioxide laser process, an excimer laser process, a YAG laser process and an UV laser process.
26 A printed circuit board and a method of manufacturing said printed circuit board according to any one of claims 23 to 25, wherein when said sputtered layer is formed on said resin plate by sputtering, at least one type of materials selected from Cu, Ni, Cr, Pd and Mo, is employed.