1. An imaging device comprising:
an imaging unit that images first and second objects placed in a reaction chamber of a semiconductor manufacturing apparatus; and
an image analysis unit that analyzes deviation of each of the first and second objects from an appropriate arrangement position by measuring a distance between the first object and the second object on the basis of an image captured by the imaging unit;
an image recording unit that records both the image captured by the imaging unit and a lot number of a semiconductor wafer;
a display screen for displaying states of the first and second objects;
a warning notification unit that gives a warning on the display screen when the deviation exceeds a predetermined value; and
a setting screen for setting the predetermined value.
2. The imaging device according to claim 1,
wherein the first object is the semiconductor wafer,
the second object is a recessed wafer mounting section in which the semiconductor wafer is mounted and which is configured to include a circular bottom portion and a side wall portion, and
the deviation is analyzed by measuring a distance between an end of the semiconductor wafer and the side wall portion of the wafer mounting section on the basis of an image captured by the imaging unit.
3. The imaging device according to claim 1,
wherein the first object is a susceptor having a recessed wafer mounting section, in which the semiconductor wafer is mounted and which is configured to include a circular bottom portion and a side wall portion, on an upper surface,
the second object is a preheat ring provided around the susceptor, and
the deviation is analyzed by measuring a distance between the susceptor and the preheat ring on the basis of an image captured by the imaging unit.
4. The imaging device according to claim 3,
wherein the susceptor is movable up and down, and
the imaging unit images the first and second objects when the susceptor is at a position closest to the imaging unit.
5. The imaging device according to claim 1,
wherein the imaging unit images a part of the first object and a part of the second object.
6. The imaging device according to claim 1,
wherein the imaging unit includes a light transmissive member that blocks light having a specific wavelength.
7. The imaging device according to claim 6,
wherein the light transmissive member blocks infrared rays.
8. The imaging device according to claim 6,
wherein the imaging unit includes an imaging element, a housing case in which the imaging element is housed and the light transmissive member is attached, and coolant supply means for supplying a coolant into the housing case, and
the light transmissive member is a quartz glass plate having a gold layer on one or both surfaces.
9. The imaging device according to claim 8,
wherein the housing case has a gold layer on a surface.
10. A semiconductor manufacturing apparatus comprising:
a susceptor having a recessed wafer mounting section, in which a semiconductor wafer is to be mounted and which is configured to include a circular bottom portion and a side wall portion, on an upper surface;
a reaction chamber in which the susceptor is provided;
an imaging unit that is provided above the reaction chamber and images first and second objects placed in the reaction chamber; and
an image analysis unit that analyzes deviation of each of the first and second objects from an appropriate arrangement position by measuring a distance between the first and second object on the basis of an image captured by the imaging unit
an image recording unit that records both the image captured by the imaging unit and a lot number of a semiconductor wafer;
a display screen for displaying states of the first and second objects;
a warning notification unit that gives a warning on the display screen when the deviation exceeds a predetermined value; and
a setting screen for setting the predetermined value.
11. The semiconductor manufacturing apparatus according to claim 10,
wherein the first object is the semiconductor wafer,
the second object is the wafer mounting section, and
the deviation is analyzed by measuring a distance between an end of the semiconductor wafer and a side wall portion of the wafer mounting section on the basis of an image captured by the imaging unit.
12. The semiconductor manufacturing apparatus according to claim 10,
wherein the first object is the susceptor,
the second object is a preheat ring provided around the susceptor, and
the deviation is analyzed by measuring a distance between the susceptor and the preheat ring on the basis of an image captured by the imaging unit.
13. The semiconductor manufacturing apparatus according to claim 10,
wherein the susceptor is movable up and down, and
the imaging unit images the first and second objects when the susceptor is at a position closest to the imaging unit.
14. The semiconductor manufacturing apparatus according to claim 10,
wherein the susceptor has a target that is a focus when the imaging unit images the first and second objects.
15. The semiconductor manufacturing apparatus according to claim 10,
wherein the imaging unit images a part of the first object and a part of the second object.
16. The semiconductor manufacturing apparatus according to claim 10,
wherein the imaging unit includes a light transmissive member that blocks light having a specific wavelength.
17. The semiconductor manufacturing apparatus according to claim 16,
wherein the light transmissive member blocks infrared rays.
18. The semiconductor manufacturing apparatus according to claim 16,
wherein the imaging unit includes an imaging element, a housing case in which the imaging element is housed and the light transmissive member is attached, and coolant supply means for supplying a coolant into the housing case, and
the light transmissive member is a quartz glass plate having a gold layer on one or both surfaces.
19. The semiconductor manufacturing apparatus according to claim 18,
wherein the housing case has a gold layer on a surface.
20. The semiconductor manufacturing apparatus according to claim 10, further comprising:
a heating unit that is provided above the reaction chamber in order to heat the semiconductor wafer.
21. The semiconductor manufacturing apparatus according to claim 20,
wherein the heating unit is a heat source that emits infrared rays.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1-2. (canceled)
3. An adjustable device operable for wrapping around the handle of a piece of luggage comprising:
a. a flexible, rectangular, laminated sheet, wherein said flexible sheet is comprised of a compressible closed-cell foam elastomer having a textured, non-slip surface and a smooth opposing surface, said smooth opposing surface being laminated to a sheet of substantially non-extending reinforcing fabric,
b. wherein said flexible sheet is operable for being rolled into a cylindrical configuration to envelope said handle, said cylindrical configuration having a length, a radius, a radial edge and an axial edge,
c. at least one hook and loop closure strip having a long dimension and a short dimension, said long dimension being parallel to said radial edge enabling said radius to be adjustable upon being rolled into said cylindrical configuration, and enabling said hook and loop closure strip to be easily interspersed with the fingers when said fingers grasp said handle.