What is claimed is:
1. An apparatus, comprising:
a body having a central axis portion and a plurality of protrusions extending away from the central axis portion towards respective ends, each of the ends of the plurality of protrusions having a mounting point to mount a printed circuit board to a mounting structure.
2. The apparatus of claim 1, wherein the plurality of protrusions operate to distribute a load around a periphery of the printed circuit board.
3. The apparatus of claim 2, wherein the body has four protrusions extending away from the central axis.
4. The apparatus of claim 3, wherein the central axis portion has a first and second ends, each of the first and second ends having the mounting point.
5. The apparatus of claim 2, wherein the plurality of protrusions are integrally formed with the central axis portion in a unitary body.
6. The apparatus of claim 2, wherein the plurality of protrusions are detachably coupled to the central axis portion.
7. The apparatus of claim 2, wherein a first pair of the plurality of protrusions extend away from approximately the middle of the central axis portion.
8. The apparatus of claim 7, wherein a second pair of the plurality of protrusions extend away from approximately an end of the central axis portion.
9. The apparatus of claim 2, wherein the mounting structure is a chassis support.
10. The apparatus of claim 2, wherein the central axis portion is constructed of aluminum.
11. The apparatus of claim 1, further comprising a plurality of fasteners to mount the ends of the plurality of protrusions to the printed circuit board at each of the mounting points.
12. The apparatus of claim 11, wherein the plurality of fasteners comprise a plunger to receive an application of force and a grommet to secure the stiffener and the printed circuit board at the mounting points.
13. The apparatus of claim 11, wherein the grommet comprises a mid section to engage the stiffener and the printed circuit board, and a deformable end to engage the mounting structure.
14. The apparatus of claim 1, wherein the plurality of protrusions comprises four protrusions.
15. The apparatus of claim 1, wherein the body has a back side that includes ribbing to distribute force towards the plurality of protrusions.
16. An apparatus, comprising:
a chassis support;
a printed circuit board coupled to the chassis support, the printed circuit board having trace routings disposed in approximately a central area of the printed circuit board; and
a board stiffener coupled to the printed circuit board and the chassis support, the board stiffener comprising
a body having a central axis portion and a plurality of protrusions extending away from the central axis portion towards respective ends, each of the ends of the plurality of protrusions having a mounting point to mount a printed circuit board to the chassis support.
17. The apparatus of claim 16, wherein the plurality of protrusions are coupled to the printed circuit board outside of the central area.
18. The apparatus of claim 17, wherein the plurality of protrusions operate to distribute a load around a periphery of the printed circuit board.
19. The apparatus of claim 17, wherein the plurality of protrusions are integrally formed with the central axis portion to form a unitary body.
20. The apparatus of claim 17, wherein a first pair of the plurality of protrusions extend away from approximately the middle of the central axis portion.
21. The apparatus of claim 17, wherein a second pair of the plurality of protrusions extend away from approximately an end of the central axis portion.
22. A method, comprising:
distributing a plurality of mounting points around a periphery of a printed circuit board to redistribute a load on the printed circuit board outside of trace routing areas of the printed circuit board; and
securing the printed circuit board between a chassis support and a stiffener using the plurality of mounting points.
23. The method of claim 22, wherein securing comprises coupling the stiffener to the printed circuit board prior to coupling the printed circuit board to the chassis support.
24. The method of claim 21, wherein securing comprises:
inserting a plurality of fasteners through the stiffener;
inserting the plurality of fasteners through the mounting points; and
inserting the plurality of fasteners into the chassis support.
25. The method of claim 21, wherein the printed circuit board is secured between the chassis support and the stiffener using six mounting points.
26. The method of claim 21, further comprising attaching a single piece mounting mechanism to each of the plurality of mounting points.
27. An apparatus, comprising:
means for securing a printed circuit board between a chassis support and a stiffener using a plurality of mounting points; and
means for distributing the plurality of mounting points around a periphery of the printed circuit board to redistribute a load on the printed circuit board outside of trace routing areas of the printed circuit board.
28. The apparatus of claim 27, wherein the means for securing comprises a single piece mounting mechanism.
29. The apparatus of claim 27, wherein the means for securing comprises a multiple piece mounting mechanism.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A polishing composition for a glass substrate having a pH of from 0.5 to 5, comprising a silica of which primary particles have an average particle size of from 5 to 50 nm and an acrylic acidsulfonic acid copolymer having a weight-average molecular weight of from 1,000 to 5,000.
2. The polishing composition according to claim 1, wherein a sulfonic acid group-containing monomer is contained in a ratio of from 3 to 90% by mole of all the monomers constituting the acrylic acidsulfonic acid copolymer.
3. The polishing composition according to claim 1, wherein the silica and the copolymer are contained in the polishing composition in a concentration ratio (concentration of the silica (% by weight)concentration of the copolymer (% by weight)) of from 10 to 5,000.
4. The polishing composition according to claim 2, wherein the silica and the copolymer are contained in the polishing composition in a concentration ratio (concentration of the silica (% by weight)concentration of the copolymer (% by weight)) of from 10 to 5,000.
5. The polishing composition according to claim 1, wherein the silica is a colloidal silica.
6. The polishing composition according to claim 2, wherein the silica is a colloidal silica.
7. The polishing composition according to claim 3, wherein the silica is a colloidal silica.
8. The polishing composition according to claim 4, wherein the silica is a colloidal silica.
9. A method for manufacturing a glass substrate, comprising the step of polishing a substrate to be polished with a polishing load of from 3 to 12 kPa while allowing the polishing composition as defined in claim 1 to be present between a polishing pad and the substrate to be polished.
10. A method for manufacturing a glass substrate, comprising the step of polishing a substrate to be polished with a polishing load of from 3 to 12 kPa while allowing the polishing composition as defined in claim 2 to be present between a polishing pad and the substrate to be polished.
11. A method for manufacturing a glass substrate, comprising the step of polishing a substrate to be polished with a polishing load of from 3 to 12 kPa while allowing the polishing composition as defined in claim 3 to be present between a polishing pad and the substrate to be polished.
12. A method for manufacturing a glass substrate, comprising the step of polishing a substrate to be polished with a polishing load of from 3 to 12 kPa while allowing the polishing composition as defined in claim 4 to be present between a polishing pad and the substrate to be polished.
13. The method according to claim 9, wherein the glass substrate is a glass hard disk substrate.
14. The method according to claim 10, wherein the glass substrate is a glass hard disk substrate.
15. The method according to claim 11, wherein the glass substrate is a glass hard disk substrate.
16. The method according to claim 12, wherein the glass substrate is a glass hard disk substrate.
17. The method according to claim 9, wherein the glass substrate is a photomask substrate.
18. The method according to claim 10, wherein the glass substrate is a photomask substrate.
19. The method according to claim 11, wherein the glass substrate is a photomask substrate.
20. The method according to claim 12, wherein the glass substrate is a photomask substrate.
21. The method according to claim 9, wherein the glass substrate is a quartz wafer substrate.
22. The method according to claim 10, wherein the glass substrate is a quartz wafer substrate.
23. The method according to claim 11, wherein the glass substrate is a quartz wafer substrate.
24. The method according to claim 12, wherein the glass substrate is a quartz wafer substrate.