What is claimed is:
1. A pulse generator comprising:
means for receiving an input signal;
a first node;
a second node;
a voltage level control means for controlling a voltage level of the first node according to a state of the input signal;
a first switching means for controlling a voltage level of the second node by performing a switching operation according to the state of the input signal;
a second switching means for changing a voltage level of the second node by performing another switching operation, opposite to the first switching means according to the state of the input signal;
a chargedischarge means for chargingdischarging a voltage between the first and the second nodes according to a switching state of the first and the second switching means; and
an output means for outputting a pulse signal according to the chargingdischarging state of the chargedischarge means.
2. The pulse generator according to claim 1, wherein the voltage level control means comprises:
a first pull-up unit for receiving the input signal through its gate terminal and the power voltage through its source terminal; and
a second pull-up unit of receiving the power voltage through its source terminal, wherein the drain terminal thereof is commonly connected to that of the first pull-up unit and the gate terminal thereof is connected to the common drain terminal and is further connected to the first node.
3. The pulse generator according to claim 1, wherein the voltage level control means comprises:
a first pull-up unit for receiving the input signal through its gate terminal, wherein the source terminal thereof is connected to an end of the chargedischarge means; and
a second pull-up unit of receiving the power voltage through its source terminal, wherein the drain terminal thereof is commonly connected to that of the first pull-up unit and, the gate terminal thereof is connected to the common drain terminal and is further connected to the first node.
4. The pulse generator according to claim 1, wherein the first switching means comprises:
a pull-up unit for receiving the input signal through its gate terminal wherein the source terminal thereof is connected to the power voltage terminal and the drain terminal thereof is connected to an end of the chargedischarge means through the second node.
5. The pulse generator according to claim 4, wherein the second switching means comprises:
a pull-down unit, which is connected between an end of the chargedischarge means and the ground voltage terminal, for receiving the input signal through its gate terminal.
6. The pulse generator according to claim 4, wherein the second switching means comprises:
an inverter for inverting the input signal; and
a pull-up unit, which is connected between the chargedischarge means and the ground voltage terminal, for receiving the input signal inverted from the inverter through its gate terminal.
7. The pulse generator according to claim 1, wherein the first switching means comprises:
a pull-down unit of receiving the input signal through its gate terminal, wherein the drain terminal thereof is connected to the power voltage terminal and the source terminal thereof is connected to an end of the chargedischarge means through the second node.
8. The pulse generator according to claim 7, wherein the second switching means comprises:
a pull-up unit, which is connected between the chargedischarge means and the ground voltage terminal, for receiving the input signal through its gate terminal.
9. The pulse generator according to claim 1, wherein the first switching means comprises:
an inverter for inverting the input signal ; and
a pull-down unit of receiving the input signal inverted from the inverter through its gate terminal, wherein the drain terminal thereof is connected to the ground voltage terminal and the source terminal thereof is connected to an end of the chargedischarge means through the second node.
10. The pulse generator according to claim 9, wherein the second switching means comprises:
a pull-down unit, which is connected between the chargedischarge means and the ground voltage terminal, for receiving the input signal through its gate terminal.
11. The pulse generator according to claim 1, wherein the first switching means comprises:
an inverter for inverting the input signal ; and
a pull-up unit of receiving the input signal inverted from the inverter through its gate terminal, wherein the source terminal thereof is connected to the power voltage terminal and the drain terminal thereof is connected to an end of the chargedischarge means through the second node.
12. The pulse generator according to claim 11, wherein the second switching means comprises:
a pull-up unit, which is connected between the chargedischarge means and the ground voltage terminal, for receiving the input signal through its gate terminal.
13. The pulse generator according to claim 1, wherein the chargedischarge means is a capacitor.
14. The pulse generator according to claim 1, wherein the output means is an inverter for inverting the voltage of the first node.
15. The pulse generator according to claim 1, wherein the voltage level control means comprises:
a first pull-down unit for receiving the input signal through its gate terminal, wherein the source terminal thereof is connected to the ground voltage terminal; and
a second pull-down unit, the drain terminal of which is commonly connected to that of the first pull-down unit, the gate terminal of which is connected to the common drain terminal and is further connected to the first node, and the source terminal of which is connected to the ground voltage terminal.
16. The pulse generator according to claim 1, wherein the voltage level control means comprises:
a first pull-down unit of receiving the input signal through its gate terminal, wherein the source terminal thereof is connected to an end of the chargedischarge means; and
a second pull-down unit, the drain terminal of which is commonly connected to that of the first pull-down unit, the gate terminal of which is connected to the common drain terminal and is further connected to the first node, and the source terminal of which is connected to the ground voltage terminal.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electronic device comprising:
a circuit board that has at least one electronic component, which is mounted to a first principal surface that is one of two principal surfaces of the circuit board;
a heat sink that has an opposing surface, which is opposed to the first principal surface of the circuit board, wherein the heat sink is placed to have a gap interposed between the opposing surface and the at least one electronic component; and
a heat conductive material that is filled between the circuit board and the heat sink to cover the at least one electronic component, wherein the heat conductive material guides heat generated from the at least one electronic component to the heat sink, wherein:
one of the circuit board and the heat sink has a heat conductive material check portion;
at least a portion of the heat conductive material check portion is formed in a bonding range, to which the heat conductive material is bonded; and
the heat conductive material check portion enables visual recognition of the heat conductive material through the heat conductive material check portion when the circuit board is viewed from one of:
a side of the circuit board where a second principal surface, which is another one of the two principal surfaces of the circuit board, is placed; and
a side of the heat sink where a back surface of the heat sink, which is opposite from the opposing surface, is placed.
2. The electronic device according to claim 1, wherein the heat conductive material check portion is one of a plurality of heat conductive material check portions, which are arranged to surround the at least one electronic component.
3. The electronic device according to claim 1, wherein the heat conductive material check portion is a through-hole that is formed in the one of the circuit board and the heat sink.
4. The electronic device according to claim 3, wherein:
the heat conductive material extends through the through-hole and protrudes from the through-hole at the one of:
the side of the circuit board where the second principal surface is placed; and
the side of the heat sink where the back surface of the heat sink is placed.
5. The electronic device according to claim 3, wherein the through-hole is one a plurality of through-holes that are arranged one after another along an outward direction, which is directed from a center of the bonding range toward an outside of the bonding range.
6. The electronic device according to claim 5, wherein the one of the circuit board and the heat sink includes at least another one through-hole that is formed at the outside of the bonding range and is arranged after the plurality of through-holes along the outward direction, which is directed from the center of the bonding range toward the outside of the bonding range.
7. The electronic device according to claim 6, wherein the plurality of through-holes and the at least another one through-hole are arranged one after another in increasing order of diameter from a center side, at which the center of the bonding range is located, toward an outer side, at which the outside of the bonding range is located.
8. The electronic device according to claim 3, wherein the through-hole is in a form of a slit and extends in an outward direction, which is directed from the center of the bonding range toward the outside of the bonding range.
9. The electronic device according to claim 3, wherein the through-hole is a screw hole, into which a screw is inserted to fix the circuit board and the heat sink together.
10. The electronic device according to claim 1, wherein the heat conductive material check portion is a transparent portion that transmits light at the circuit board.
11. The electronic device according to claim 1, wherein:
the heat sink includes:
a recess that is formed at a corresponding location of the heat sink, which is opposed to the at least one electronic component; and
a groove that extends from the recess; and
the heat conductive material check portion is placed at a location, which corresponds to the groove.
12. A drive apparatus for driving a load to rotate the load, the drive apparatus comprising:
the electronic device of claim 1; and
a dynamo-electric machine, energization of which is controlled by the electronic device.
13. A manufacturing method for an electronic device that includes:
a circuit board that has at least one electronic component, which is mounted to a first principal surface that is one of two principal surfaces of the circuit board;
a heat sink that has an opposing surface, which is opposed to the first principal surface of the circuit board, wherein the heat sink is placed to have a gap interposed between the opposing surface and the at least one electronic component; and
a heat conductive material that is filled between the circuit board and the heat sink to cover the at least one electronic component, wherein the heat conductive material guides heat generated from the at least one electronic component to the heat sink, wherein:
one of the circuit board and the heat sink has a heat conductive material check portion;
at least a portion of the heat conductive material check portion is formed in a bonding range, to which the heat conductive material is bonded; and
the heat conductive material check portion enables a visual recognition of the heat conductive material through the heat conductive material check portion when the circuit board is viewed from one of:
a side of the circuit board where a second principal surface, which is another one of the two principal surfaces of the circuit board, is placed; and
a side of the heat sink where a back surface of the heat sink, which is opposite from the opposing surface, is placed, the manufacturing method comprising:
an application step of applying the heat conductive material to one of the at least one electronic component, which is mounted to the circuit board, and the opposing surface of the heat sink in such a manner that a thickness of the heat conductive material, which is applied to the one of the at least one electronic component and the opposing surface of the heat sink, is larger than a size of the gap;
a circuit board placing step of placing the circuit board relative to the heat sink such that the heat conductive material is compressed and is spread between the at least one electronic component and the opposing surface of the heat sink; and
an inspection step of inspecting whether the heat conductive material is visible through the heat conductive material check portion when the circuit board is viewed after the circuit board placing step from the one of:
the side of the circuit board where the second principal surface is placed; and
the side of the heat sink where the back surface of the heat sink is placed.