1. A method for manufacturing a light-emitting device, comprising the steps of:
disposing a first substrate and a second substrate so that one surface of the first substrate faces a deposition surface of the second substrate, wherein the first substrate includes a reflective layer including an opening, a light absorption layer covering the opening in the reflective layer over the reflective layer, a protective layer including a trench portion in a position overlapped with the opening in the reflective layer over the light absorption layer, and a material layer including a light-emitting material over the protective layer; and
forming an EL layer including the light-emitting material in a region overlapped with the opening in the reflective layer on the deposition surface of the second substrate by performing light irradiation from the other surface side of the first substrate,
wherein the protective layer has a lower heat conductivity than the reflective layer and the light absorption layer,
wherein the protective layer has a first region which is overlapped with the reflective layer and a second region which is not overlapped with the reflective layer, and
wherein the first region is thicker than the second region.
2. The method for manufacturing a light-emitting device according to claim 1, wherein the protective layer includes a trench formed in a position overlapped with the reflective layer.
3. The method for manufacturing a light-emitting device according to claim 1, wherein the deposition surface of the second substrate is provided with a first electrode.
4. A method for manufacturing a light-emitting device, comprising the steps of:
disposing a first substrate and a second substrate so that one surface of the first substrate faces a deposition surface of the second substrate, wherein the first substrate includes a reflective layer including an opening, a light absorption layer covering the opening in the reflective layer over the reflective layer, a first protective layer including an opening in a position overlapped with the opening in the reflective layer over the light absorption layer, a second protective layer covering the opening in the first protective layer over the first protective layer, and a material layer including a light-emitting material over the second protective layer; and
forming an EL layer including the light-emitting material in a region overlapped with the opening in the reflective layer on the deposition surface of the second substrate by performing light irradiation from the other surface side of the first substrate,
wherein the first and second protective layers have a lower heat conductivity than the reflective layer and the light absorption layer,
wherein each of the first and second protective layers has a first region which is overlapped with the reflective layer and the second protective layer has a second region which is not overlapped with the reflective layer, and
wherein the first region of the first protective layer is thicker than the second region of the second protective layer.
5. The method for manufacturing a light-emitting device according to claim 4, wherein the first protective layer includes a trench formed in a position overlapped with the reflective layer.
6. The method for manufacturing a light-emitting device according to claim 4, wherein the deposition surface of the second substrate is provided with a first electrode.
7. A method for manufacturing a light-emitting device, comprising the steps of:
disposing a first substrate and a second substrate so that one surface of the first substrate faces a deposition surface of the second substrate, wherein the first substrate includes a reflective layer including an opening, a heat insulating layer including an opening in a position overlapped with the opening in the reflective layer over the reflective layer, a light absorption layer covering the opening in the reflective layer and the opening in the heat insulating layer over the heat insulating layer, a protective layer over the light absorption layer, and a material layer including a light-emitting material over the protective layer; and
forming an EL layer including the light-emitting material in a region overlapped with the opening in the reflective layer and the opening in the heat insulating layer on the deposition surface of the second substrate by performing light irradiation from the other surface side of the first substrate,
wherein the protective layer has a lower heat conductivity than the reflective layer and the light absorption layer,
wherein the protective layer has a first region which is overlapped with the reflective layer and a second region which is not overlapped with the reflective layer, and
wherein the first region is thicker than the second region.
8. The method for manufacturing a light-emitting device according to claim 7, wherein the heat insulating layer includes a trench formed in a position overlapped with the reflective layer.
9. The method for manufacturing a light-emitting device according to claim 7, wherein the deposition surface of the second substrate is provided with a first electrode.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A system for assembling a shielded space, comprising:
a plurality of rigid multi-layered wall panels with a top edge, a bottom edge, a right edge and a left edge, each panel comprising a low frequency magnetic shielding layer, and an ionizing radiation shield layer;
wherein the right edge and left edge of adjacent panels are adapted to connect to each other.
2. The system of claim 1, further comprising:
a non-ionizing radiation shielding layer comprised of non-woven metallized fibers; and
an anti-microbial layer.
3. The system of claim 1, wherein said ionizing radiation shielding layer is comprised of lead or lead amalgam.
4. The system of claim 1, wherein said ionizing radiation shielding layer is comprised of polyethylene.
5. The system of claim 1, one or more of said panels further comprising an acoustical shielding layer.
6. The system of claim 1, wherein the multi-layer panels are adapted to be attached to the wall of a room.
7. The system of claim 1, wherein at least one of said panels is attached to the headboard of a bed.
8. The system of claim 1, wherein at least one of said panels is free-standing.
9. The system of claim 1, wherein said panels are 8 feet in height.
10. The system of claim 1, wherein the panel layers are bonded by an adhesive.
11. The system of claim 5, wherein said acoustical shielding layer is comprised of a layer of mass loaded dampening material and a layer of acoustic foam, said acoustic foam layers being joined to said mass loaded dampening material by an adhesive layer therebetween.
12. The system of claim 1, one or more of said panels further comprising a bulletproof layer.