1. A method fabricating integrated circuits providing a desired operation using a plurality of masks, wherein each of said plurality of masks is used to control a corresponding one of a plurality of layers to form said integrated circuits, said method comprising:
incorporating a plurality of dummy stacks along with a functional block, said functional block providing said desired operation, each of said dummy stack providing a point of common connectivity on a plurality of metal layers comprised in said plurality of layers.
2. The method of claim 1, wherein said plurality of metal layers comprise all metal layers providing connectivity to elements contained in said functional block.
3. The method of claim 1, wherein each of said dummy stacks contain vias to provide said point of common connectivity.
4. The method of claim 1, further comprising fabricating said integrated circuits using masks designed according to said incorporating.
5. The method of claim 1, further comprising:
identify the connections required to be added and removed to implement a desired design change; and
redesign some of said plurality of masks to addremove identified connections using a dummy stack, wherein said dummy stack is connected to said functional block.
6. The method of claim 5, further comprising fabricating said integrated circuits using masks designed according to said redesign.
7. The method of claim 1, further comprising:
map to a common plane the area portions occupied by each of said plurality of metal layers in providing connectivity for elements forming said functional portion; and
identify unoccupied areas on said common plane,
wherein said incorporating incorporates said plurality of dummy stacks in said unoccupied areas.
12. A computer readable medium carrying one or more sequences of instructions for causing a system to implement computer aided design of an integrated circuit, wherein each of said integrated circuits comprise a plurality of metal layers used to implement a functional portion of said integrated circuit, wherein execution of said one or more sequences of instructions by one or more processors contained in said system causes said one or more processors to perform the actions of:
map to a common plane the area portions occupied by each of said plurality of metal layers in providing connectivity for elements forming said functional portion of said integrated circuit; and
identify unoccupied areas on said common plane,
wherein a plurality of dummy stacks are incorporate in said unoccupied areas.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An image sensor with a spectrum sensor, comprising:
an image sensor region having a plurality of light-detection parts;
a spectrum sensor region located in the image sensor region; and
image signal processor analyzing, processing the image which is obtained by said image sensor region and the spectrum signal which is obtained by said spectrum sensor region,
wherein said spectrum sensor region comprises:
a first spectrum sensor region for obtaining a reference signal; and
a second spectrum sensor region for obtaining a spectrum signal of the object.
2-3. (canceled)
4. The image sensor with the spectrum sensor according to claim 3 claim 1, wherein the image signal processor comprises:
an image reception part receiving the image obtained in the image sensor region;
a reference signal reception part receiving a reference signal for checking a current lighting condition from the first spectrum sensor region;
a object spectrum signal reception part receiving from the second spectrum sensor region a spectrum signal of the object that passed the band pass filter; and
a computation part computing a reflection or transmission rate of the object with respect to each band of the band pass filter by comparing the spectrum signal of the object with the reference signal.
5. The image sensor with the spectrum sensor according to claim 1, wherein each of the light-detection part comprises:
a light-detection part for the image sensor region; and
a light-detection part for the spectrum sensor region.
6. The image sensor with the spectrum sensor according to claim 5,
wherein the image sensor region further comprises a color filter provided on each of the light-detection parts for the image sensor region.
7. The image sensor with the spectrum sensor according to claim 5,
wherein the spectrum sensor region further comprises a band pass filter provided on each of the light-detection parts for the spectrum sensor region.
8. The image sensor with the spectrum sensor according to claim 7, wherein a band width of light wavelength transmitting the band pass filter is 20 mn or less.
9. The image sensor with the spectrum sensor according to claim 8, wherein band widths of the plurality of the band pass filter overlap with each other.
10. The image sensor with the spectrum sensor according to claim 1, wherein the light-detection part is at least one selected from a group including a photodiode, a photo transistor and a photo conductor.