1. A jamb and frame combination for window or door casings, comprising an elongated jamb member formed to fit snugly against the interior surface of a window or door casing, and having a tongue portion on each opposite side extending the length thereof; a first frame member formed to fit snugly against a respective inner or outer surface of said window or door casing, wherein said first frame member includes a groove portion extending the length thereof on one distal end that is snugly receives and mates with a respective tongue portion of said jamb member, and includes a tongue portion extending the lengths thereof on an opposite distal end that snugly receives and mates with a respective grooves of a trim member, and at least one removable fastener passing through said respective frame member in an area adjacent to each said tongue portion and passing into said window or door casing to thereby hold said first frame member snugly thereto; an elongated first trim member including a groove portion extending the length thereof and interlocking with said tongue portion of said first frame member, such that when said first frame members is installed upon a window or door casing, said first trim member groove portion is pushed upon said first frame member tongue portion and frictionally held in place and covering said at least one removable fastener; a second frame member formed to fit snugly against an opposite inner or outer surface of said window or door casing, wherein said second frame member includes a groove portion extending the length thereof on one distal end that snugly receives and mates with the opposite respective tongue portion of said jamb member, and includes a second groove portion extending the length thereof on an outside surface, and at least one removable fastener passing through said second frame member at a point that is within said second groove portion and passing into said window or door casing to thereby hold said second frame member snugly thereto; and an elongated second trim member snugly fitting within and covering said second groove portion and said at least one removable fastener; wherein said first frame member, said second frame member, and said jamb member together form a shape having a cross-section that includes an interior portion that flares in a direction along the widths of said first and second frame members, such that said first and second frame members can connect with a portion of said window or door casing without contacting the distal edge portions of said window or door casing.
2. The combination of claim 1, wherein each of said at least one removable fasteners for each respective frame member includes a series of removable fasteners extending the length of each said respective frame member.
3. The combination of claim 1, wherein said first frame member and said first trim member have interdigitating shapes, such that said first trim member fits snugly around the tongue portion and a front surface of said first frame member, thereby covering said at least one removable fastener.
4. The combination of claim 1, wherein said second trim member includes two deformable arms extending the length thereof, and are adapted to be pushed into and deformed within said second groove portion to thereby create a strong friction hold between said second trim member and said second groove portion.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor-processing apparatus comprising:
a wafer handling chamber;
at least one wafer processing chamber, each connected to the wafer handling chamber;
a wafer handling device disposed in the wafer handling chamber for loading a wafer in the wafer processing chamber, said wafer handling device comprising an end effector for placing a wafer thereon, said end effector being movable from a ready-to-load position to the wafer processing chamber in an x-axis direction which is a wafer loading direction and in a y-axis which is perpendicular to the x-axis direction on a wafer loading plane;
at least one first photosensor disposed in the wafer handling chamber in front of the wafer processing chamber at a position where the wafer placed on the end effector partially blocks light received by the first photosensor at the ready-to-load position and entirely blocks light received by the first photosensor when the wafer moves from the ready-to-load position toward the wafer processing chamber in the x-axis direction; and
at least one second photosensor disposed in the wafer handling chamber in front of the wafer processing chamber at a position where the wafer placed on the end effector does not block light received by the second photosensor at the ready-to-load position and partially blocks but never entirely blocks light received by the second photosensor when the wafer moves from the ready-to-load position toward the wafer processing chamber in the x-axis direction,
wherein the first photosensor is adapted to output a first analogue signal indicative of quantity of light sensed by the first photosensor at the ready-to-load position, and the second photosensor is adapted to output a second analogue signal indicative of lowest quantity of light sensed by the second photosensor when the wafer moves from the ready-to-load position toward the wafer processing chamber,
wherein the first and second photosensors are disposed at positions such that an amount of a wafer deviation, a, in the x-axis direction is determinable by the equation
a=a\u2032+(R\u2212\u221a{square root over ((R2\u2212b2))})
wherein a\u2032 is an amount of a wafer deviation detected by the first photosensor, b is an amount of a wafer deviation detected by the second photosensor, and R is a radius of the wafer.
2. The semiconductor-processing apparatus according to claim 1, further comprising a control unit which stores a standard first signal and a standard second signal which are indicative of no deviation of the wafer placed on the end effector either in the x-axis direction or the y-axis direction, wherein the control unit receives the first and second signals from the first and second photosensors, and compares the first and second signals with the standard first and second signals to determine a deviation of the wafer on the end effector in the x-axis direction and a deviation of the wafer on the end effector in the y-axis direction.
3. The semiconductor-processing apparatus according to claim 2, wherein the control unit controls the wafer handling device based on the determined deviations of the wafer to move the end effector by compensating for the deviations to the wafer processing chamber.
4. The semiconductor-processing apparatus according to claim 1, wherein the first photosensor is disposed in alignment with an x-axis drawn from an axis of the wafer handing device to a center of the wafer processing chamber as viewed above the end effector, and the second photosensor is disposed next to the first photosensor along a track of an outer periphery edge of the wafer when the wafer handling device turns.
5. The semiconductor-processing apparatus according to claim 4, wherein the first and second photosensors are disposed in the vicinity of the wafer processing chamber.
6. The semiconductor-processing apparatus according to claim 1, wherein the first photosensor has a shape elongated in the x-axis direction.
7. The semiconductor-processing apparatus according to claim 1, wherein the second photosensor has a shape elongated in the y-axis direction.
8. The semiconductor-processing apparatus according to claim 1, wherein the first photosensor functions also as a sensor for detecting an obstacle in front of the wafer processing chamber.
9. The semiconductor-processing apparatus according to claim 1, wherein the wafer handling device is adapted to rotate the end effector around an axis of the wafer handling device to position the end effector at the ready-to-load position.
10. The semiconductor-processing apparatus according to claim 1, wherein the at least one wafer processing chamber is comprised of two or more wafer processing chambers disposed around the wafer handling chamber.
11. The semiconductor-processing apparatus according to claim 10, wherein the wafer handling device comprises double arms, each having an end effector.
12. The semiconductor-processing apparatus according to claim 1, wherein the wafer handling device further comprises a wafer clumper for clumping the wafer.
13. The semiconductor-processing apparatus according to claim 1, wherein each of the first and second photosensors is comprised of a light emitter disposed under the end effector in an axial direction of the wafer handling device, and a light sensor disposed above the end effector in the axial direction.
14. The semiconductor-processing apparatus according to claim 13, wherein the light sensor is constituted by a CCD element.
15. The semiconductor-processing apparatus according to claim 1, wherein the first and second photosensors are the only photosensors used for detecting the deviations in the x-axis and y-axis directions for each wafer processing chamber.
16. The semiconductor-processing apparatus according to claim 1, wherein the second photosensor is connected to a peak hold circuit designed for temporarily holding the second signal which is a signal of lowest quantity of light outputted from the second photosensor.