1. An electronic device comprising a leadframe attached to a die and embedded in a mold packaging, said leadframe with wires bonded to said die for electrical interconnection therebetween, said leadframe further comprises
a) at least one predetermined bonding surface with said wires bonded thereon;
b) at least one predetermined soldering surface exposed to the exterior of said mold packaging and adapted for soldering connection with an external circuit;
c) at least one predetermined mold adhesion surface whereon said mold is attached thereto; and
d) at least one predetermined die attachment surface whereon said die is attached thereto; wherein said soldering surface and said bonding surface are non-roughened and nickel palladium gold is deposited onto the surface of said leadframe at said soldering surface and said bonding surface; and said mold adhesion surface and said die attachment surface are free of metal plating and roughened to increase the surface area for attachment to said mold and said die respectively such that adhesion is enhanced.
2. The device according to claim 1 wherein a roughening agent is used for roughening said leadframe material; and said roughening agent is non-reactive with said nickel palladium gold.
3. The device according to claim 1 wherein said leadframe further comprises at least one predetermined exposed surface provided outside said mold packaging for connecting said leadframe to an external circuit, wherein said exposed surface is plated with nickel palladium gold.
4. The device according to claim 1 wherein side edges of said leadframe are roughened to increase the surface area for attachment to said mold such that adhesion is enhanced.
5. A leadframe for electrical connection in a die packaging comprising
a) at least one predetermined bonding surface for wire bonding thereon;
b) at least one predetermined soldering surface adapted for exposure to the exterior of said packaging for solder connection with an external circuit;
c) at least one predetermined mold adhesion surface for adhesion of packaging mold thereto; and
d) at least one predetermined die attachment surface for attachment of said die thereto; wherein said soldering surface and said bonding surface are non-roughened and nickel palladium gold is deposited onto the surface of said leadframe material at said soldering surface and said bonding surface; said mold adhesion surface and said die attachment surface are free of metal plating and roughened to increase the surface area for attachment to said mold and said die respectively such that adhesion is enhanced.
6. The leadframe according to claim 5 wherein a roughening agent is used for roughening said leadframe material; and said roughening agent is non-reactive with said nickel palladium gold.
7. The leadframe according to claim 5 wherein said leadframe further comprises at least one predetermined exposed surface provided outside said mold packaging for connecting said leadframe to an external circuit, wherein said exposed surface is plated with nickel palladium gold.
8. The leadframe according to claim 5 wherein side edges of said leadframe are roughened to increase the surface area for attachment to said mold such that adhesion is enhanced.
9. In an electronic device according to claim 1, a method of treating said leadframe for enhanced attachability to said mold package and said die comprising
a) selectively protecting the molding and die attachment surfaces from plating;
b) selectively plating the wire bonding surface of said leadframe with nickel palladium gold; and
c) selectively roughening said contact surfaces of said leadframe with said die and said mold packaging.
10. The method according to claim 9 further comprising the step of selectively plating said soldering surface with nickel palladium gold.
11. The method according to claim 9 wherein said selective plating step comprises the steps of coating said leadframe with a protective material; selectively removing said protecting material from preselected surfaces of said leadframe on which said nickel palladium gold plating is desired; and plating said nickel palladium gold layer onto said preselected surfaces.
12. An electronic device according to claim 1 characterized in that said leadframe adheres to said mold packaging with sufficient strength to remain laminated for at least one year at a minimum temperature of 30\xb0 C. and a minimum relative humidity of 60%.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A bearing-positioning tool set comprising:
a grip (1) having a hammering end opposite an inner end which is fixed with a combining rod (10) extending outward, said combining rod bored with a combining threaded hole (11);
one positioning press block (2), said positioning press block to be fitted with said grip being bored with an insert hole (20) in a center of said positioning press block, each said positioning press block (2) formed with a first circular fitting member (21), a first circular holding edge (22), a second circular fitting member (23) and a second circular holding edge (24) which are arranged sequentially; wherein said first circular fitting member (21) has a conic shape with a large bottom near said first circular holding edge (22); and said second circular fitting member (23) has a conic shape with a large bottom near said second circular holding edge (24); and said first circular holding edge (22) has an outer diameter greater than that of said first circular fitting member (21) and also greater than that of said second circular fitting member (23); and an outer diameter of said first circular holding edge 22 is greater than that of said second circular holding edge (24); a circular protruding portion is formed between the first circular edge (22) and said second circular holding edge (24);
three through holes formed around said insert hole (20) and formed in said positioning press block (22);
a combining member (3) threadably combined with said combining threaded hole (11) of said grip (1) for fixing said positioning press block (2) in position; and
wherein in operation, said combining rod (10) of said grip (1) is inserted through said insert hole (20) of said positioning press block (2) and then said combining member (3) is threadably combined with said combining threaded hole (11) of said grip (1) to fix said positioning press block (2) in position; a bearing is positioned to be assembled in the receiving hole of an axle when one of said first fitting member 21 and said second fitting member 23 closely contacts with an inner wall of said bearing with a respective one of said first holding edge (22) and said second holding edge (23) closely and horizontally resting on an upper edge of said bearing, and then said bearing can be driven into said receiving hole by striking said hammering end (12) of said grip (1) with a hammering tool; therefore, said bearing can smoothly and quickly be assembled and positioned in the receiving hole.
2. The bearing positioning tool set as claimed in claim 1, wherein a toolbox is provided for depositing and storing the members of said tool set.