1. A combinative outer frame for a flat panel display, comprising:
a front frame including an inner surface;
a support frame including a sidewall, said sidewall including a top surface, wherein said top surface including a ridge protruding therefrom is distributed along an extending direction of said sidewall in a zigzag-like manner and is opposite to said inner surface of the front frame; and
an elastic pad joined to said inner surface and said top surface respectively, so that said ridge is pressed into said elastic pad, wherein said elastic pad has a pad thickness, said ridge has a ridge height, and said pad thickness is larger than or equal to said ridge height.
2. The combinative outer frame of claim 1, wherein at least one recess is formed on an inner side of said sidewall to form at least one pit upon said top surface, and said ridge is bent along the edge of said pit.
3. The combinative outer frame of claim 1, wherein said ridge is discontinuously disposed on said top surface.
4. The combinative outer frame of claim 1, wherein said ridge is distributed in a closed circle around said top surface.
5. The combinative outer frame of claim 1, wherein at least one of two opposite surfaces of said elastic pad is sticky and adhered to said inner surface and said top surface respectively.
6. The combinative outer frame of claim 1, wherein said ridge has a cross-section with a narrower top and a wider bottom on said top surface.
7. A flat panel display, comprising:
a front frame including an inner surface;
a display panel disposed corresponding to an inner side of the front frame; and
a backlight module disposed opposite to said front frame so that the display panel is sandwiched between said backlight module and said front frame, said backlight module including:
a support frame including a sidewall, said sidewall including a top surface, wherein said top surface is opposite to said inner surface of said front frame and includes at least a ridge protrudes therefrom, said ridge is distributed along an extending direction of said sidewall in a zigzag-like manner; and
an elastic pad joined to said inner surface, said display panel, and said top surface respectively, so that said ridge is pressed into said elastic pad, wherein said elastic pad has an pad thickness, said ridge has a ridge height, and said pad thickness is larger than or equal to said ridge height.
8. The flat panel display of claim 7, wherein at least one recess is formed on an inner side of said sidewall to form at least one pit upon said top surface, and said ridge is bent along the edge of said pit.
9. The flat panel display of claim 7, wherein said ridge is discontinuously disposed on said top surface.
10. The flat panel display of claim 7, wherein said ridge is distributed in a closed circle around said top surface.
11. The flat panel display of claim 7, wherein at least one of two opposite surfaces of said elastic pad is sticky and adhered to said inner surface and said top surface respectively.
12. The flat panel display of claim 7, wherein said ridge has a cross-section with a narrower top and a wider bottom on said top surface.
13. A method for manufacturing a flat panel display, comprising:
providing a support frame, wherein said support frame includes a sidewall, said sidewall includes a top surface;
forming at least a ridge upon said top surface so that the ridge protrudes from the top surface and is distributed along an extending direction of said sidewall;
disposing the support frame, so that the top surface is opposite to an inner surface of a front frame;
sandwiching a display panel between said support frame and said front frame;
disposing an elastic pad between said inner surface and said top surface; and
combining said front frame and said support frame, so that the elastic pad respectively joins the inner surface, the display panel, and the top surface, and said ridge is pressed into said elastic pad; wherein the step of forming said ridge comprising forming said ridge in a zigzag-like manner on said top surface.
14. The method of claim 13, wherein the step of forming said ridge comprising distributing said ridge in a closed circle around said top surface.
15. The method of claim 13, wherein the step of forming said ridge comprising forming said ridge in a discontinuous manner on said top surface.
16. The method of claim 13, wherein at least one recess is formed on an inner side of said sidewall to form at least one pit upon said top surface, and the step of forming said ridge further comprising forming said ridge upon said top surface so that said ridge is bent along the edge of said pit.
17. The method of claim 13, wherein the step of disposing said elastic pad comprising:
making at least one of two opposite surfaces of said elastic pad to be sticky; and
adhering said two opposite surfaces of said elastic pad to said inner surface and said top surface respectively.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of forming a light-emitting semiconductor device, said method comprising:
forming a structure including a stack of semiconductor layers overlying a host substrate, said stack including an active region, said active region comprising a semiconductor selected from the group consisting of III-Phosphides, III-Arsenides, and alloys thereof;
attaching a superstrate to a first side of said structure, said superstrate substantially transparent to light emitted by said active region;
removing at least a portion of said host substrate; and
forming a first electrical contact and a second electrical contact on a second side of said structure opposite to said first side, said first electrical contact and said second electrical contact electrically coupled to apply a voltage across said active region.
2. The method of claim 1, further comprising bonding said superstrate to said stack.
3. The method of claim 1, further comprising growing said superstrate on said stack.
4. The method of claim 1, wherein the act of removing said portion of said host substrate precedes the act of attaching said superstrate to said structure.
5. The method of claim 1, wherein the act of attaching said superstrate to said structure precedes the act of removing said portion of said host substrate.