1. A thermal interposer comprising:
a test probe guide and insulator top;
a thermal conductor, the test probe guide and insulator top affixed to a top surface of the thermal conductor;
a test probe; and
a test probe guide and insulator bottom affixed to a bottom surface of the thermal conductor, the test probe guide and insulator bottom configured in a ring-like shape to enable the thermal conductor to pass through and make contact with a bottom of a package on package (PoP) integrated circuit (IC).
2. The thermal interposer of claim 1 wherein the test probe guide and insulator comprises:
a generally rectangular ring;
apertures positioned at corners in the ring; and
alignment pins positioned through the apertures.
3. The thermal interposer of claim 1 wherein the thermal conductor comprises:
a generally rectangular ring composed of thermally conductive and electrically isolitive materials and adapted to receive the test probe guide and insulator top through an upper portion of the ring and the test probe guide and insulator bottom through a lower portion of the ring.
4. The thermal interposer of claim 3 wherein the thermally conductive material is selected from the group consisting of aluminum, copper, and aluminum nitride.
5. The thermal interposer of claim 3 wherein the electrically isolitive material is selected from the group consisting of an amorphous thermoplastic polyetherimide (PEI) resin, a ceramic-filled polyetheretherketone (PEEK) compound, a ceramic, and an engineered plastics.
6. A system comprising:
a thermal device plunger linked to a thermal control unit (TCU); and
a thermal interposer, the thermal interposer linked to the thermal device plunger and a test socket through a TCU latch adapter, the thermal interposer transferring electrical connections between a top package and a bottom package of a package on package (PoP) integrated circuit (IC), the thermal interposer transferring temperature between the thermal device plunger and the bottom package.
7. The system of claim 6 wherein the top package is a memory.
8. The system of claim 7 wherein the bottom package is a logic.
9. The system of claim 6 wherein the thermal interposer comprises one or more thermal conductive materials and one or more electrically isolating materials.
10. The system of claim 9 wherein the one or more thermal conductive materials is selected from the group consisting of aluminum, copper, and aluminum nitride.
11. The system of claim 10 wherein the one or more electrically isolating materials is selected from the group consisting of an amorphous thermoplastic polyetherimide (PEI) resin, a ceramic-filled polyetheretherketone (PEEK) compound, a ceramic, and an engineered plastics.
12. The system of claim 6 wherein the thermal interposer comprises:
a test probe guide and insulator top;
a thermal conductor, the test probe guide and insulator top affixed to a top surface of the thermal conductor;
a test probe; and
a test probe guide and insulator bottom affixed to a bottom surface of the thermal conductor, the test probe guide and insulator bottom configured in a ring-like shape to enable the thermal conductor to pass through and make contact with a bottom of a package on package (PoP) integrated circuit (IC).
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A resist composition, comprising a base component (A) which exhibits changed solubility in a developing solution under action of acid, and an acid generator component (B) which generates acid upon exposure, wherein
the base component (A) comprises a polymeric compound (A1) having a structural unit (a5) represented by general formula (a5-1) shown below:
wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms, X represents a single bond or a divalent linking group, W represents a cyclic alkylene group which may include an oxygen atom at an arbitrary position, each of Ra and Rb independently represents a hydrogen atom or an alkyl group which may include an oxygen atom at an arbitrary position, or alternatively, Ra and Rb may be bonded to each other to form a ring together with a nitrogen atom in the formula, and p represents an integer of 1 to 3.
2. The resist composition according to claim 1, wherein the polymeric compound (A1) further comprises a structural unit (a1), which is derived from an acrylate ester in which a hydrogen atom bonded to a carbon atom on an \u03b1-position may be substituted with a substituent, and comprises an acid-degradable group that exhibits increased polarity under action of acid.
3. The resist composition according to claim 2, wherein the polymeric compound (A1) further comprises at least one structural unit selected from the group consisting of a structural unit (a0), which is derived from an acrylate ester in which a hydrogen atom bonded to a carbon atom on an \u03b1-position may be substituted with a substituent, and comprises an \u2014SO2-containing cyclic group, and a structural unit (a2), which is derived from an acrylate ester in which a hydrogen atom bonded to a carbon atom on an \u03b1-position may be substituted with a substituent, and comprises a lactone-containing cyclic group.
4. A method of forming a resist pattern, the method comprising: forming a resist film on a substrate using the resist composition according to any one of claims 1 to 3, conducting exposure of the resist film, and developing the resist film to form a resist pattern.