1. A method for treating andor preventing Cardiovascular Diseases and recurrence thereof, in a patient in need thereof, comprising the following steps performed in any order:
a) administering a compound of formula I
or a pharmaceutically acceptable salt, solvate, active metabolite, prodrug, racemate or enantiomer thereof; and
b) performing a PCI procedure.
2. A method for treating andor preventing Cardiovascular Diseases and recurrence thereof, in a patient in need thereof, comprising the following steps performed in any order:
a) administering a compound of formula I
or a pharmaceutically acceptable salt, solvate, active metabolite, prodrug, racemate or enantiomer thereof in combination with aspirin; and
b) performing a PCI procedure.
3. A method for treating andor preventing Cardiovascular Diseases and recurrence thereof, in a patient in need thereof, comprising the following steps performed in the order described:
a) first, administering a compound of formula I
or a pharmaceutically acceptable salt, solvate, active metabolite, prodrug, racemate or enantiomer thereof, optionally in combination with aspirin;
b) second, performing a PCI procedure; and
c) third, administering a compound of formula I or a pharmaceutically acceptable salt, solvate, active metabolite, prodrug, racemate or enantiomer thereof, optionally in combination with aspirin.
4. A method according to claims 1, 2, or 3 comprising in order the steps of:
a) administering a therapeutically effective amount of a compound of formula I, or a pharmaceutically acceptable salt, solvate, active metabolite, prodrug, racemate or enantiomer thereof, optionally in combination with aspirin or other cardio protective agent about 2 to 30 days prior to performing the PCI procedure,
b) performing a PCI procedure, and
c) administering a therapeutically effective amount of a compound of formula I, or a pharmaceutically acceptable salt, solvate, active metabolite, prodrug, racemate or enantiomer thereof, optionally in combination with aspirin or other cardio protective agent about 0 to 365 days after performance of the PCI procedure.
5. A method according to claim 1, 2, or 3 wherein the compound of formula I, is 2-Acetoxy-5-(\u03b1-cyclopropylcarbonyl-2-fluorobenzyl)-4,5,6,7-tetrahydrothieno3,2-cpyridine hydrochloride acid addition salt or enantiomer thereof.
6. A method according to claim 1, 2 or 3 wherein the Cardiovascular Disease is selected from the group consisting of coronary occlusion, restenosis, acute coronary syndrome, high risk vascular diseases, congestive heart failure, cardiac alternation, ventricular aneurysm, mural aneurysm, myocardial infarction, cardiac arrest, cardiac dysrhythmia including atrial fibrillation, cardiac edema, cardiac dyspnea, cardiac failure, tachycardia, cardiac hemoptysis, cardiac incompetence, cardiac murmur, cardiac syncope, and cardiac tamponade.
7. A method according to claim 1, 2 or 3 wherein the Cardiovascular Disease is selected from the group consisting of ACS, CVA and HRVD.
8. A device coated or impregnated with a compound of formula I or a pharmaceutically acceptable salt, solvate, prodrug, active metabolite, racemate or enantiomer thereof, for the treatment, prevention or amelioration of Cardiovascular Diseases.
9. Use of a therapeutically effective amount of a compound of formula I or a pharmaceutically acceptable salt, solvate, prodrug, active metabolite, racemate or enantiomer thereof, in conjunction with a stent for treating andor preventing recurrence of peripheral vascular disease.
10. Use of a therapeutically effective amount of a compound of formula I or a pharmaceutically acceptable salt, solvate, prodrug, active metabolite, racemate or enantiomer thereof, in conjunction with a stent for treating andor preventing recurrence of cerebrovascular disease.
11. Use of a compound of formula I
or a pharmaceutically acceptable salt, solvate, prodrug, racemate or enantiomer thereof, in conjunction with a PCI procedure for treating andor preventing the recurrence of Cardiovascular Diseases comprising administering an effective amount of said compound of formula I optionally in combination with aspirin to a patient in need thereof.
12. A method of treating andor preventing Cardiovascular Diseases andor recurrences thereof, comprising administering a compound of formula I or a pharmaceutically acceptable salt, solvate, prodrug, active metabolite, racemate or enantiomer thereof, in conjunction with a stent impregnated with the compound of formula I, a pharmaceutically acceptable salt, prodrug, active metabolite, racemate or enantiomer thereof, optionally in combination with other cardio-protective agent(s) to a patient in need thereof.
13. (canceled)
14. (canceled)
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electronic device, comprising:
a substrate;
a MEMS device on the substrate;
a metal seal, wherein the metal seal is positioned on the substrate proximate a perimeter of the MEMS device, thereby forming an hermetic seal proximate a perimeter of the MEMS device; and
means for sealing said MEMS device in contact with the metal seal, thereby encapsulating the MEMS device within the substrate, the metal seal, and the means for sealing.
2. The electronic device of claim 1, wherein the substrate comprises a transparent substrate.
3. The electronic device of claim 1, wherein the MEMS device comprises an array of interferometric modulators.
4. The electronic device of claim 1, wherein said sealing means comprises a back-plate.
5. The electronic device of claim 1, wherein the metal seal comprises a solder layer.
6. The electronic device of claim 1, further comprising one or more adhesion metal layers disposed over the metal seal, wherein the one or more adhesion metal layers are configured for attachment to a backplane.
7. The electronic device of claim 6, wherein the one or more adhesion layers comprises solder.
8. The electronic device of claim 1, wherein the metal seal comprises at least one of a metal seed layer and an adhesion layer.
9. The electronic device of claim 1, further comprising means for attaching the sealing means to the metal seal.
10. The electronic device of claim 9, wherein the attaching means comprises a pre-deposited adhesion layer configured to adhere to the metal seal.
11. The electronic device of claim 1, wherein said MEMS device comprises an interferometric modulator.
12. A microelectromechanical system (MEMS) device sealed from ambient conditions, comprising:
a MEMS device formed on a substrate;
a substantially metal seal formed on the substrate proximate a perimeter of the MEMS device, wherein the metal seal comprises a metal seed layer or an adhesion layer; and
a backplane in contact with the substantially metal seal, thereby encapsulating the MEMS device within the substrate, the substantially metal seal, and the backplane.
13. The device of claim 12, further comprising one or more adhesion metal layers deposited over the substantially metal seal, wherein the one or more adhesion metal layers are configured for attachment to the backplane.
14. The device of claim 13, wherein the one or more adhesion layers comprises a solder.
15. The device of claim 12, wherein the substantially metal seal comprises a metal seed layer.
16. An electronic device, comprising:
a MEMS device formed on a substrate;
a seal comprising metal, wherein said seal is formed on the substrate proximate a perimeter of the MEMS device, thereby forming an hermetic seal proximate a perimeter of the MEMS device; and
a back-plate in contact with the seal, thereby encapsulating the MEMS device within the substrate, the seal, and the back-plate.
17. The electronic device of claim 16, wherein the seal comprises a solder layer.
18. The electronic device of claim 16, wherein the seal comprises at least one of a metal seed layer and an adhesion layer.
19. The electronic device of claim 16, wherein the seal further comprises an adhesion layer.
20. The electronic device of claim 16, wherein the substrate comprises a transparent substrate.
21. The electronic device of claim 16, wherein the seal comprises a metal seed layer and an adhesion layer.
22. The electronic device of claim 16, wherein the MEMS device is an interferometric modulator.
23. The device of claim 12, wherein the substantially metal seal is metal.