What is claimed is:
1. A mechanical seal device for providing a seal between a high pressure process fluid side and a lower pressure side by developing a sealing contact between the two seal faces of a first seal ring mounted on a rotary body and a second seal ring installed in a seal housing, said mechanical seal device comprising:
1) a mating surface being retained by one of said seal rings and being fixedly installed in a step shoulder installation surface;
2) a seal face being located on the opposite side relative to said mating face;
3) a cup gasket being disposed between said mating surface of said seal ring and said step shoulder installation surface, said cup gasket being made of a resilient rubber material; and
4) a support plate being disposed in said cup gasket in an integral manner, a support face of said support plate facing opposite relative to and in approximately parallel with said mating surface of said seal ring.
2. A mechanical seal device as claimed in claim 1 wherein the diameter of said support plate in said cup gasket is in a range of from the diameter of the inner diameter surface of said seal ring to the diameter of the inner diameter surface of a through hole extending through said step shoulder installation surface.
3. A mechanical seal device as claimed in claim 1 or 2 wherein said support plate retains a cylindrical wall in the outer circumferential portion of the circular plate and the length of said cylindrical wall does to exceed the axial length of the chamfered corner located at the outer circumferential edge of said seal ring.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A curing light comprising:
a light module,
said light module including an elongate heat sink with a proximal end and a distal end, said elongate heat sink havinga longitudinal axis,
a mounting platform located at said elongate heat sink distal end, said mounting platform being adapted to have a LED chip module mounted thereon, and
an LED chip module mounted on said mounting platform, said LED chip module including
a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink,
a well on said primary heat sink for mounting an LED chip therein,
an LED chip mounted in said well,
wherein said LED chip module is mounted on said mounting platform; and wherein said mounting platform is positioned so light emitted by said LED chip module directly forward of said LED chip module travels away from said LED chip module at an angular orientation in the range of 30 to 150 degrees; with respect to said elongate heat sink longitudinal axis and wherein light emitted by the curing light travels away from the curing light at an angular orientation in the range of 30 to 150 degrees with respect to said elongate heat sink longitudinal axis; and
wherein said light exits the curing light and travels to a location where it can cure a light-curable material without passing through a light guide.
2. A curing light comprising:
an elongate heat sink with a proximal end and a distal end, said elongate heat sink having a longitudinal axis defined between said proximal end and said distal end,
an LED chip module mounted at said elongate heat sink distal end, said LED chip module including
a primary heat sink, said primary heat sink having a smaller mass than said elongate heat sink, and
an LED chip mounted to said primary heat sink;
wherein said LED chip module is mounted on said mounting platform in a position so that light emitted by said LED chip module directly forward of said LED chip module travels away from said LED chip module at an angle in the range of 45 to 135 degrees with respect to said elongate heat sink longitudinal axis;
wherein said light exits the curing light and travels to a location where it can cure a light-curable material without passing through a light guide.
3. A curing light as recited in claim 2 further comprising a well on said primary heat sink wherein said LED chip is mounted.
4. A curing light comprising:
an elongate heat sink having a longitudinal axis,
a semiconductor chip capable of emitting light that can aid in initiating curing of a curable material,
wherein said semiconductor chip is fixedly mounted with respect to said elongate heat sink so that light emitted by said semiconductor chip directly forward of said semiconductor chip departs said semiconductor chip at an angle with respect to said elongate heat sink longitudinal axis in the range of 30 to 150 degrees; and
wherein said light travels to the exterior of the curing light and travels to a location where it can cure a light-curable material without passing through a light guide.