1. A system for recovering gas from a gas well, comprising:
a tubing string extending into the gas well;
a ported member co-axially disposed within the tubing string, the ported member configured to selectively permit or prevent fluid connection between an interior of the ported member and an annular region between the tubing string and a wall of the well;
a retrievable plug disposed within the tubing string below the ported member; and
a dead string co-axially disposed in the tubing string below the retrievable plug.
2. The system of claim 1, wherein the dead string is disposed in a perforated interval of the well.
3. The system of claim 1, wherein an outer diameter of the dead string is greater than an outer diameter of the tubing string.
4. The system of claim 1, further comprising a wireline re-entry guide attached to the dead string.
5. The system of claim 1, wherein the ported member is a sliding sleeve valve.
6. The system of claim 1, wherein the ported member is a ported flow sub.
7. The system of claim 1, further comprising capillary tubing attached to an exterior wall of the tubing string for delivering reagents to a top of the dead string.
8. The system of claim 7, further comprising a valve for delivering reagents from the capillary tubing into an interior of the tubing string or dead string below the ported member.
9. The system of claim 8, wherein the retrievable plug is configured to be selectively positioned above or below the valve for delivering reagents.
10. The system of claim 1, further comprising a capillary tubing inside the tubing string for delivering reagents to a top of the dead string.
11. The system of claim 1, further comprising a plunger lift system installed in the tubing stream above the ported member.
12. A system for recovering gas from a gas well, comprising:
a tubing string extending into the gas well;
a means for selectively permitting or preventing fluid communication between an interior of the tubing string and an annular region between the tubing string and a wall of the well;
a retrievable plug disposed within the tubing string below the means for selectively permitting or preventing fluid communication between an interior of the tubing string and an annular region between the tubing string and a wall of the well; and
a dead string co-axially disposed in the tubing string below the retrievable plug.
13. The system of claim 12, wherein the means for selectively permitting or preventing fluid communication between an interior of the tubing string and an annular region between the tubing string and a wall of the well is a ported flow sub or a sliding sleeve valve.
14. The system of claim 12, further comprising a means for delivering reagents to an interior of the dead string.
15. The system of claim 14, wherein the means for delivering reagents is a capillary tube or side string attached to an exterior wall of the tubing string and a valve for communicating reagents between the capillary tube and an interior of the dead string.
16. A method of reducing the critical velocity of a gas produced in a perforated interval of a gas well, comprising:
providing a tubing string extending into the well;
providing a ported member configured to selectively permit or prevent fluid connection between an interior of the ported member and an annular region between the tubing string and a wall of the well; and
providing a dead string attached to the tubing string and disposed within the perforated interval such that gas produced in the perforated interval flows through an annular flow path between the dead string and a wall of the well and crosses over into an interior of the tubing string via the ported member;
wherein an interior of the dead string and the interior of the ported member are selectively isolatable from each other by a retrievable plug.
17. The method of claim 16, further comprising delivering chemical foamer to the interior of the dead string.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An apparatus comprising:
at least one antenna structure located on a first surface of a first substrate;
at least one pad located on the first surface of the first substrate; and
at least one via traversing the first substrate and thereby connecting the at least one pad located on the first surface of the first substrate to at least one pad located on a second surface;
wherein the at least one pad located on the first surface of the first substrate is operatively coupleable to at least one pad located on a surface of an integrated circuit; the at least one pad located on the second surface is operatively coupleable to at least one pad located on a surface of a printed circuit board; and the at least one via is thereby operative to couple the at least one pad located on the surface of the integrated circuit and the at least one pad located on the surface of the printed circuit board.
2. The apparatus of claim 1, wherein the first surface is capable of having the integrated circuit flip-chip mounted thereto.
3. The apparatus of claim 1, wherein the second surface is capable of having the printed circuit board flip-chip mounted thereto.
4. The apparatus of claim 1, wherein the antenna structure comprises at least one feed line operatively coupled to the at least one pad located on the first surface.
5. The apparatus of claim 1, wherein the first substrate is a low-loss substrate.
6. The apparatus of claim 1, wherein the second surface is a surface of the first substrate.
7. The apparatus of claim 1, wherein the second surface is a surface of a second substrate and wherein the at least one via traverses the first and second substrates.
8. The apparatus of claim 7, wherein the second substrate has a cavity located between at least a portion of the at least one antenna and at least a portion of a ground plane located proximate to the second surface.
9. The apparatus of claim 8, wherein the surfaces of the second substrate adjacent to the cavity are plated with metal.
10. The apparatus of claim 8, wherein a ground plane is formed on the surface of the printed circuit board.
11. The apparatus of claim 7, further comprising a third substrate formed between the first and second substrates;
wherein the at least one via traverses the first, second and third substrates;
wherein the third substrate has a cavity located between at least a portion of the at least one antenna.
12. The apparatus of claim 11, wherein the surfaces of the second and third substrates adjacent to the cavity are plated with metal.
13. The apparatus of claim 11, wherein the surface of the third substrate adjacent to the cavity provides a ground plane.
14. An apparatus comprising:
a plurality of pads located on a surface of a substrate opposite a printed circuit board;
at least one integrated circuit operatively coupled to at least a portion of the plurality of pads and located proximate to the surface of the substrate opposite the printed circuit board;
a plurality of antennas located proximate to the surface of the substrate opposite the printed circuit board; and
at least one feed line operatively connected between each of the plurality of antennas and a given one or more of the plurality of pads.
15. The apparatus of claim 14, further comprising:
at least one pad proximate to a surface of the printed circuit board and located between the substrate and the printed circuit board; and
at least one via traversing the substrate, wherein each via connects a given one of the plurality of pads located between the integrated circuit and the substrate with the at least one pad located proximate to the surface of the printed circuit board.
16. A method of packaging an antenna, comprising the steps of:
forming an antenna on a first surface of a first substrate;
flip-chip mounting an integrated circuit to the first surface of the first substrate; and
flip-chip mounting a second surface opposite the first surface of the first substrate to a printed circuit board.
17. The method of claim 16, further comprising the step of forming at least one via traversing the first substrate, the at least one via operatively coupling at least one pad located on the first surface to the at least one via connecting the at least one pad located on the second surface.
18. The method of claim 17, wherein the at least one via operatively couples at least one pad located on a surface of the integrated circuit adjacent to the first surface to at least one pad located on a surface of the printed circuit board adjacent to the second surface.
19. The method of claim 16, wherein the second surface is a surface of the first substrate.
20. The method of claim 16, wherein the second surface is a surface of a second substrate.