1. A cable retention mechanism for locking an external connector with an inputoutput connector of an electronic device, comprising:
a retention housing configured to couple to the electronic device, the retention housing having a first surface and a second surface opposite the first surface, the second surface being adjacent to the device housing when the retention mechanism and the electronic device are coupled to one another; and
a retainer disposed at least partially within the retention housing and including:
a mounting arrangement defining a channel configured to receive a cable of the external connector, the mounting arrangement being biased to apply a first retaining force to the cable; and
a biasing member coupled to the mounting arrangement, the biasing member compressing a portion of the mounting arrangement adjacent to the channel such that a width of the channel decreases as the channel approaches the second surface, the biasing member applying a second retaining force to the mounting arrangement to increase the first retaining force, the biasing member having ends angled towards each other in a converging V-shape to apply an asymmetric force across a length of the mounting arrangement,
wherein, when a longitudinal tension is applied to the cable, the biasing member increases the second retaining force.
2. The cable retention mechanism of claim 1, wherein the biasing member is a spring wire that is U-shaped when viewed from a first side and C-shaped when viewed from a second side.
3. The cable retention mechanism of claim 2, wherein the first portion is disposed at least partially in the retention housing, the first portion configured to engage a second portion of the locking arrangement that is disposed at least partially in the device housing of the electronic device.
4. The cable retention mechanism of claim 1, wherein the mounting arrangement includes gripping features configured to increase the first retaining force.
5. The cable retention mechanism of claim 4, wherein the gripping features are rounded extensions extending into the channel.
6. The cable retention mechanism of claim 1, wherein the biasing member has a substantial U-shape corresponding to a substantial M-shape of the mounting arrangement.
7. The cable retention mechanism of claim 6, wherein the mounting arrangement has a shape configured to engage the biasing member, the substantial U-shape of the biasing member including a loop portion and end portions extending from the loop portion.
8. The cable retention mechanism of claim 7, wherein the end portions of the biasing member converge toward each other such that the channel is caused to converge.
9. The cable retention mechanism of claim 1, wherein the second retaining force is increased from the channel being caused to converge further.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A pad conditioning head for a chemical mechanical polishing (CMP) process, comprising:
a rotatable member;
an end effector adapted to receive and retain a conditioning disk;
a sealing element comprising a flexible lip disposed around the rotatable member, the flexible lip being adapted to:
seal against the rotatable member when the rotatable member is not rotating, and
retract, in response to a pressure force from a gaseous media, away from the rotatable member, when the rotatable member is rotating so as to permit the gaseous media to flow past the flexible lip, along the rotatable member; and
an elastic device disposed between the rotatable member and the end effector, the elastic device being:
adapted to rotate the end effector via a torque from the rotatable member, and
flexibly extensible so as to impart a force to the end effector while permitting the end effector to deviate from a perpendicular alignment with the rotatable member in order for a conditioning surface of the conditioning disk to conform to an irregular polishing surface of a pad being conditioned.
2. The pad conditioning head of claim 1 wherein the elastic device is a bellows.
3. The pad conditioning head of claim 2 wherein the rotatable member includes a duct for providing a vacuum or pressure to the bellows.
4. The pad conditioning head of claim 1 wherein the elastic device is further adapted to move the end effector along an axis of rotation of the rotatable member.
5. The pad conditioning head of claim 1 wherein the rotatable member includes a flanged portion coupled to the elastic device; and
wherein the elastic device is adapted to move the end effector relative to the flanged portion.
6. The pad conditioning head of claim 1 further comprising a boot disposed around the elastic device and coupled to the rotatable member and the end effector, thereby deterring a polishing slurry from contacting the elastic device.
7. The pad conditioning head of claim 6 wherein the boot forms a first seal with the rotatable member and a second seal with the end effector.
8. The pad conditioning head of claim 7 further comprising a duct, coupled to a volume defined by the boot, the elastic device, the rotatable member and the end effector, for reducing a pressure within the volume.
9. A pad conditioning head for a chemical mechanical polishing (CMP) process, comprising:
a rotatable member; and
a sealing element comprising a flexible lip disposed around the rotatable member, the flexible lip being adapted to:
seal against the rotatable member when the rotatable member is not rotating, and
retract, in response to a pressure force from a gaseous media, away from the rotatable member, when the rotatable member is rotating so as to permit the gaseous media to flow past the flexible lip, along the rotatable member.
10. The pad conditioning head of claim 9 wherein the rotatable member is disposed within a housing; and
further comprising a duct in the housing adapted to introduce the gaseous media within the pad conditioning head.
11. The pad conditioning head of claim 9 wherein the flexible lip is further adapted to retract, in response to a pressure force from a gaseous media, away from the rotatable member, when the rotatable member is rotating so as to permit the gaseous media to flow past the flexible lip, thereby purging polishing slurry from the pad conditioning head.
12. A pad conditioning head for a chemical mechanical polishing (CMP) process, comprising:
a rotatable member; and
a sealing element comprising a flexible lip disposed around the rotatable member, the flexible lip being adapted to:
seal against the rotatable member when the rotatable member is not rotating; and
retract away from the rotatable member when the rotatable member is rotating.
13. The pad conditioning head of claim 12 wherein the rotatable member is disposed within a housing so as to define a path adapted to permit a flow of cleaning fluid into and from the pad conditioning head when the rotatable member is not rotating; and
wherein the flexible lip is adapted to enhance a seal between the sealing element and the rotatable member when the cleaning fluid contacts a first side of the flexible lip.
14. A pad conditioning head, comprising:
a housing;
an end effector coupled to the housing, the end effector being adapted to:
receive and retain a conditioning disk;
move away from the housing so as to position the conditioning disk in contact with a polishing pad;
urge a conditioning disk against a polishing pad and rotate relative to the housing for polishing pad conditioning; and
pivot relative to the housing during polishing pad conditioning so as to conform to an irregular polishing surface of a polishing pad;
a rotatable member adapted to rotate the end effector; and
a sealing element comprising a flexible lip disposed around the rotatable member, the flexible lip being adapted to:
seal against the rotatable member when the rotatable member is not rotating, and
retract, in response to a pressure force from a gaseous media, away from the rotatable member, when the rotatable member is rotating so as to permit the gaseous media to flow past the flexible lip, along the rotatable member.
15. The pad conditioning head of claim 14 further comprising a rotatable member disposed within the housing; and
wherein the end effector is adapted to deviate from a perpendicular orientation with respect to an axis of the rotatable member.
16. A pad conditioning head, comprising:
a housing;
a rotatable member rotatably disposed within the housing, the housing and the rotatable member together defining a gap susceptible to exposure of migrating polishing slurry during pad conditioning;
a sealing element comprising a flexible lip disposed around the rotatable member, the flexible lip being adapted to:
seal against the rotatable member when the rotatable member is not rotating, and
retract, in response to a pressure force from a gaseous media, away from the rotatable member, when the rotatable member is rotating so as to permit the gaseous media to if low past the flexible lip, along the rotatable member; and
a duct within the housing adapted to selectively direct a flow of cleaning fluid to the gap so that the cleaning fluid flow passes along the gap, carrying polishing slurry therefrom.
17. The pad conditioning head of claim 16 further comprising another duct within the housing adapted to permit the cleaning fluid to flow from the pad conditioning head, thereby carrying polishing slurry therefrom.
18. A method of chemical mechanical polishing (CMP), comprising:
providing a pad conditioning head for a CMP process, having:
a rotatable member;
a sealing element comprising a flexible lip disposed around the rotatable member, the flexible lip being adapted to:
seal against the rotatable member when the rotatable member is not rotating, and
retract, in response to a pressure force from a gaseous media, away from the rotatable member, when the rotatable member is rotating so as to permit the gaseous media to flow past the flexible lip, along the rotatable member; and
an end effector coupled to the rotatable member and adapted to receive and retain a conditioning disk; imparting a force to the end effector; and
permitting the end effector to deviate from a perpendicular alignment with the rotatable member, and conform to an irregular polishing surface of a pad being conditioned.