What is claimed is:
1. A metal bumping structure on the inputoutput connector of a substrate or wafer, which is a metal conductor composed of multiple metal layers overlap the connector pad, and it is characterized in that: the multiple metal layers which overlap to outer or upper metal layer is thinner than the inner or lower metal layer, and the outer or upper metal layer that form the pillar style whose conductivity, connectivity and corrosion resist are better than the inner or lower metal layer, such that the bumping connector has better conductivity, connectivity and not easy to be corroded.
2. The structure according to claim 1, wherein the multiple metal layers of the metal bumping structure is made of metal, its alloy or its compound.
3. The structure according to claim 1, wherein the metal bumping, structure is composed of double metal layer that overlap on connector pad, the inner or lower layer is Ni, its alloy or its compound, and the outer or upper layer is Au, its alloy or its compound.
4. The structure according to claim 3, wherein the deposition to the inner or lower metal layer, its alloy or its compound of the metal bumping, structure is repressed by the photoresist.
5. The structure according to claim 3, wherein the deposition to the outer or upper metal layer, its alloy or its compound of the metal bumping structure is repressed by the photoresist.
6. The structure according to claim 3, wherein the deposition to the inner or lower metal layer, its alloy or its compound of the metal bumping structure, and the deposition to the outer or upper metal layer, its alloy or its compound of the metal bumping structure are repressed by the photoresist.
7. The structure according to claim 1, wherein the metal bumping structure is composed of triple metal layer that overlap on connector pad, the inner or lower layer is Pd, its alloy or its compound, the middle layer is Ni, its alloy or its compound, and the outer or upper layer is Au, its alloy or its compound.
8. The structure according to claim 7, wherein the deposition to the inner or lower metal layer, its alloy or its compound and the middle metal layer of the metal bumping structure is repressed by the photoresist.
9. The structure according to claim 7, wherein the deposition to the outer or upper metal layer, its alloy or its compound and the middle metal layer of the metal bumping structure is repressed by the photoresist.
10. The structure according to claim 7, wherein the deposition to the inner or lower metal layer, its alloy or its compound and the middle metal layer of the metal bumping structure and the deposition to the outer or upper metal layer, its alloy or its compound and the middle metal layer of the metal bumping structure both are repressed by the photoresist.
11. The structure according to claim 1, wherein the outer metal layer of the multi-metal layer of the metal bumping structure is not extended to the rim of pillar, that is not to fully cover the inner or lower metal layer.
12. The structure according to claim 1, wherein the outer metal layer of the multi-metal layer of the metal bumping structure extends to the rim of pillar, that is fully cover the inner or lower metal layer such that not to be corroded.
13. The structure according to claim 1, wherein the metal bumping structure is constructed upon the inputoutput connector pad, and the bumping edge does not exceed the pad area.
14. The structure according to claim 1, wherein the metal bumping structure is constructed upon the inputoutput connector pad, and the bumping edge exceeds the pad area but does not exceed the one-second pitch between two pads.
15. The structure according to claim 1, wherein the metal bumping structure of the inputoutput connector pad conductor is composed of Al, Cu, Ag, Au, their alloies or their compounds, in order to construct and make use of the same or different metals, such that the well connectivity is obtained.
16. A method for manufacturing metal bumping structure on the inputoutput connector of a substrate or wafer, comprising the steps of electroless plating accompanies photoresist, exposure, developing and photoresist removing to construct a metal conductor of the multiple metal layers upon the inputoutput connector pad.
17. A method according to claim 16, in the step of electroless plating, which the metal ion is replaced in the silvent or, performing chemical reduction method in the solvent contains reducing agent, single or repeat mixing both of the former processes to attain, and adjust it depend on the elements or the concentration of the solvent to deposit a metal, its alloy or its compound, such that to construct the overlap of the multiple metal layers, and the outer or upper metal layer is thinner than the inner or lower metal layer, then the flatness of the top bumping connector without extension of the metal bumping is formed.
18. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 16, it comprises the steps of:
(1) Coating photoresist;
(2) Adding mask to exposure;
(3) Developing to expose the metal of the pad;
(4) Pre-treatment of the electroless plating;
(5) Plating a metal layer by electroless plating method;
(6) Photoresist removing;
(7) By electroless plating method, plating an another metal onto the surface of the metal layer to construct the bumping
19. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 18 wherein, when the original metal of the pad is Al, the manufacturing steps (4) (5) (7) are separately modified to:
(4) The Al on the pad is replaced by Zn, its alloy or its compound;
(5) In the step (4), the surface of Zn is replaced by Ni, its alloy or its compound;
(7) In the step (5), the upper edge and the rim surface of the Ni is replaced or deposited by Au, its alloy or its compound;
so as to construct the bumping.
20. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 18 wherein, when the original metal of the pad is Cu, the manufacturing steps (4) (5) (7) separately modify to:
(4) The Cu on the pad surface is replaced by Pd, alloy or compound;
(5) In the step (4), the surface of the Pd is replaced by Ni, its alloy or its compound;
(8) In the step (5), the upper edge and the rim surface of the Ni is replaced or deposited by Au, its alloy or its compound
so as to construct the bumping.
21. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 17, it comprises the steps of:
(1) Coating photoresist;
(2) Adding mask to exposure;
(3) Developing to expose the metal of the pad;
(4) Pre-treatment of the electroless plating;
(5) Plating one metal layer by electroless plating method;
(6) By electroless plating method, plating an another metal on the surface of the metal layer formed by step (5) to construct the bumping;
(7) Photoresist removing;
(8) By electroless plating method, again plating the same metal in the step (6) on the rim of the metal formed by step (5)
so as to construct the bumping.
22. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 21 wherein, when the original metal of the pad is Al, the manufacturing steps (4) (5) (6) (8) are separately modified to:
(4) The Al on the pad is replaced by Zn, alloy or compound;
(5) In the step (4), the surface of Zn is replaced by Ni, its alloy or its compound;
(6) In the step (5), the upper edge surface of Ni is replaced or deposited by Au, its alloy or its compound;
(8) In the step (5), the rim surface of Ni is replaced or deposited by Au, its alloy or its compound;
so as to construct the bumping.
23. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 21 wherein, when the original metal of the pad is Cu, the manufacturing steps (4) (5) (6) (8) are separately modified to:
(4) The Cu on the pad is replaced by Pd, its alloy or its compound;
(5) In the step (4), the surface of Pd is replaced by Ni, its alloy or its compound;
(6) In the step (5), the upper edge surface of Ni is replaced or deposited by Au, its alloy or its compound;
(8) In the step (5), the rim surface of Ni is replaced or deposited by Au, its alloy or its compound;
so as to construct the bumping.
24. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 16, it comprises the steps of:
(1) Coating photoresist;
(2) Adding mask to exposure;
(3) Developing to expose the metal of the pad;
(4) Pre-treatment of the electroless plating;
(5) Plating one metal layer by electroless plating method;
(6) By electroless plating method, plating an another metal on the surface of the metal layer formed by step (5);
(7) Photoresist removing;
so as to construct the bumping.
25. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 24 wherein, when the original metal of the pad is Al, the manufacturing steps (4) (5) (6) are separately modified to:
(4) The Al on the pad is replaced by Zn, its alloy or its compound;
(5) In the process number four, the surface of the Zn is replaced by Ni, alloy or compound;
(6) In the step (5), the upper edge and the rim surface of Ni is replaced or deposited by Au, its alloy or its compound;
so as to construct the bumping.
26. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 24 wherein, when the original metal of the pad is Cu, the manufacturing steps (4) (5) (6) are separately modified to:
(4) The Cu on the pad surface is replaced by Pd, its alloy or its compound;
(5) In the step (4), the surface of Pd is replaced by Ni, its alloy or its compound;
(6) In the step (5), the upper edge and the rim surface of Ni is replaced or deposited by Au, its alloy or its compound;
so as to construct the bumping.
27. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 16, it comprises the steps of:
(1) Pre-treatment of the electroless plating;
(2) Plating one metal layer by electroless plating method;
(3) By electroless plating method, plating an another metal on the surface of the metal layer formed by process number two;
(4) Coating photoresist;
(5) Adding mask to exposure;
(6) Developing to expose the top metal of the pad;
(7) By electroless plating method, plating the same thicker metal on the top surface of the metal layer formed by step (2);
(8) Photoresist removing;
So as to construct the bumping.
28. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 27 wherein, when the original metal of the pad is Al, the manufacturing steps (1) (2) (3) (7) are separately modified to:
(1) The Al on the pad is replaced by Zn, its alloy or its compound;
(2) In the step (1), the surface of Zn is replaced by Ni, its alloy or its compound;
(3) In the step (2), the surface of Ni is replaced or deposited by Au, its alloy or its compound;
(7) In the step (3), the top surface of the Au is deposited thicker by Au, its alloy or its compound;
so as too construct the bumping.
29. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 27 wherein, when the original metal of the pad is Cu, the manufacturing steps (1) (2) (3) (7) are separately modified to:
(1) The Cu on the pad surface is replaced by Pd, its alloy or its compound;
(2) In the step (1), the surface of Pd is replaced by Ni, its alloy or its compound;
(3) In the step (2), the surface of Ni is replaced or deposited by Au, its alloy or its compound;
(7) In the step (3), the top surface of the Au is deposited by a thicker layer of Au, its alloy or its compound;
so as to construct the bumping.
30. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 16, it comprises the steps of:
(1) Pre-treatment of the electroless plating;
(2) Plating one metal layer by electroless plating method;
(3) Coating photoresist;
(4) Adding mask to exposure;
(5) Developing to expose the top metal of the pad;
(6) By electroless plating method, plating an another metal on the surface of the metal layer formed by step (2);
(7) Photoresist removing;
so as to construct the bumping.
31. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 16 wherein, when the original metal of the pad is Al, the manufacturing steps (1) (2) (3) are separately modified to:
(1) Pre-treatment of the electroless plating;
(2) Plating one metal layer by electroless plating method;
(3) Coating photoresist;
(4) Adding mask to exposure;
(5) Developing to expose the top metal of the pad;
(6) By electroless plating method, plating an another metal on the surface of the metal layer formed by step (2);
(7) Photoresist removing;
so as to construct the bumping.
32. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 30 wherein, when the original metal of the pad is Cu, the manufacturing steps (1) (2) (3) are separately modified to:
(1) The Cu of the pad surface is replaced by Pd, its alloy or its compound;
(2) In the step (1), the surface of the Pd is replaced by Ni, its alloy or its compound;
(3) In the step (2),. the surface of the Ni is replaced or deposited by Au, its alloy or its compound;
so as to construct the bumping.
33. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 16, it comprises the steps of:
(1) Pre-treatment of the electroless plating;
(2) Plating one metal layer by electroless plating method;
(3) Coating photoresist;
(4) Adding mask to exposure;
(5) Developing to expose the top metal of the pad;
(6) By electroless plating method, plating an another metal on the surface of the metal layer formed by step (2);
(7) Photoresist removing;
(8) By electroless plating method, plating a thicker layer of metal same as that used in step (6) on the rim of the metal formed by step (2) and on the top surface of the metal layer formed by step (6);
so as to construct the bumping.
34. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 33 wherein, when the original metal of the pad is Al, the manufacturing steps (1) (2) (3) (8) are separately modified to:
(1) The Al on the pad surface is replaced by Zn, its alloy or its compound;
(2) In the step (1), the surface of Zn is replaced by Ni, its alloy or its compound;
(3) In the step (2), the surface of Ni is replaced or deposited by Au, its alloy or its compound;
(8) The rim in the step (2) and the top surface in the step (6) are plating thicker layers of metal same as that used in step (6);
so as to construct the bumping.
35. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 33 wherein, when the original metal of the pad is Cu, the manufacturing steps (1) (2) (3) (8) are separately modified to:
(1) The Cu of the pad surface is replaced by Pd, its alloy or its compound;
(2) In the step (1), the surface of the Pd is replaced by Ni, its alloy or its compound;
(3) In the step (2), the surface of Ni is replaced or deposited by Au, its alloy or its compound;
(8) The rim in the step (2) and the top surface in the step (6) are plating thicker layers of metal same as that used in step (6);
so as to construct the bumping.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A binding for a snowboard or other type of board, comprising:
a base plate structure comprising:
a lower plate that is mountable on a board;
an upper plate that is adapted to receive a boot and is mounted above the lower plate in a spaced relationship;
a spring-based suspension system connecting the upper plate to the lower plate;
wherein the spring-based suspension system is compressed by the application of force and thereby absorbs vibration and shock.
2. The binding of claim 1 wherein the upper and lower plates each comprise a plurality of flanges extending outwards from a footprint area of the plates, the flanges of the upper plate being aligned with corresponding flanges of the lower plate.
3. The binding of claim 2 wherein the suspension system comprises a plurality of springs, one spring being connected between each flange of the upper plate and its corresponding flange on the lower plate.
4. The binding of claim 2 further comprising an aperture in each flange.
5. The binding of claim 4 further comprising a bolt extending upwardly through each aperture of each flange of the lower plate and being fixedly mounted thereto.
6. The binding of claim 5 wherein the bolt passes though the corresponding aperture of the upper plate, and further comprising an end cap attached to the distal end of the bolt.
7. The binding of claim 6 wherein the suspension system comprises a plurality of springs, one spring between each pair of flanges around each bolt.
8. The binding of claim 7 further comprising spring seats engaging each end of each spring.
9. The binding of claim 1 further comprising a pair of lateral brackets mounted on the top of the upper plate, one along each lateral edge, inside the laterally extending flanges.
10. The binding of claim 1 further comprising a boot attachment apparatus connected to the base plate structure.
11. The binding of claim 10 wherein the boot attachment apparatus comprises:
a heel portion;
a toe retainer apparatus;
a mid-boot retainer apparatus.
12. The binding of claim 11 wherein the toe retainer apparatus comprises a toe retainer, a strap connecting the toe retainer to the binding, and a tensioning and releasing buckle in the strap.
13. The binding of claim 12 wherein the mid-boot retainer apparatus comprises a mid-boot retainer, a strap connecting the mid-boot retainer to the binding, and a tensioning and releasing buckle in the strap.
14. The binding of claim 11 further comprising a pair of lateral brackets mounted on the top of the upper plate, one along each lateral edge, inside the laterally extending flanges.