1. A feedback control system for a power supply, comprising:
a feedback signal indicative of one or more parameters in the power supply for indicating operational conditions;
a compensation circuit coupled to the feedback signal and operable to condition the feedback signal to provide a power supply feedback control signal;
a response speed control circuit coupled to a parametric signal indicative of an operating condition of the power supply, and coupled to the compensation circuit and being operable to influence the compensation circuit to modify a response speed of the compensation circuit whereby the feedback control loop for the power supply has a modified response speed.
2. The circuit according to claim 1, wherein the parametric signal is the feedback signal.
3. The circuit according to claim 1, wherein the feedback signal is indicative of a transient when a transient occurs during operation of the power supply.
4. The circuit according to claim 1, wherein the response speed control circuit is operable to modify stability of the power supply feedback control loop.
5. The circuit according to claim 1, further comprising a switch coupled to the compensation circuit and operable by the response speed control circuit to modify a response speed of the compensation circuit.
6. The circuit according to claim 5, wherein operation of the switch produces a location change in a major low frequency pole in the compensation circuit.
7. The circuit according to claim 6, further comprising an electrical component coupled to the switch, whereby operation of the switch connects or disconnects the component to the compensation circuit.
8. The circuit according to claim 7, wherein the electrical component is a passive element.
9. The circuit according to claim 1, wherein response speed control circuit further comprises a reference comparison circuit operable with the parametric signal to determine if the parametric signal is beyond a given threshold.
10. The circuit according to claim 9, wherein the reference comparison circuit includes a comparator having a reference input and a parametric signal input and an output of the comparator indicating when the parametric signal has a value beyond that of the reference value.
11. The circuit according to claim 10, further comprising a second comparator with a second reference input and a parametric signal input and an output of the second comparator indicating when the parametric signal has a value beyond that of the second reference signal.
12. The circuit according to claim 9, wherein the reference comparison circuit exhibits hysteresis.
13. The circuit according to claim 1, wherein the response speed control circuit further comprises a counter operable to indicate a number of times the response speed control circuit is active to modify the response speed of the compensation circuit.
14. The circuit according to claim 13, wherein the counter further includes an output operable to influence the output of the response speed control circuit to disable modification of the response speed of the compensation circuit.
15. The circuit according to claim 14, further comprising a timer coupled to the counter and a response speed control signal, and operable to reset the counter when the response speed control signal is active for a predetermined time interval specified by the timer.
16. The circuit according to claim 15, wherein the response speed control signal indicates a disabled state based on the counter reaching a predetermined value.
17. A method for varying the response speed of a control loop in a power supply, comprising:
deriving a parametric signal based on operating parameters of the power supply;
determining whether the parametric signal is beyond a predetermined reference level; and
modifying a response speed of a compensation circuit influencing the parametric signal based on the outcome of the determination.
18. The method according to claim 17, further comprising modifying a major low frequency pole in the compensation circuit to modify the response speed of the compensation circuit.
19. The method according to claim 17, further comprising disabling the response speed modification based on criteria indicative of prior response speed modification activity.
20. The method according to claim 19, wherein the criteria includes a pulse count or a time interval.
21. A response speed controller for a power supply control loop comprising:
a compensation circuit in the control loop and applicable to condition a feedback signal for control of an input power converter;
an electric-component selectively coupled to the compensation circuit to selectively modify a major low frequency pole location in the compensation circuit to vary a response speed of the compensation circuit; and
a response speed controller operable to influence the selective coupling of the electrical component to the compensation circuit, the controller having a parametric signal input indicative of an operating condition of the power supply.
22. The circuit according to claim 21, wherein selectively coupling the electrical component to the compensation circuit modifies a stability characteristic of the power supply control loop.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A wafer container including a container body that having a plurality of slots therein for placing a plurality of wafers and an opening formed on a sidewall of said wafer container for exporting said plurality of wafers or importing said plurality of wafers, at least a pair of socket holes being disposed at the edge of said opening of said container body; and a door with an outer surface and an inner surface with at least a pair of latch holes corresponding to said pair of socket holes being disposed at the edge of said door, said door joining with said opening of said container body via said inner surface for protecting said plurality of wafers in said container body, the characteristic in that:
a recess is disposed on said inner surface of said door and located between two platforms, and in each of said platform is disposed with a latch component, said latch component including an oval cam, a pair of moving bars contacting two ends of said oval cam, at least one roller disposed in said platform of said door and fixed in a slide groove of said moving bars, and a locating spring being an integral part of said moving bars for controlling the turning of said oval cam to drive said moving bars to move to and fro between said pair of socket holes and said pair of latch holes.
2. The wafer container according to claim 1, wherein a locating roller is further disposed on one end of said moving bars and said locating roller contacts said oval cam.
3. The wafer container according to claim 1, wherein a plurality of locating grooves is further disposed on said oval cam.
4. The wafer container according to claim 1, wherein the material of said oval cam is selected from the group consisting of: the metal and the polymer plastic material.
5. The wafer container according to claim 1, wherein the material of said moving bars is selected from the group consisting of: the metal and the polymer plastic material.
6. The wafer container according to claim 1, wherein the material of said locating spring is selected from the group consisting of: the metal and the polymer plastic material.
7. The wafer container according to claim 1, wherein the material of said roller is selected from the group consisting of: metal and polymer plastic material.
8. The wafer container according to claim 1, wherein at least a restraint module is further disposed respectively on each of said two platforms.
9. The wafer container according to claim 8, wherein said plurality of restraint modules includes a base portion for fixing said restraint modules on said platforms with said base portion, and a plurality of curve portions is formed with a space at interval on a longer side of said base portion, a semicircle-like protruding portion being formed between each of said curve portions and its free-end, and a guide notch being disposed on each of said semicircle-like protruding portion of each of said restraint modules 30 for contacting wafers.
10. The wafer container according to claim 9, wherein a wear-resisting material is coated on contact area between said guide notch of said protruding portions and said wafer
11. The wafer container according to claim 8, wherein said plurality of restraint modules consist of a plurality of restraint components with a space at interval, and each of said restraint components is aligned with a restraint component of restraint module located on another side of said recess; each of said restraint component including a base portion which is fixed on said inner surface of said door, said plurality of base portion connecting to a curve portion on one side adjacent to said recess, each of said curve portion further extending to the central portion of said recess to form a bent arm, and said bent arm being disposed on a top of said recess.
12. The wafer container according to claim 11, wherein said restraint component is a springy component.
13. The wafer container according to claim 11, wherein a first contact head is formed where said bent arm and said curve portion cross, and a second contact head is formed on the free-end of said bent arm.
14. The wafer container according to claim 8, wherein said plurality of restraint modules consist of a plurality of restraint components in arrangement, and each of said restraint components is aligned with a restraint component of restraint module located on another side of said recess; each of said restraint component including a base portion with one end of said base portion fixed on said inner surface of said door and another end connecting to a first bent arm, said first bent arm having two free-ends with a first contact head formed at one of said two free-ends that is located farther from central part of said recess and the other of said two free-ends opposite to said first contact head further connecting a second bent arm, said second bent arm including a second contact head and a third contact head.
15. The wafer container according to claim 14, wherein a pivot is disposed between said two free-ends of said first bent arm and on one side of said inner surface.
16. The wafer container according to claim 15, wherein said pivot is fixed to said inner surface.
17. A wafer container including a container body that having a plurality of slots therein for placing a plurality of wafers and having an opening formed on a sidewall of said wafer container for exporting said plurality of wafers or importing said plurality of wafers, at least a pair of socket holes being disposed at the edge of said opening of said container body; and a door with an outer surface and an inner surface with at least a pair of latch holes corresponding to said pair of socket holes being disposed at the edge of said door, said door joining with said opening of said container body via said inner surface for protecting said plurality of wafers in said container body, the characteristic in that:
at least a latch component is disposed between said inner surface and said outer surface of said door, said latch component including an oval cam, a pair of moving bars contacting two ends of said oval cam, at least one roller disposed between said inner surface and said outer surface of said door and fixed in a slide groove of said moving bars, and a locating spring being an integral part of said moving bars for controlling the turning of said oval cam to drive said moving bars to move to and between said pair of socket holes and said pair of latch holes.
18. The wafer container according to claim 17, wherein a locating roller is further disposed on one end of said moving bars.
19. The wafer container according to claim 17, wherein a plurality of locating grooves is further disposed on said oval cam.
20. The wafer container according to claim 17, wherein the material of said oval cam is selected from the group consisting of metal and polymer plastic material.
21. The wafer container according to claim 17, wherein the material of said moving bars is selected from the group consisting of metal and polymer plastic material.
22. The wafer container according to claim 17, wherein the material of said locating spring is selected from the group consisting of metal and polymer plastic material.
23. The wafer container according to claim 17, wherein the material of said roller is selected from the group consisting of metal and polymer plastic material.
24. The wafer container according to claim 17, wherein at least a restraint module is further disposed on said inner surface of said door.