1. A method of manufacturing a printed circuit board, the method comprising:
providing a substrate having a pad formed thereon;
forming a resist on the substrate, the resist having an opening formed therein such that the pad is exposed;
forming a metal post inside the opening such that the metal post is electrically connected to the pad;
forming a through-hole in the resist by removing a portion of the resist such that the through-hole surrounds the metal post; and
forming a solder layer inside the through-hole and on an upper surface of the metal post so as to cover an exposed surface of the metal post.
2. The method of claim 1, wherein the forming of the through-hole is performed by a laser.
3. The method of claim 1, wherein the forming of the metal post is performed by way of plating.
4. The method of claim 3 further comprising, prior to the forming of the metal post, forming a seed layer on the pad.
5. The method of claim 1 further comprising, after the forming of the solder layer, flattening an upper surface of the solder layer such that the upper surface of the solder layer becomes level.
6. A printed circuit board comprising:
a substrate having a pad formed therein;
a metal post formed on the pad such that the metal post is electrically connected to the pad;
a solder layer formed on a side of the metal post and an upper surface of the metal post so as to cover an exposed surface of the metal post.
7. The printed circuit board of claim 6, further comprising a seed being interposed between the pad and the metal post.
8. The printed circuit board of claim 6, wherein an upper surface of the solder layer is a planar surface.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A backstop comprising:
(a) a backstop frame;
(b) a net attached to the backstop frame;
(c) a strike zone comprised of collapsible material attached to the net by means allowing changes to the acoustical responses generated when the strike zone is struck;
(d) four or more vertical large diameter hollow supports that accept four or more vertical smaller diameter net holders, creating 2 finished vertical net supports;
(e) a net attached to the four vertical smaller diameter net holders;
(f) one or more ropes attached to the ground and to the finished vertical net supports; and
(g) one or more base pieces secured to the bottom of each finished vertical net support.
2. The backstop of claim 1, comprising means for attaching the net to the backstop frame allowing changes to the acoustical responses generated when the net is struck.
3. The backstop of claim 2, comprising two foul line ropes attached to the backstop.
4. The backstop of claim 3, comprising base markers attached to the foul line ropes.
5. The backstop of claim 4, comprising a carrying bag able to enclose the backstop frame, net, strike zone, strike zone holder, foul line ropes and base markers.
6. The backstop of claim 1, comprising finished vertical net supports having top caps with one or more openings allowing rope to pass through the top caps.
7. The backstop of claim 6, comprising a strike zone attached to a solid, single piece fastener which attaches into the backstop net.
8. The backstop of claim 7 comprising one or more tension cords attached to the strike zone and net, by means allowing adjustment to the acoustical responses generated when the strike zone is struck.
9. The backstop of claim 8 further comprising one or more tension cords attached to the net and backstop frame by means allowing adjustment to the acoustical responses generated when the net is struck.
10. The backstop of claim 9, for use with balls weighing less than 5 ounces.