1. A semiconductor memory device comprising:
a first memory block of a first type of memory; and
a second memory block of a second type of memory having a different type from the first type, wherein the first and second memory blocks are integrated in a unitary die;
wherein a first address region of the first memory block and a second address region of the second memory block are included in the same address domain,
wherein each of the first and second memory blocks is accessed by an address signal including an address of the address domain, and
wherein the second memory block is a nonvolatile memory.
2. The device of claim 1, wherein the same address domain refers to a set of consecutive addresses, wherein the addresses of the second address region immediately follow the addresses of the first address region.
3. The device of claim 1, wherein the first and second memory blocks are each driven by different AC parameters.
4. The device of claim 1, wherein the first memory block is configured as a system operating memory.
5. The device of claim 1, wherein the first memory block is a volatile memory.
6. The device of claim 5, wherein the first memory block includes a DRAM.
7. The device of claim 1, wherein the second memory block is configured as a memory for storing data.
8. The device of claim 1, wherein the nonvolatile memory includes one of a flash memory device, a Ferroelectric Random Access Memory (FeRAM), a Phase-change Random Access Memory (PRAM), and a Magnetic Random Access Memory (MRAM).
9. A computer system comprising:
a semiconductor memory device including a first memory block and a second memory block that has different operational characteristics from the first memory block;
a memory controller configured to access the first and second memory blocks by an address signal; and
a central processing unit configured to, by way of the memory controller, allocate a memory space to the first memory block for system management and allocate a memory space to the second memory block for data storage,
wherein the first and second memory blocks are integrated in a unitary die.
10. The computer system of claim 9, wherein an address region of the semiconductor memory device includes a first address region for accessing the first memory block and a second address region for accessing the second memory block.
11. The computer system of claim 9, wherein the first and second memory blocks are each driven by different AC parameters.
12. The computer system of claim 9, wherein the second memory block is a nonvolatile memory.
13. The computer system of claim 12, wherein the nonvolatile memory includes one of a flash memory device, a Ferroelectric Random Access Memory (FeRAM), a Phase-change Random Access Memory (PRAM), and a Magnetic Random Access Memory (MRAM).
14. A memory access method in a semiconductor memory device that includes a first memory block of a first type of memory on a die and a second memory block of a second type of memory having a different type from the first type on the same die, the memory access method comprising:
accessing a first address region of the first memory block by a first address signal including a first address;
accessing a second address region of the second memory block by a second address signal including a second address, wherein:
the first address and second address are part of the same address domain, and
the second memory block is a nonvolatile memory.
15. The method of claim 14, wherein:
the first memory block is a volatile memory.
16. The method of claim 15, further comprising:
using the first memory block as a memory space for managing a computer system; and
using the second memory block as a memory space for storing data.
17. The method of claim 14, wherein the same address domain includes a set of consecutive addresses, wherein the addresses of the second address region immediately follow the addresses of the first address region.
18. The method of claim 14, further comprising:
applying first AC parameters to the first address region; and
applying second AC parameters to the second address region, the second AC parameters different from the first AC parameters.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A process for preparing a polybromoaryl ether comprising:
(A) adding to a solvent for the polybromoaryl ether a mixture of:
(1) at least one compound of the structure
HO\u2014Ar\u2014X1X2X3X4X5\u2003\u2003(I)
wherein Ar is an aryl group and X1 X2 X3 X4 and X5 are independently selected from the group consisting of hydrogen and bromine, provided that at least one of X1 X2 X3 X4 and X5 is bromine,
(2) at least one alkali or alkaline metal hydroxide, and
(3) at least one polymerization initiator,
wherein said solvent for the polybromoaryl ether is a non-solvent for alkali or alkaline metal bromides;
(B) mixing the materials prepared in (A) to polymerize compound I and form the polybromoaryl ether and at least one alkali or alkaline metal bromide by-product;
(C) quenching the polymerization of compound I; and then
(D) separating the insoluble alkali or alkaline metal bromide by-product using filtration from the soluble polybromoaryl ether.
2. The process of claim 1 wherein said solvent is tetrahydrofuran.
3. The process of claim 1 wherein:
said solvent is from about 100 wt % to 600 wt % tetrahydrofuran as based on compound I;
said alkali metal hydroxide is from about 100 mol % to 120 mol % sodium hydroxide as based on compound I; and
said polymerization initiator is from about 0.1 mol % to 30 mol % benzoyl peroxide as based on compound I.
4. The process of claim 1 wherein from 30.0 mol % to 0.5 mol % of benzoyl peroxide is reacted to result in said polybromoaryl ether having a molecular weight ranging from 4,000 to 62,000 Daltons.
5. The process of claim 1 wherein from 3.0 mol % to 1.0 mol % of benzoyl peroxide is reacted to result in said polybromoaryl ether having a molecular weight ranging from 15,000 to 40,000 Daltons.