1. A process for functionalizing or modifying compounds or surfaces having at least one group which is reactive toward isocyanate, by reacting a compound of the formula 1
OCN\u2014R1\u2014NHCOX\u2014R2\u2014(Y)n\u2003\u2003(1)
where R1 and R2 are each a substituted or unsubstituted, linear or branched saturated or unsaturated alkylene radical having from 1 to 20 carbon atoms, a substituted or unsubstituted, saturated or unsaturated cycloalkylene radical having from 3 to 20 carbon atoms, a substituted or unsubstituted arylene radical having from 3 to 20 carbon atoms, an arylenealkylene radical having from 4 to 20 carbon atoms, a heterocyclic radical or any linear or branched sequence of two or more of the radicals mentioned, if desired linked via ether, thioether, ester amine or amide structures, X is a covalent bond to R2 or O, S or NR3, where R3 is a hydrogen atom or a substituted or unsubstituted, linear or branched, saturated or unsaturated alkyl radical having from 1 to 20 carbon atoms, a substituted or unsubstituted, saturated or unsaturated cycloalkyl radical having from 3 to 20 carbon atoms, a substituted or unsubstituted aryl radical having from 3 to 20 carbon atoms, a heterocyclic radical or any linear or branched sequence of two or more of the radicals mentioned, Y is a hydrogen atom or a free functional group selected from the group consisting of hydroxyl, amino, amido, carbonyl, carboxyl, mercapto, sulfonyl, sulfinyl, sulfenyl, sulfate, nitro, nitrile, isonitrile, cyanate, silyl, silanyl, phosphine, phosphate, phosphite, phosphonate, acrylate, methacrylate, allyl, and vinyl and mixtures thereof and n is an integer from 1 to 20,
with at least one isocyanate-reactive group of a compound having at least one isocyanate-reactive group, which group reacts with the OCN\u2014R1-moiety of the compound of the formula (1) wherein Y is retained as a hydrogen atom or a free functional group selected from the group consisting of hydroxyl, amino, amido, carbonyl, carboxyl, mercapto, sulfonyl, sulfinyl, sulfenyl, sulfate, nitro, nitrile, isonitrile, cyanate, silyl, silanyl, phosphine, phosphate, phosphite, phosphonate, acrylate, methacrylate, allyl, and vinyl and mixtures thereof or with at least one isocyanate-reactive group on a surface which has at least one isocyanate-reactive group, which group reacts with the OCN\u2014R1- moiety of the compound of the formula (1) wherein Y is retained as a hydrogen atom or a free functional group selected from the group consisting of hydroxyl, amino, amido, carbonyl, carboxyl, mercapto, sulfonyl, sulfinyl, sulfenyl, sulfate, nitro, nitrile, isonitrile, cyanate, silyl, silanyl, phosphine, phosphate, phosphite, phosphonate, acrylate, methacrylate, allyl, and vinyl and mixtures thereof.
2. A process as claimed in claim 1, wherein the compound which has at least one group which is reactive toward isocyanate is a monomer, polymer, dendrimer, hyperbranched polymer or star polymer containing at least one group which is reactive toward isocyanate.
3. A process as claimed in claim 1, wherein the surface which has at least one group which is reactive toward isocyanate is a surface of wood, glass, textiles, ceramic materials, leather, paper, plastic, stone, concrete, metals or metal alloys, with the proviso that these surfaces have at least one group which is reactive toward isocyanate.
4. A process as claimed in claim 1, wherein the group which is reactive toward isocyanate is selected from the group consisting of hydroxyl, amino, amido, carboxyl and mercapto and mixtures thereof.
5. A process as claimed in claim 2, wherein the group which is reactive toward isocyanate is selected from the group consisting of hydroxyl, amino, amido, carboxyl and mercapto.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for preparing a mold, comprising:
coating a chemical amplification resist composition on a substrate to form a resist film,
performing pattern drawing with an electron beam,
performing development with a developer to form a resist pattern;
performing an etching treatment to the substrate having thereon the thus-formed resist pattern by using the resist pattern as a mask to form a concave-convex structure on the substrate,
wherein
the chemical amplification resist composition comprises:
(A) a resin capable of decomposing by an action of an acid to increase the solubility of the resin (A) in an alkali developer,
wherein the resin (A) has a group represented by the following formula (I) or (II):
wherein each of R1 and R2 independently represents a hydrogen atom or an alkyl group;
W represents a divalent organic group; and
R3 represents an alkyl group, a cycloalkyl group, an aryl group or an aralkyl group:
wherein R1, R2 and W have the same meanings as those in formula (I); and
R4 represents a cycloalkyl group or an aryl group.
2. The method for preparing a mold according to claim 1,
wherein the mold is a mold used for forming a semiconductor microcircuit.
3. The method for preparing a mold according to claim 1,
wherein the resin (A) in the chemical amplification resist composition contains a repeating unit represented by the following formula (III):
wherein each of R3 to R5 independently represents a hydrogen atom, a fluorine atom, a chlorine atom, a cyano group or an alkyl group;
X1 represents a group capable of leaving by an action of an acid; and
L represents a single bond or a divalent linking group.
4. The method for preparing a mold according to claim 1, wherein the chemical amplification resist composition further comprises:
(B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation,
wherein the compound (B) contains a compound capable of generating an acid represented by the following formula (a):
wherein each of R1a, R2a and R1a independently represents an alkyl group or a cycloalkyl group; and
M represents a single bond or a divalent linking group.
5. The method for preparing a mold according to claim 1,
wherein the resin (A) in the chemical amplification resist composition has the group represented by formula (I), and R3 represents an aryl group or an aralkyl group.
6. The method for preparing a mold according to claim 1, wherein the resin (A) contains a repeating unit having a lactone structure.
7. The method for preparing a mold according to claim 1, wherein the chemical amplification resist composition further comprises:
(B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation,
and the content of the compound (B) is from 3 to 30 mass % based on the entire solids content of the chemical amplification resist composition.
8. The method for preparing a mold according to claim 7,
wherein the content of the compound (B) is from 5 to 25 mass % based on the entire solids content of the chemical amplification resist composition.
9. The method for preparing a mold according to claim 1,
wherein the resin (A) in the chemical amplification resist composition further contains at least one repeating unit selected from the group consisting of the following formulae (IV) to (VI):
wherein each of R04, R05 and R07 to R09 independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group or an alkoxycarbonyl group;
R06 represents a cyano group, a carboxyl group, \u2014CO\u2014OR25 or \u2014CO\u2014N(R26)(R27), wherein R26 and R27 may combine with each other to form a ring together with the nitrogen atom;
each of X1 to X3 independently represents a single bond, an arylene group, an alkylene group, a cycloalkylene group, \u2014O\u2014, \u2014SO2\u2014, \u2014CO\u2014, \u2014COO\u2014, \u2014N(R33)\u2014 or a divalent linking group formed by combining a plurality of these groups;
R25 represents an alkyl group, a cycloalkyl group, an alkenyl group, an aryl group or an aralkyl group;
each of R26, R27 and R33 independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an alkenyl group, an aryl group or an aralkyl group; and
B represents a structural moiety capable of decomposing upon irradiation with an actinic ray or radiation to produce an acid.
10. The method for preparing a mold according to claim 9,
wherein B in formulae (IV) to (VI) is a structure represented by the following formula (ZI\u2032) or (ZII\u2032):
wherein each of R201, R202 and R203 independently represents an organic group, two members out of R201 to R203 may combine with each other to form a ring structure, and the ring may contain an oxygen atom, a sulfur atom, an ester bond, an amide bond or a carbonyl group;
each of R204 and R205 independently represents an aryl group, an alkyl group or a cycloalkyl group; and
Z\u2212 represents an acid anion that is generated by decomposition upon irradiation with an actinic ray or radiation.
11. The method for preparing a mold according to claim 10,
wherein the acid anion Z\u2212 in formulae (ZI\u2032) and (ZII\u2032) is an acid anion corresponding to an aliphatic sulfonate anion substituted with a fluorine atom at the \u03b1-position, an aromatic sulfonate anion substituted with a fluorine atom or a fluorine atom-containing group, a bis(alkylsulfonyl)imide anion in which the alkyl group is substituted with a fluorine atom, or a tris(alkylsulfonyl)methide anion in which the alkyl group is substituted with a fluorine atom.
12. The method for preparing a mold according to claim 1, wherein the chemical amplification resist composition further comprises:
(C) an organic basic compound.
13. The method for preparing a mold according to claim 12,
wherein the organic basic compound (C) is a compound having an onium hydroxide structure.
14. The method for preparing a mold according to claim 13,
wherein the compound having an onium hydroxide structure is a tetraalkylammonium hydroxide.
15. The method for preparing a mold according to claim 1, wherein the resin (A) in the chemical amplification resist composition has a group represented by formula (II).
16. The method for preparing a mold according to claim 15, wherein W in formula (II) represents an alkylene group.
17. The method for preparing a mold according to claim 15, wherein W in formula (II) represents a linear alkylene group.
18. The method for preparing a mold according to claim 15, wherein R4 in formula (II) represents a cycloalkyl group.
19. The method for preparing a mold according to claim 15, wherein R4 in formula (II) represents a polycyclic cycloalkyl group.