1. A semiconductor device comprising:
a first resin film having a through hole penetrating from a first major surface to a second major surface thereof;
an organic semiconductor disposed inside the through hole, the organic semiconductor being formed along a wall surface of the through hole and having a hollow space;
an insulating film on the upper surface of the organic semiconductor located at the first major surface side;
a gate electrode on the insulating film, the gate electrode being inflexed to lie along a wall surface of the hollow space of the organic semiconductor, the inflexed gate electrode having a hollow space on a side opposite to the insulating film;
a source electrode connected electrically to the lower surface of the organic semiconductor located at the second major surface side; and
a drain electrode connected electrically to the lower surface of the organic semiconductor.
2. The semiconductor device according to claim 1, further comprising a second resin film bonded to the second major surface of the first resin film.
3. The semiconductor device according to claim 2, wherein the second resin film has a second through hole and a via conductor formed from an electrically conductive composite material in the second through hole.
4. The semiconductor device according to claim 2, wherein the organic semiconductor is sealed by the source electrode, the drain electrode, the insulating film and the second resin film.
5. The semiconductor device according to claim 1, wherein the source electrode and the drain electrode have comb shape and are disposed to oppose each other at a distance so as to mesh with each other.
6. The semiconductor device according to claim 1, wherein the insulating layer is located in the through hole.
7. The semiconductor device according to claim 1, wherein the inflexed gate electrode has a convex surface on the first major surface side.
8. The semiconductor device according to claim 1, wherein the hollow space of the organic semiconductor is filled with the gate electrode.
9. The semiconductor device according to claim 8, wherein the insulating film extends over the first major surface of the first resin film.
10. The semiconductor device according to claim 1, wherein the organic semiconductor is a high molecular organic semiconductor.
11. The semiconductor device according to claim 1, wherein the organic semiconductor is a low molecular organic semiconductor.
12. The semiconductor device according to claim 1, wherein the first resin film is formed from any one material selected from the group consisting of a polyimide resin, a polyamide resin, a polyethylene naphthalate resin and an aramid resin.
13. The semiconductor device according to claim 1, wherein the source electrode and the drain electrode are formed from a noble metal.
14. An image display apparatus comprising a display section having an array of light emitting elements and a drive circuit layer for driving the light emitting elements used in the display section, wherein the drive circuit layer includes the semiconductor device according to claim 1.
15. The image display apparatus according to claim 14, wherein the semiconductor element of the semiconductor device is an ONOFF switching transistor.
16. The image display apparatus according to claim 14, wherein the semiconductor element of the semiconductor device is a driver transistor for driving the light emitting element to emit light.
17. The image display apparatus according to 14, wherein the light emitting element is an organic electroluminescence element.
18. A method for manufacturing a semiconductor device, the method comprising:
(1) forming a source electrode and a drain electrode on one surface of a first resin film and forming a through hole in the first resin film, the source electrode and the drain electrode being located on the bottom of the through hole;
(2) forming an organic semiconductor in the through hole such that one end of the organic semiconductor contacts the source electrode and the drain electrode, the organic semiconductor being formed along the wall surface of the through hole and having a hollow space;
(3) forming an insulating layer on the other end of the organic semiconductor, a part of the insulating layer for serving as a gate insulating film; and
(4) forming a gate electrode on the section for serving as the gate insulating film of the insulating layer, the gate electrode being inflexed to lie along a wall surface of the hollow space of the organic semiconductor, the inflexed gate electrode having a hollow space on a side opposite to the insulating film.
19. The method of claim 18, wherein said step (1) includes disposing the one surface of the first resin film on the surface of a second resin film having the source electrode and the drain electrode disposed thereon.
20. The method of claim 19, wherein the surface of the second resin film having the source electrode and the drain electrode is a first surface, and the second resin film further includes a second surface, and
wherein the second resin film comprises a wiring layer disposed on the second surface, and a via conductor for allowing the wiring layer to conduct with the source electrode or the drain electrode.
21. The method of claim 18, wherein the inflexed gate electrode has a convex surface on the first major surface side.
22. The method of claim 18, wherein the insulating layer and the gate electrode are formed successively so as to fill the hollow space.
23. The method of claim 22, wherein the insulating layer extends over the other surface of the first resin film.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method, comprising:
maintaining payment account information by using a payment application in a mobile device memory included in a mobile device, wherein the payment application is not browser based and is a mobile operating system platform based mobile application preinstalled or downloaded and installed on the mobile device, the mobile device comprising a mobile device display, a mobile device processor, a mobile device radio interface, and a mobile device wireless fidelity (Wi-Fi) interface;
receiving input from a user at the mobile device to purchase an item selected at the mobile device;
sending a request for a digital artifact for display within a specific payment application generated screen to a management server, the payment application screen corresponding to a specific screen, scene, or real estate property, wherein the management server maintains plurality of user profiles and promotions and selects the digital artifact based on correlating two or more targeting parameters from personal information and transaction history for the user;
receiving the digital artifact from the management server;
displaying the digital artifact within the specific payment application generated screen, wherein the payment application screen corresponds to a specific screen, scene, or real estate property;
wirelessly transmitting authentication information to the management server, the management server configured to process a transaction using a default payment method; and
receiving response information at the mobile device from the management server.
2. The method of claim 1, wherein a data exchange between the payment application and the management server has already occurred, wherein the management server permits a user associated with the payment application running on the mobile device to conduct an online transaction as a result of the data exchange.
3. The method of claim 2, wherein the data exchange includes exchanging an identification code.
4. The method of claim 3, wherein the identification code is a personal identification number (PIN).
5. The method of claim 1, wherein coupons are redeemed during the transaction.
6. The method of claim 1, wherein a shopping list maintained by the payment application is applied during the transaction.
7. The method of claim 1, wherein the digital artifact is an advertisement, receipt, ticket, coupon, media, or content received at the payment application.
8. The method of claim 1, wherein the digital artifact is based on user profile information andor a transaction history associated with the user.
9. The method of claim 1, wherein the mobile device has a secure element, the secure element including a secure element processor configured for near field communication transaction processing, a secure element memory configured to maintain a secure element application, and a secure element near field communication transceiver.
10. The method of claim 1, wherein the payment application displays transaction history, receipts, and payment accounts.
11. A mobile device, comprising:
a mobile device memory included in the mobile device, the mobile device memory configured to maintain payment account information by using a payment application, wherein the payment application is not browser based and is a mobile operating system platform based mobile application preinstalled or downloaded and installed on the mobile device;
a mobile device wireless fidelity (Wi-Fi) interface;
a mobile device processor configured to receive a digital artifact from a management server;
a mobile device input interface configured to receive input from a user to purchase an item selected at the mobile device;
a mobile device output interface configured to send a request for a digital artifact for display within a specific payment application generated screen to a management server, the payment application screen corresponding to a specific screen, scene, or real estate property, wherein the management server maintains plurality of user profiles and promotions and selects the digital artifact based on correlating two or more targeting parameters from personal information and transaction history for the user, wherein the digital artifact is received from the management server;
a mobile device display configured to present the digital artifact within the specific payment application generated screen, wherein the payment application screen is a specific screen, scene, or real estate property; and
a mobile device radio transceiver configured to wirelessly transmit authentication information to the management server, the management server configured to process a transaction using a default payment method, wherein response information is received at the mobile device from the management server.
12. The mobile device of claim 11, wherein a data exchange between the payment application and the management server has already occurred, wherein the management server permits a user associated with the payment application running on the mobile device to conduct an online transaction as a result of the data exchange.
13. The mobile device of claim 12, wherein the data exchange includes exchanging an identification code.
14. The mobile device of claim 13, wherein the identification code is a personal identification number (PIN).
15. The mobile device of claim 11, wherein coupons are redeemed during the transaction.
16. The mobile device of claim 11, wherein a shopping list maintained by the payment application is applied during the transaction.
17. The mobile device of claim 11, wherein the digital artifact is an advertisement, receipt, ticket, coupon, media, or content received at the payment application.
18. The mobile device of claim 11, wherein the digital artifact is based on user profile information andor a transaction history associated with the user.
19. The mobile device of claim 11, wherein the mobile device has a secure element, the secure element including a secure element processor configured for near field communication transaction processing, a secure element memory configured to maintain a secure element application, and a secure element near field communication transceiver.
20. The mobile device of claim 11, wherein the payment application displays transaction history, receipts, and payment accounts.