What is claimed is:
1. A dosage form comprising (a) a gelatin capsule containing a liquid, active agent formulation; (b) a multilayer wall superposed on the gelatin capsule comprising, in outward order from the capsule: (i) a barrier layer, (ii) an expandable layer, and (iii) a semipermeable layer; and (c) an orifice formed or formable through the wall.
2. The dosage form of claim 1 wherein the expandable layer is hydro-activated.
3. The dosage form of claim 3 wherein the expandable layer is an osmotic layer.
4. The dosage form of claim 2 wherein the barrier layer is impermeable to water.
5. The dosage form of claim 1 wherein the barrier layer is formed as a coating on the gelatin capsule.
6. The dosage form of claim 5 wherein the expandable layer is formed as an osmotic layer coated on the barrier layer.
7. The dosage form of claim 6 wherein the semipermeable layer is formed as a coating on the osmotic layer.
8. A method of converting a gelatin capsule containing a liquid active agent formulation into a controlled release dosage form which comprises forming a composite wall over the gelatin capsule by sequentially forming a barrier layer on the external surface of the gelatin capsule, an expandable layer over the barrier layer and a semipermeable layer over the expandable layer.
9. The method of claim 8 wherein at least one of the forming steps comprises a coating step.
10. The method of claim 8 which comprises forming an exit orifice in the wall by sequentially forming an opening in the wall having a diametric dimension greater than the final diameter of the exit orifice and filling the opening with a material in which the exit orifice may be formed.
11. A method of manufacturing a controlled release dosage form comprising a gelatin capsule containing a liquid active agent formulation, which method comprises the steps of (1) forming a barrier layer surrounding the gelatin capsule; (2) forming an expandable layer surrounding the barrier layer-gelatin capsule; (3) removing a portion of the expandable layer in an area in which an exit orifice is to be located without compromising the integrity of the barrier layer in the area; (4) forming a semipermeable layer surrounding the intermediate dosage form prepared through step (4); and forming an exit orifice in the area exposing at least a portion of the gelatin capsule.
12. The dosage form of claim I wherein the barrier layer forms a seal between the expandable layer and the environment at the exit orifice.
13. A dosage form comprising a gelatin capsule containing a liquid, active agent formulation, the gelatin capsule being surrounded by a barrier layer contacting the external surface of the gelatin capsule, an expandable layer contacting at least a portion of the barrier layer, a semipermeable layer surrounding at least the expandable layer, and an exit orifice formed or formable in the dosage form extending from the external surface of the gelatin capsule to the environment of use.
14. The dosage form of claim 13 wherein the expandable layer is in one or more discrete sections.
15. The dosage form of claim 13 wherein the expandable layer is in two discrete sections which are applied individually to the respective ends of the capsule.
16. The dosage form of claim 1 wherein the active agent is selected from the group consisting of acetaminophen, cyclosporin, ethchlorvynol, nifedipine, etoposide, digoxin, ranitidine hydrochloride, calcifediol, ethosuximide, calcitriol, paclitaxel, valproic acid, tretinoin, isotretinoin, indinavir, lamivudine, stavudine, nelfinavir mesylate, saquinavir mesylate, ritonavir, zidovudine, didanosine, nevirapine, ganciclovir, zalcitabine, fluoexetine, sertraline, paroxetine, bupropion, nefazodone, mirtazpine, mianserin, zanamivir, olanzapine, risperidone, quetiapine fumurate, buspirone, alprazolam, lorazepam, clorazepate dipotassium, clozapine, sulpiride, amisulpride, methylphenidate, and pemoline and pharmaceutically-acceptable salts and esters thereof.
17. The dosage form of claim I wherein the active agent comprises cyclosporin.
18. The dosage form of claim 1 wherein the active agent comprises acetaminophen.
19. The dosage form of claim 1 wherein the active agent comprises isotretinoin.
20. The dosage form of claim 1 wherein the active agent comprises valproic acid.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A midplane circuit board for forming an orthogonal interconnection between two daughtercards, said midplane circuit board comprising:
a first mating surface having a first linear array of vias disposed in a first direction;
a second mating surface having a second linear array of vias disposed in a second direction that is orthogonal to said first direction; and
one or more signal vias that is offset from a centerline of said first linear array of vias andor a centerline of said second linear array of vias.
2. The midplane circuit board of claim 1, wherein said first linear array of vias further comprises:
a first signal via of a first differential signal pair;
a first ground via;
wherein said second linear array of vias further comprises:
a first signal via of a second differential signal pair;
a second ground via; and
wherein said one or more offset signal vias further comprises:
a second signal via of said first differential signal pair andor a second signal via of said second differential signal pair.
3. The midplane circuit board of claim 1, further comprising:
a first pair of ground vias, wherein said first pair of ground vias forms said centerline of first linear array of vias;
a second pair of ground vias, wherein said second pair of ground vias forms said centerline of said second linear array of vias;
one or more of said signal vias of said a first differential signal pair of electrically conductive vias is offset from said first via array centerline; and
one or more of said signal vias of said second differential signal pair of electrically conductive vias is offset from said second via array centerline.
4. The midplane circuit board of claim 1, further comprising an elongate pad on at least one mating surface of said midplane circuit board, wherein said elongate pad is electrically connected to one offset signal via, and wherein said elongate pad is adapted to make electrical contact with a surface-mount contact.
5. The midplane circuit board of claim 1, further comprising:
a first elongate pad on said first mating surface of said midplane circuit board, wherein said first elongate pad extends from one of said signal vias in a first direction; and
a second elongate pad on said second mating surface of said midplane circuit board, wherein said second elongate pad extends from the same signal via as said first elongate pad, and wherein said second elongate pad extends in a second direction that is generally orthogonal to said first direction of said first elongate pad.
6. The midplane circuit board of claim 1, further comprising a shared via, wherein said first signal via of said first differential pair of signal vias of said first linear array and said first signal via of said second differential pair of signal vias of said second linear array comprise said shared signal via, wherein said shared signal via is lies in said first linear array and said second linear array.
7. A circuit board having a plurality of electrical signaling paths for electrically coupling electrical contacts through said circuit board, said circuit board comprising:
a first electrical signaling path for receiving a through-mount electrical contact;
a second electrical signaling path for receiving a surface-mount electrical contact.
8. The circuit board of claim 7, wherein:
said first electrical signaling path further comprises a first signal via adapted to receive a press-fit electrical contact; and
said second electrical signaling path further comprises a second signal via adapted to receive a J-lead electrical contact.
9. The circuit board of claim 8, wherein said second electrical signaling path further comprises:
a signal via extending from a first side to a second side of said circuit board;
a first elongate pad disposed on a first side of said circuit board, said first elongate pad electrically connected to said signal via and extending in a first direction; and
a second elongate pad disposed on said second side of said circuit board, said second elongate pad electrically connected to said same signal via as said first elongate pad, and said second elongate pad extending in a second direction that is orthogonal to said first direction of said first elongate pad.
10. The circuit board of claim 7, wherein said electrical signaling paths comprise one or more of: one or more differential signaling paths, one or more single-ended signaling paths, and combinations of differential signaling paths and single-ended signaling paths.
11. A midplane circuit board for forming an orthogonal interconnection between two daughtercards, said midplane circuit board comprising:
a first mating surface having a first plurality of electrically conductive vias defining a first footprint;
a second mating surface having a second plurality of electrically conductive vias defining a second footprint;
a trace extending between and electrically connecting one of said first plurality of electrically conductive vias to a respective one of said second plurality of electrically conductive vias so that two substantially similar electrical connectors can be received on said first mating surface and said second mating surface of said midplane circuit board and differential signals can pass from said first mating surface to said second mating surface.
12. The midplane circuit board of claim 11, wherein said one or more traces are located on said first mating surface andor on said second mating surface, andor between said first mating surface and said second mating surface.
13. The midplane circuit board of claim 11, further comprising one or more partial signal vias, wherein said one or more partial signal vias comprise signal vias that do not extend all the way through said midplane circuit board from said first mating surface to said second mating surface andor from said second mating surface to said first mating surface.
14. The midplane circuit board of claim 11, further comprising one or more shared signal vias, wherein said one or more shared signal vias comprise signal vias adapted to receive a contact from respective electrical connectors connected to each mating surface of said midplane circuit board.
15. The midplane circuit board of claim 11, wherein said midplane circuit board further comprises:
a first differential signal pair of electrically conductive vias disposed in a first direction, said first differential signal pair of electrically conductive vias extending from said first mating surface toward said second mating surface;
a second differential signal pair of electrically conductive vias disposed in a second direction that is generally orthogonal to said first direction, said second differential signal pair of electrically conductive vias extending from said second mating surface toward said first mating surface.
16. The midplane circuit board of claim 15, wherein:
said first differential signal pair of electrically conductive vias further comprises a first signal via and a second signal via;
said second differential signal pair of electrically conductive vias further comprises a third signal via and a fourth signal via, wherein said third signal via and said fourth signal via are offset from said first signal via and said second signal via;
a first trace extending between and electrically connecting said first signal via and said third signal via; and
a second trace extending between and electrically connecting said second signal via and said fourth signal via.
17. The midplane circuit board of claim 15, wherein:
said first differential signal pair of electrically conductive vias further comprises a first signal via and a second signal via;
said second differential signal pair of electrically conductive vias further comprises said second signal via and a third signal via;
wherein said second signal via comprises a shared signal via adapted to receive a contact from respective electrical connectors connected to each mating surface of said midplane circuit board; and
wherein said third signal via is offset from said first signal via.
18. The midplane circuit board of claim 15, further comprising:
a first ground via disposed adjacent to said first differential signal pair of electrically conductive vias along said first direction;
a second ground via disposed adjacent to said second differential signal pair of electrically conductive vias along said second direction; and
a trace extending between and electrically connecting said first ground via and said second ground via.
19. The midplane circuit board of claim 15, further comprising:
a first pair of ground vias, wherein one or more of said signal vias of said first differential signal pair of electrically conductive vias is located in between said first pair of ground vias;
a second pair of ground vias, wherein one or more of said signal vias of said second differential signal pair of electrically conductive vias is located in between said second pair of ground vias; and
traces extending between and electrically connecting said first pair of ground vias and said second pair of ground vias.
20. The midplane circuit board of claim 19, further comprising one or more offset signal vias, wherein an offset signal via is a signal via that is offset from a respective linear array of vias.
21. The midplane circuit board of claim 15, further comprising:
a first pair of ground vias, wherein said first differential signal pair of electrically conductive vias is associated with said first pair of ground vias, wherein said first pair of ground vias define a first linear array, wherein said first differential signal pair of electrically conductive vias is offset from said first linear array; and
a second pair of ground vias, wherein said second differential signal pair of electrically conductive vias is associated with said second pair of ground vias, wherein said second pair of ground vias define a second linear array that is generally orthogonal to said first linear array, wherein said second differential signal pair of electrically conductive vias is offset from said second linear array; and
traces extending between and electrically connecting said first pair of ground vias and said second pair of ground vias.
22. The midplane circuit board of claim 15, wherein:
each of said differential signal pairs of electrically conducting vias further comprises at least one positive signal path and at least one negative signal path through said midplane;
wherein at least one of said positive signal path and said negative signal path is offset and does not pass straight through said midplane circuit board.
23. The midplane circuit board of claim 11, wherein:
said first plurality of electrically conductive vias further comprises a plurality of differential signal pair of electrically conductive vias and a ground via arranged in a first linear array of vias, wherein said first linear array of vias comprises a repeating pattern of two signal vias and a ground via; and
said second plurality of electrically conductive vias further comprises a plurality of differential signal pair of electrically conductive vias and a ground via arranged in a second linear array of vias, wherein said second linear array of vias comprises a repeating pattern of two signal vias and a ground via, wherein said second linear array of vias is orthogonal to said first linear array of vias.
24. A midplane circuit board for an orthogonal connector system comprising:
a first signal via disposed within a first column of electrically conductive vias, said first column being disposed on a first side of said midplane circuit board in a first direction;
a second signal via disposed within a second column of electrically conductive vias, said second column being disposed on a second side of said midplane circuit board in a second direction that is generally orthogonal to said first direction;
wherein said first signal via is offset from and electrically connected to said second signal via to form a signaling path through said midplane circuit board.
25. The midplane circuit board of claim 24, further comprising:
a plurality of columns of electrically conductively vias arranged parallel to one another in said first direction on said first side of said midplane circuit board;
a plurality of columns of electrically conductively vias arranged parallel to one another in said second direction on said second side of said midplane circuit board;
wherein one or more of said signal vias in said columns on said first side fall outside said columns of signal vias on said second side; and
one or more electrically conductive traces located in or on said midplane circuit board, said traces electrically connecting one or more of said signal vias on said first side of said midplane circuit board to one or more complimentary signal vias on said second side of said midplane circuit board to complete a signaling path through said midplane circuit board.
26. The midplane circuit board of claim 24, further comprising a shared signal via, wherein said shared signal via lies within a column on said first side and a column on said second side of said midplane circuit board.
27. An orthogonal connector system comprising:
a midplane circuit board having a first mating surface and a second mating surface;
a first differential pair of electrically conductive vias on said first mating surface of said midplane circuit board, said first differential pair of electrically conductive vias disposed in a first direction;
a first electrical connector mounted to said first mating surface of said midplane circuit board;
a first differential signal pair of electrical contacts extending from said first electrical connector, wherein said first differential signal pair of electrical contacts are electrically connected to said first differential pair of electrically conductive vias;
a second differential pair of electrically conductive vias on said second mating surface of said midplane circuit board, said second differential pair of electrically conductive vias disposed in a second direction that is generally orthogonal to said first direction;
a second electrical connector mounted to said second mating surface of said midplane circuit board; and
a second differential signal pair of electrical contacts extending from said second electrical connector, wherein said second differential signal pair of electrical contacts are electrically connected to said second differential pair of electrically conductive vias;
wherein said second electrical connector is oriented in a substantially orthogonal relationship to said first electrical connector.
28. The orthogonal connector system of claim 27, further comprising:
a first footprint on said first mating surface of said midplane circuit board;
a second footprint on said second mating surface of said midplane circuit board;
wherein said second footprint is substantially identical to said first footprint and wherein said second footprint is oriented generally orthogonal to said first footprint;
wherein said substantially identical footprints allows the same electrical connector to be coupled to either mating surface of said midplane circuit board.
29. The orthogonal connector system of claim 27, further comprising at least one non-linear signaling path through said midplane circuit board and at least one electrically conductive trace,
wherein at least one signal via of said first differential signal pair of electrically conductive vias and at least one complimentary signal via of said second differential signal pair of electrically conductive vias are offset from one another; and
wherein one of said at least one electrically conductive trace extends between and electrically connects said offset signal vias to form said non-linear signaling path.
30. A first electrical connector comprising:
an electrical housing;
a plurality of contact tails that each extend from a mounting side of the electrical housing,
wherein two of the contact tails are press-fit tails and one of the contact tails is a surface mount contact tail.
31. A midplane circuit board for forming an orthogonal interconnection between two daughtercards, said midplane circuit board comprising:
a first mating surface having a first differential signal pair of electrically conductive vias and a first ground via disposed in a first direction;
a second mating surface having a second differential signal pair of electrically conductive vias and a second ground via disposed in a second direction that is generally orthogonal to said first direction;
a relatively large ground via disposed adjacent to at least one of said first and second differential signal pair of electrically conductive vias;
wherein said relatively large ground via defines an opening that is large relative to said first and second ground vias; and
a trace electrically connecting said relatively large ground via to at least one of said first and second ground vias.
32. A circuit board having one or more giant ground holes, said circuit board comprising:
a giant ground via disposed adjacent to at least one of a first and second differential signal pair of electrically conductive vias;
wherein said giant ground via defines an opening that is large relative to said first and second ground vias.
33. The midplane circuit board of claim 32, further comprising:
a first ground via disposed adjacent to said first differential signal pair of electrically conductive vias along a first direction; and
a second ground via disposed adjacent to said second differential signal pair of electrically conductive vias along a second direction that is generally orthogonal to said first direction;
wherein said first ground via, said second ground via, and said giant ground via are electrically connected to one another.
34. A midplane circuit board for forming an orthogonal interconnection between two daughtercards, said midplane circuit board comprising:
a first mating surface having a first differential signal pair of electrically conductive pads disposed in a first direction;
a second mating surface having a second differential signal pair of electrically conductive pads disposed in a second direction that is generally orthogonal to said first direction;
at least one relatively small signal via disposed adjacent to at least one of said first and second differential signal pair of electrically conductive pads;
wherein said relatively small signal via is small in size relative to said first and second differential signal pair of electrically conductive pads;
wherein said relatively small signal via is electrically connected to at least one of said first and second differential signal pair of electrically conductive pads.
35. The midplane circuit board of claim 34, further comprising:
a first trace on said first mating surface that electrically connects one of said first plurality of electrically conductive pads to said relatively small signal via; and
a second trace on said second mating surface that electrically connects one of said second plurality of electrically conductive pads to said relatively small signal via;
wherein said relatively small signal via allows differential signals to pass from said first mating surface to said second mating surface through said relatively small signal via.