1. A method for manufacturing a substrate, the method comprising:
forming a hole through a non-conductive layer, the hole including a sidewall;
after forming the hole, depositing a conductive layer on at least a portion of the sidewall and at least one of a top-side and a bottom-side of the non-conductive layer; and
forming partitions within the hole that separate the conductive layer into a first interconnect within the hole and a second interconnect within the hole that is electrically isolated form the first interconnect.
2. The method of claim 1 wherein the non-conductive layer comprises at least one of a dielectric core layer of a circuit board and a semiconductor layer of a semiconductor wafer.
3. The method of claim 1 wherein forming the hole and the partitions comprises removing conductive material from the conductive layer using a patterning process that includes at least one of chemical etching, mechanical drilling, laser drilling, and mechanical stamping.
4. The method of claim 1, further comprising at least partially filling the hole with a dielectric spacer material.
5. The method of claim 1 further comprising:
forming a lead land on at least one of a top-side portion and a bottom-side portion of the conductive layer, the lead land at least partially surrounding the hole and including first and second segmented portions, the first segmented portion being electrically coupled to the first interconnect and the second segmented portion being electrically coupled to the second interconnect and electrically isolated from the first interconnect.
6. The method of claim 5 further comprising forming a first trace on at least one of the top-side and bottom-side portions of the conductive layer, the first trace being electrically coupled to the first segmented portion of the lead land.
7. The method of claim 6 further comprising forming a second trace on at least one of the top-side and bottom-side portions of the conductive layer, the second trace being electrically coupled to the second segmented portion of the lead land.
8. The method of claim 7 wherein the first and second traces are located on the same side of the non-conductive layer and are substantially parallel to one another.
9. The method of claim 1 wherein forming the hole further includes forming the hole through a portion of a stacking layer that is attached to the non-conductive layer.
10. A method for manufacturing a substrate, the method comprising:
forming a via hole through a non-conductive material having a first side opposite a second side, the via hole including a sidewall extending between the first side and the second side;
after forming the hole, depositing a conductive material on at least a portion of the sidewall, the first side, and the second side of the non-conductive material;
forming partitions within the via hole that separate the conductive material into a first interconnect and a second interconnect within the via hole, the first and second interconnects being electrically isolated from each other; and
patterning the conductive material on the first and second sides of the non-conductive material to form
first and second lead lands electrically isolated from each other and in direct contact with the first and second interconnects, respectively; and
first and second traces in electrical contact with and extending away from the first and second lead lands, respectively.
11. The method of claim 10 wherein the non-conductive layer comprises at least one of a dielectric core layer of a circuit board and a semiconductor layer of a semiconductor wafer.
12. The method of claim 10 wherein forming the via hole and the partitions comprises removing a portion of the conductive material using a patterning process that includes at least one of chemical etching, mechanical drilling, laser drilling, and mechanical stamping.
13. The method of claim 10, further comprising at least partially filling the hole with a dielectric spacer material.
14. The method of claim 10, further comprising forming third and fourth lead lands on the second side of the non-conductive material, the third lead land being electrically coupled to the first interconnect and the fourth lead land being electrically coupled to the second interconnect.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An intake system for an internal combustion engine comprising an unfiltered air inlet, a filter element situated in a housing, said filter element separating an unfiltered air area of the housing from a clean air area, and a clean air outlet opening out of the housing, said clean air outlet being connected to the internal combustion engine, wherein at least one shunt resonator or lambda4 pipe is provided, and wherein the shunt resonator or lambda4 pipe occupies an area of the air filter housing in which there is little or no movement of air.
2. An intake system according to claim 1, wherein a shunt resonator or a lambda4 pipe is arranged on the unfiltered air side of the air filter housing.
3. An intake system according to claim 1, wherein the shunt resonator or lambda4 pipe is arranged on the clean air side of the air filter housing.
4. An intake system according to claim 1, wherein the shunt resonator is formed by an exterior wall of the air filter housing and at least one partition which extends into the air filter housing.
5. An intake system according to claim 1, wherein the internal combustion engine is a V-type engine having two air filter housing sections arranged symmetrically on the internal combustion engine, and two shunt resonators are provided inside the air filter housing.
6. An intake system according to claim 4, wherein the partition is provided with additional noise suppressing elements.
7. An intake system according to claim 6, wherein said additional noise suppressing elements comprise webs.
8. An intake system according to claim 6, wherein said additional noise suppressing elements comprise additional cavities.
9. An intake system according to claim 4, wherein the shunt resonator is provided with a dust discharge valve or water discharge valve situated on an exterior wall of the air filter housing.
10. An intake system according to claim 1, wherein the shunt resonator is a plate resonator.