1. A carrier, suitable for receiving one or more semiconductor wafers for the machining thereof in lapping, grinding or polishing machines, comprising a core composed of a first material which has a high stiffness, said core being completely or partly coated with a second material, and also at least one cutout for receiving a semiconductor wafer, wherein the second material is a thermoset polyurethane elastomer having a Shore A hardness of 20-90.
2. The carrier of claim 1, wherein the first material has a modulus of elasticity of 70-600 GPa.
3. The carrier of claim 1, wherein the first material has a modulus of elasticity of 100-250 GPa.
4. The carrier of claim 1, wherein the first material has a Rockwell hardness of HRC 30 to HRC 60.
5. The carrier of claim 1, wherein the first material has a Rockwell hardness of HRC 40 to HRC 52.
6. The carrier of claim 1, wherein the first material is a steel.
7. The carrier of claim 1, wherein the thermoset polyurethane elastomer has a hardness of Shore A 40 to Shore A 80.
8. The carrier of claim 1, wherein a cutout of the carrier is lined in its edge region with a third material selected from the group consisting of polyvinylidene difluoride (PVDF), polyamide (PA), polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), polycarbonate (PC), polystyrene (PS), polymethyl methacrylate (PMMA), perfluoroalkoxy (PFA), and mixtures thereof.
9. The carrier of claim 1, wherein a cutout of the carrier is lined in its edge region with a thermoset polyurethane elastomer having a Shore A hardness of 20-90.
10. The carrier of claim 1, wherein a total thickness of the carrier is between 0.3 and 1.0 mm and a thickness of the core of the carrier composed of the first material is between 30% and 98% of the total thickness of the carrier.
11. The carrier of claim 1, wherein the thickness of the core of the carrier is between 50% and 90% of the total thickness of the carrier.
12. The carrier of claim 10, wherein the thickness of the layers composed of the second material is identical on both sides of the core.
13. The carrier of claim 10, wherein the coating is thicker in the region of some or all of the edges of openings in the carrier than in the remaining regions of the carrier.
14. A method for producing a carrier of claim 1 in which a carrier comprising a metallic core and at least one cutout is coated, comprising the following steps: chemically activating the core of the carrier by chemical treatment, electrochemical treatment or treatment with a plasma to form a pretreated core, applying an adhesion promoter to the pretreated core, applying a polyurethane prepolymer to the adhesion promoter by means of potting to form a polyurethane layer, and grinding the polyurethane layer to a target thickness.
15. The method of claim 14, wherein the polyurethane is applied to the core of the carrier on both sides simultaneously.
16. The method of claim 14, wherein the application of the polyurethane prepolymer takes place in a mold by means of vacuum or under pressure.
17. The method of claim 14, wherein the adhesion promoter contains a silane.
18. The method of claim 14, wherein a third material for lining an edge of a cutout is introduced by means of a high-pressure injection-molding method.
19. The method of claim 14, wherein the polyurethane coating is led completely or partly around some or all of the edges of openings or cutouts of the carrier in such a way that front-side coating and rear-side coating are connected to one another.
20. The method of claim 19, wherein activation is by chemical treatment with an acid or alkaline etchant solution.
21. The method of claim 20, wherein the etchant is selected from the group consisting of phosphoric acid (H3PO4), nitric acid (HNO3), sulfuric acid (H2SO4), hydrofluoric acid (HF), hydrochloric acid (HCl) and mixtures thereof.
22. The method of claim 20, wherein an oxidizing agent additionally acts on the first material during etching.
23. A method for the simultaneous double-side material-removing machining of a plurality of semiconductor wafers, wherein each semiconductor wafer lies such that it is freely movable in a cutout of one of a plurality of carriers of claim 1 that are caused to rotate by means of a rolling apparatus and is thereby moved on a cycloidal trajectory, wherein the semiconductor wafers are machined in material-removing fashion between two rotating ring-shaped working disks.
24. The method of claim 23, wherein the material-removing machining includes a double-side grinding of the semiconductor wafers and each working disk comprises a working layer comprising abrasive material.
25. The method of claim 23, wherein the material-removing machining includes a double-side lapping of the semiconductor wafers with supply of a slurry comprising abrasive material.
26. The method of claim 23, wherein the material-removing machining includes a double-side polishing with supply of a dispersion comprising silica sol, wherein each working disk comprises a polishing cloth as a working layer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method comprising:
determining, by a controller device for a software defined network (SDN), a primary path for network traffic between network devices of the SDN;
storing, by the controller device, data indicating that one or more network devices along the primary path comprise master network devices;
determining, by the controller device, a backup path to the primary path for the network traffic between the network devices of the SDN;
storing, by the controller device, data indicating that one or more network devices along the backup path comprise slave network devices, wherein each of the master network devices of the primary path corresponds to one or more of the slave network devices of the backup path; and
in response to a failover event, configuring the network devices to switch from the primary path to the backup path, wherein configuring comprises, based on the stored data, configuring each of the network devices to forward packets to the slave network device corresponding to the primary network devices and not to forward the packets to the master network devices.
2. The method of claim 1, wherein the failover event comprises a failure of one of the network devices along the primary path.
3. The method of claim 1, wherein configuring the network devices comprises programming the network devices to avoid all of the network devices along the primary path.
4. The method of claim 1, wherein a first set of the network devices of the SDN form the primary path, wherein a second set of the network devices of the SDN form the backup path, and wherein the first set and the second set are mutually exclusive.
5. The method of claim 1, wherein a first set of network devices of the SDN form the primary path, wherein a second set of the network devices of the SDN form the backup path, and wherein the second set of network devices includes all but one of the network devices of the first set of network devices.
6. The method of claim 5, wherein determining the backup path comprises determining a plurality of backup paths to the primary path, wherein each of the plurality of backup paths includes a different subset of the first set of network devices and at least one respective network device of the SDN that is not in the first set of network devices.
7. The method of claim 1, wherein configuring the network devices comprises programming, by the controller device, a service device to determine when the failover event has occurred and to cause the service device to configure the network devices to switch from the primary path to the backup path in response to the failover event.
8. The method of claim 7, wherein the service device comprises one of a physical service device, a multi-tenant service device, or a virtual service device.
9. A controller device for a software defined network (SDN), the controller device comprising:
one or more network interfaces configured to communicate with network devices of the SDN; and
one or more processors configured to determine a primary path for network traffic between network devices of the SDN, store data indicating that one or more network devices along the primary path comprise master network devices, determine a backup path to the primary path for the network traffic between the network devices of the SDN, store data indicating that one or more network devices along the backup path comprise slave network devices, wherein each of the master network devices of the primary path correspond to one or more of the slave network devices of the backup path, and, in response to a failover event, configure the network devices through the one or more network interfaces to switch from the primary path to the backup path, wherein to configure the network devices, the one or more processors are configured to, based on the stored data, configure each of the network devices to forward packets to the slave network device corresponding to the primary network devices and not to forward the packets to the master network devices.
10. The controller device of claim 9, wherein to configure the network devices, the one or more processors are configured to program the network devices to avoid all of the network devices along the primary path.
11. The controller device of claim 9, wherein a first set of network devices of the SDN form the primary path, wherein a second set of the network devices of the SDN form the backup path, and wherein the second set of network devices includes all but one of the network devices of the first set of network devices.
12. The controller device of claim 11, wherein to determine the backup path, the one or more processors are configured to determine a plurality of backup paths to the primary path, wherein each of the plurality of backup paths includes a different subset of the first set of network devices and at least one respective network device of the SDN that is not in the first set of network devices.
13. The controller device of claim 9, wherein to configure the network devices, the one or more processors are configured to program a service device to determine when the failover event has occurred and to cause the service device to configure the network devices to switch from the primary path to the backup path in response to the failover event.
14. The controller device of claim 13, wherein the service device comprises one of a physical service device, a multi-tenant service device, or a virtual service device.
15. A non-transitory computer-readable storage medium having stored thereon instructions that, when executed, cause a processor of a controller device for a software defined network (SDN) to:
determine a primary path for network traffic between network devices of the SDN;
store data indicating that one or more network devices along the primary path comprise master network devices;
determine a backup path to the primary path for the network traffic between the network devices of the SDN;
store data indicating that one or more network devices along the backup path comprise slave network devices, wherein each of the master network devices of the primary path correspond to one or more of the slave network devices of the backup path; and
in response to a failover event, configure the network devices to switch from the primary path to the backup path, wherein the instructions that cause the processor to configure the network devices comprise instructions that cause the processor to, based on the stored data, configure each of the network devices to forward packets to the slave network device corresponding to the primary network devices and not to forward the packets to the master network devices.
16. The non-transitory computer-readable storage medium of claim 15, wherein the instructions that cause the processor to configure the network devices comprise instructions that cause the processor to program the network devices to avoid all of the network devices along the primary path.
17. The non-transitory computer-readable storage medium of claim 15, wherein a first set of network devices of the SDN form the primary path, wherein a second set of the network devices of the SDN form the backup path, and wherein the second set of network devices includes all but one of the network devices of the first set of network devices.
18. The non-transitory computer-readable storage medium of claim 17, wherein determining the backup path comprises determining a plurality of backup paths to the primary path, wherein each of the plurality of backup paths includes a different subset of the first set of network devices and at least one respective network device of the SDN that is not in the first set of network devices.
19. The non-transitory computer-readable storage medium of claim 15, wherein the instructions that cause the processor to configure the network devices comprise instructions that cause the processor to program a service device to determine when the failover event has occurred and to cause the service device to configure the network devices to switch from the primary path to the backup path in response to the failover event.
20. The non-transitory computer-readable storage medium of claim 19, wherein the service device comprises one of a physical service device, a multi-tenant service device, or a virtual service device.