1. An apparatus to manufacture a semiconductor package, comprising:
a first process unit to perform a semiconductor package manufacturing process on a first surface of a substrate;
a reversing unit to reverse an orientation of the substrate such that a second surface of the substrate faces in a first direction; and
a second process unit to perform a semiconductor package manufacturing process on the second surface of the substrate that faces in the first direction,
wherein the first process unit, the reversing unit, and the second process unit are disposed inside an equipment housing.
2. The apparatus of claim 1, wherein the first process unit, the reversing unit, and the second process unit are arranged in a row and each include a transfer member for transferring the substrate in one direction, and wherein the transfer member includes:
a guide rail aligned to extend in a transfer direction of the substrate and supporting the edge of the substrate; and
a pusher to push the substrate supported by the guide rail in the transfer direction.
3. The apparatus of claim 2, wherein the reversing unit includes:
a rotation driving member to rotate the guide rail to reverse the orientation of the first and second surfaces of the substrate supported by the guide rail.
4. The apparatus of claim 3, wherein the rotation driving member includes:
a rotation shaft coupled with a side surface of the guide rail to be perpendicular to a longitudinal direction of the guide rail; and
a driving motor to supply rotation force to the rotation shaft.
5. The apparatus of claim 4, wherein the substrate is a strip-type lead frame on which a plurality of semiconductor chips are mounted.
6. The apparatus of claim 1, wherein the first and second process units are a die attaching unit to attach a semiconductor chip to the first and second surfaces of the substrate.
7. The apparatus of claim 1, wherein the first and second process units are a wire bonding unit to electrically connect semiconductor chips attached to the first and second surfaces of the substrate to terminals of the substrate.
8. The apparatus of claim 1, further comprising a buffer part disposed adjacent to the second process unit to hold the processed substrate.
9. An apparatus to manufacture a semiconductor package, comprising:
a die attaching part to attach a semiconductor chip to a substrate;
a buffer part disposed adjacent to the die attaching part that includes a space to hold the substrate transferred from the die attaching part; and
a wire bonding part disposed adjacent to the buffer part to electrically connect the semiconductor chips attached to the substrate transferred from the buffer part to terminals of the substrate,
wherein the die attaching part includes first and second die attaching units to attach the semiconductor chip to a surface of the substrate that faces in a first direction,
wherein the wire bonding part includes first and second wire bonding units to electrically connect the semiconductor chips attached to the surface of the substrate that faces in the first direction to terminals of the substrate, and
wherein reversing units to reverse an orientation of the substrate are disposed between the first and second die attaching units and between the first and second wire bonding units, respectively.
10. The apparatus of claim 9, wherein the first and second die attaching units, the first and second wire bonding units, and the reversing units each include a transfer member for transferring the substrate in one direction, and wherein the transfer member includes:
a guide rail aligned to extend a transfer direction of the substrate and to support the edge of the substrate; and
a pusher to push the substrate supported by the guide rail to the transfer direction.
11. The apparatus of claim 10, wherein each of the reversing units includes:
a rotation driving member to rotate the guide rail to reverse an orientation of a first surface and a second surface of the substrate supported by the guide rail.
12. The apparatus of claim 11, wherein the rotation driving member includes:
a rotation shaft coupled with a side surface of the guide rail to be perpendicular to a longitudinal direction of the guide rail; and
a driving motor to supply rotation force to the rotation shaft.
13. The apparatus of claim 12, wherein the substrate is a strip-type lead frame on which a plurality of semiconductor chips are mounted.
14. The apparatus of claim 9, wherein the buffer part includes:
a guide rail aligned to extend in a transfer direction of the substrate and to support the edge of the substrate;
a rotation shaft coupled with a side surface of the guide rail to be perpendicular to a longitudinal direction of the guide rail; and
a driving motor for supplying rotation force to the rotation shaft to reverse the orientation of a first surface and a second surface of the substrate supported by the guide rail.
15-22. (canceled)
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An air cycle machine comprising:
a first compressor having a first compressor input and a first compressor output, wherein the first compressor is included in a first turbocharger, the first turbocharger including a first turbine mechanically coupled to the first compressor, the first turbine having first turbine input coupled to an exhaust of an internal combustion engine;
a first heat exchanger coupled to a first coolant circuit the first heat exchanger having a first heat exchanger input and a first heat exchanger output, the first heat exchanger input coupled to the first compressor output;
an air cycle machine compressor having a second compressor input and a second compressor output, the second compressor input coupled to the first heat exchanger output through a flow control valve;
a second heat exchanger coupled to a second coolant circuit the second heat exchanger having a second heat exchanger input and a second heat exchanger output, the second heat exchanger input coupled to the second compressor output; and
an air cycle machine turbine mechanically coupled to the air cycle machine compressor, the air cycle machine turbine having a second turbine input and a second turbine output, the second turbine input coupled to the second heat exchanger output, the second turbine output being coupled to a conditioned space to receive a cooled air flow output from the second turbine output;
wherein the conditioned space includes at least one of a passenger cabin or a refrigerated cargo space.
2. The system of claim 1, further comprising a first cooling media source coupled to the first cooling circuit for cooling the first heat exchanger.
3. The system of claim 1, further comprising a second cooling media source coupled to the second cooling circuit for cooling the second heat exchanger.
4. The system of claim 1, further comprising a controller coupled to the flow control valve, the controller for controlling a temperature of the cool air flow output from the second turbine output.
5. The system of claim 1, wherein an intake of the internal combustion engine is coupled to the first heat exchanger output.