What is claimed is:
1. A database system which has a plurality of database storage subsystems operating under a database management system, comprising:
mirroring means for making the plurality of database storage subsystems operate as a mirrored storage system;
write suspending means for temporarily suspending write operations to the plurality of database storage subsystems;
detaching means for detaching at least one of the database storage subsystems from the mirrored storage system; and
write restarting means for restarting the write operations to the remaining database storage subsystems.
2. The database system according to claim 1, further comprising:
attachment means for attaching the detached database storage subsystem to another database management system; and
rebooting means for rebooting said another database management system with the attached database storage subsystem to activate a recovery function.
3. The database system according to claim 1, further comprising:
recovery processing means for making corrections to the detached database storage subsystem to resolve any inconsistency in its records, which might have been introduced in relation with such transactions that were in process when said detaching means worked; and
conversion means for converting file location data of the detached database storage subsystem with a predetermined conversion rule, whereby the detached database storage subsystem will serve as a separate database volume.
4. A computer-readable medium storing a program which controls a database system employing a plurality of database storage subsystems, the program causing a computer system to function as:
mirroring means for making the plurality of database storage subsystems operate as a mirrored storage system;
checkpoint finding means for finding a checkpoint at which it is ensured that all updates of preceding transactions are written in the database storage subsystems;
detaching means for disabling said mirroring means and detaching one of the database storage subsystems from the mirrored storage system;
waiting means for waiting for the completion of such transactions that were in process at the time of the detachment; and
logging means for creating and storing log records including logs at the time of the detachment.
5. A database system having a plurality of database storage subsystems, comprising:
mirroring means for making the plurality of database storage subsystems operate as a mirrored storage system;
checkpoint finding means for finding a checkpoint at which it is ensured that all updates of preceding transactions are written in the database storage subsystems;
detaching means for disabling said mirroring means and detaching one of the database storage subsystems from the mirrored storage system; and
waiting means for waiting for the completion of such transactions that were in process at the time of the detachment; and
logging means for creating and storing log records including log records at the time of the detachment.
6. The database system according to claim 5, further comprising failure recovery means for recovering one of the remaining database storage subsystems from a failure by using the detached database storage subsystem and the log records stored in said logging means.
7. A computer-readable medium storing a program which controls a database system employing a plurality of database storage subsystems, the program causing a computer system to function as:
mirroring means for making the plurality of database storage subsystems operate as a mirrored storage system;
write suspending means for temporarily suspending write operations to the plurality of database storage subsystems;
detaching means for detaching at least one of the database storage subsystems from the mirrored storage system: and write restarting means for restarting the write operations to the remaining database storage subsystems.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A system comprising:
an integrated circuit die;
an integrated circuit package;
a first level interconnection between the die and the package;
a system board;
a second level interconnection between the package and the system board; and
interconnect bumps in at least one of the interconnections, the interconnect bumps including a diameter greater than a height of interconnect bumps.
2. The system of claim 1, wherein at least one of the interconnect bumps is in contact with a contact pad and a substrate.
3. The system of claim 1, wherein the interconnect bumps include a height of approximately one-third of a diameter interconnect bumps.
4. The system of claim 1, wherein the interconnect bumps has an interconnect height to area ratio of at least 1.25
5. The system of claim 1, wherein the interconnect bumps comprise an electrically conductive polymer.
6. The system of claim 1, wherein the interconnect bumps comprise a metal alloy bump.
7. A system comprising:
an integrated circuit die;
an integrated circuit package;
a first level interconnection between the die and the package;
a system board;
a second level interconnection between the package and the system board; and
interconnect bumps in at least one of the interconnections, at least one of the interconnect bumps being in contact with a contact pad and a substrate.
8. The system of claim 7, wherein the interconnect bumps comprise benzocyclobutene.
9. The system of claim 7, wherein the interconnect bumps comprise a silver-filled epoxy.
10. The system of claim 7, wherein the interconnect bumps comprise a tin-silver-copper alloy.
11. A system comprising:
an integrated circuit die;
an integrated circuit package;
a first level interconnection between the die and the package;
a system board;
a second level interconnection between the package and the system board; and
interconnect bumps in at least one of the interconnections, the interconnect bumps including a diameter greater than a height of interconnect bumps, and at least one of the interconnect bumps being in contact with a contact pad and a substrate.
12. The system of claim 11, wherein the interconnect bumps comprises a material having a modulus in the approximate range of 0.5 to 6 GigaPascals.
13. The system of claim 11, wherein the at least one of the interconnect bumps extends in area wider than a top surface of the contact pad.
14. The system of claim 11, wherein the interconnect bumps contact a top surface of a passivation layer formed over the substrate.
15. The system of claim 11, wherein the contact pad is located in an opening of a passivation layer formed over the substrate, and the at least one of the interconnect bumps includes a diameter greater than a size of the opening.