1. A method for shielding a device which includes an electrical circuit from electromagnetic interference comprising the steps of:
(a) providing a nanoscale fiber film which comprises a plurality of nanoscale fibers; and
(b) incorporating the nanoscale fiber film into an exterior portion of the device to shield an interior portion of the device from electromagnetic interference.
2. The method of claim 1, wherein step (a) includes providing a plurality of nanoscale fibers; dispersing the plurality of nanoscale fibers into a liquid to form a suspension; and
removing the liquid to form a nanoscale fiber film.
3. The method of claim 2, wherein the step of removing the liquid comprises filtration, vaporization, or a combination thereof.
4. The method of claim 2, further comprising the step of coating the nanoscale fibers with a metal material before the step of dispersing the nanoscale fibers.
5. The method of claim 2, further comprising the step of aligning the nanoscale fibers after the step of dispersing the nanoscale fibers and before the step of removing the liquid.
6. The method of claim 1, wherein step (b) comprises adhering one or more layers of the nanoscale fiber film with an adhesive material to at least one surface of the device.
7. An electromagnetic interference shielded device comprising:
a device which includes an exterior portion and an interior portion having an electrical circuit disposed therein; and
at least one nanoscale fiber film which comprises a plurality of nanoscale fibers,
wherein the at least one nanoscale fiber film material is part of the exterior portion of the device.
8. The device of claim 7, wherein one or more layers of the nanoscale fiber film are attached to a surface of the exterior portion or are part of a composite material of construction forming at least part of the exterior portion of the device.
9. The device of claim 7, wherein the plurality of nanoscale fibers are coated with a metal material.
10. The device of claim 7, wherein the plurality of nanoscale fibers are aligned.
11. The device of claim 7, wherein the plurality of nanoscale fibers comprise carbon nanotubes.
12. The device of claim 7, wherein the nanoscale fiber film has a thickness between 5 and 50 microns.
13. The device of claim 7, wherein a structural material is impregnated into spaces among the plurality of nanoscale fibers.
14. The device of claim 13, wherein the second structural material comprises a polymeric material.
15. The device of claim 14, wherein the polymeric material comprises an epoxy.
16. The device of claim 7, which has an average electromagnetic wave attenuation of at least about 21 dB between the frequencies of about 200 MHz and about 500 MHz.
17. The device of claim 7, which has an average electromagnetic wave attenuation of at least about 30 dB between the frequencies of about 4 GHz and about 18 GHz.
18. A method for making a composite structure for electromagnetic interference shielding, comprising the steps of:
(a) providing a nanoscale fiber film which comprises a plurality of nanoscale fibers; and
(b) combining the nanoscale fiber film with one or more structural materials to form a composite material which is effective as an electromagnetic interference shielding structure.
19. The method of claim 18, wherein the composite material comprises a laminate structure.
20. The method of claim 18, wherein the one or more structural materials comprise a polymeric material.
21. The method of claim 20, wherein the polymeric material comprises an epoxy.
22. The method of claim 18, wherein step (b) comprises impregnating the nanoscale fiber film with a flowable material to form an impregnated nanoscale fiber film and then solidifying the flowable material.
23. The method of claim 22, wherein the flowable material comprises a epoxy resin and the solidifying step comprises curing the epoxy resin.
24. The method of claim 22, wherein the flowable material comprises a thermoplastic material heated above its melting temperature and the solidifying step comprises cooling the thermoplastic material to below its melting temperature.
25. The method of claim 18, wherein step (a) comprises providing a plurality of nanoscale fibers; dispersing the plurality of nanoscale fibers into a liquid to form a suspension; and removing the liquid to form a nanoscale fiber film.
26. The method of claim 25, further comprising the step of coating the nanoscale fibers with a metal material before the step of dispersing the nanoscale fibers.
27. The method of claim 25, further comprising the step of aligning the nanoscale fibers after the step of dispersing the nanoscale fibers and before the step of removing the liquid.
28. A composite structure for shielding electromagnetic interference comprising:
at least one nanoscale fiber film which comprises a plurality of nanoscale fibers; and
one or more structural materials combined with the at least one nanoscale fiber film to provide a composite material structure for shielding electromagnetic interference.
29. The composite structure of claim 28, wherein the composite material comprises a laminate structure.
30. The composite structure of claim 29, wherein the composite material structure includes two or more layers of the nanoscale fiber film.
31. The composite structure of claim 28, wherein the plurality of nanoscale fibers are coated with a metal material.
32. The composite structure of claim 28, wherein the plurality of nanoscale fibers are aligned.
33. The composite structure of claim 28, wherein the plurality of nanoscale fibers comprise carbon nanotubes.
34. The composite structure of claim 28, wherein the nanoscale fiber film has a thickness between 5 and 50 microns.
35. The composite structure of claim 28, wherein the one or more structural materials comprise a polymeric material.
36. The composite structure of claim 35, wherein the polymeric material comprises an epoxy.
37. The composite structure of claim 28, wherein the one or more structural materials are electrically non-conductive.
38. The composite structure of claim 28, wherein the one or more structural materials comprise a solid foam or porous substrate.
39. The composite structure of claim 28, wherein the one or more structural materials comprise a glass fiber material.
40. The composite structure of claim 28, wherein one or more structural materials are impregnated into spaces among the plurality of nanoscale fibers.
41. The composite structure of claim 28, which has an average electromagnetic wave attenuation of at least about 21 dB between the frequencies of about 200 MHz and about 500 MHz.
42. The composite structure of claim 28, which has an average electromagnetic wave attenuation of at least about 30 dB between the frequencies of about 4 GHz and about 18 GHz.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for bonding a microchannel plate (MCP) to a multi-layer ceramic body (MLC) unit comprising the steps of:
mating surfaces of the microchannel plate (MCP) and the multi-layer ceramic body (MLC) unit are deposited with a thin film using a suitable metal selected for optimum diffusion at elevated temperatures and pressure; the film deposition of the surface of the multi-layer ceramic body is formed having protuberances placed compatible for bonding of the mating surfaces of the MCP and MLC;
a metallized MCP and MLC body unit are aligned and placed in a bonding fixture for applying a force sufficient to initiate a diffusion bond between the mating surfaces of the MCP and MLC at a selected elevated temperature; and
the bonding fixture is placed in a vacuum heat chamber to accelerate the diffusion bonding process between the MCP and the multi-layer ceramic body unit.
2. The invention of claim 1 wherein the protuberance is formed from a metal selected from the group consisting of gold, silver, nickel, platinum, and palladium.