1. A method for dissipating heat from a light source comprising the steps of:
providing a circuit board having a plurality of layers;
providing at least one light source connected to a first layer of said circuit board, wherein said at least one light source produces heat when said at least one light source draws electrical current; and
dissipating said heat from said at least one light source by transferring said heat from said first layer to a second layer of said circuit board.
2. The method of dissipating heat from a light source of claim 1, wherein said second layer is a thermal transferring layer formed by a material that is an electrical insulator and a thermal conductor.
3. The method of dissipating heat from a light source of claim 1 further comprising the step of transferring said heat from said second layer to a third layer.
4. The method of dissipating heat from a light source of claim 3, wherein said third layer is a thermal management having a greater thickness than said first layer and said second layer, such that said heat is dissipated over the surface area of said third layer.
5. The method of dissipating heat from a light source of claim 3, wherein said third layer is formed of a material with a high thermal conductivity.
6. The method of dissipating heat from a light source of claim 3 further comprising the step of providing a fourth layer connected to said third layer, wherein said fourth layer is a heat sink, such that said heat is transferred to said heat sink from said third layer in order to dissipate said heat.
7. The method of dissipating heat from a light source of claim 1 further comprising the step of providing at least one conductive trace connecting said light source to said circuit board.
8. The method of dissipating heat from a light source of claim 7 further comprising the step of providing a thermal sink as part of said conductive trace, wherein said thermal sink draws said heat from said light source, such that said heat from said light source is transferred from said light source through said thermal sink to said second layer.
9. The method of dissipating heat from a light source of claim 1 wherein said first layer includes at least one thermal via to facilitate the transfer of heat from the light source to a thermal transfer member extending through at least one other layer of the circuit board, the at least one thermal via and the thermal transfer member transferring heat from the light source to the at least one other layer of the circuit board.
10. A light source assembly for dissipating heat comprising:
a circuit board having a plurality of layers;
at least one light source connected to a first layer of said circuit board; and
a second layer operably connected to said at least one light source, wherein heat produced from said light source is transferred to said second layer.
11. The light source assembly of claim 10 further comprising at least one conductive trace connecting said at least one light source to said first layer.
12. The light source assembly of claim 11, wherein said conductive trace has at least one thermal sink, wherein said at least one thermal sink draws heat from said light source and transfers heat to said second layer.
13. The light source assembly of claim 10, wherein said second layer is a thermal transferring layer formed by a material that is an electrical insulator and a thermal conductor.
14. The light source assembly of claim 10 further comprising a third layer connected to said second layer.
15. The light source assembly of claim 14, wherein said third layer is a thermal management layer having a greater thickness than said first layer and said second layer, such that said heat is dissipated over the surface area of said third layer.
16. The light source assembly of claim 14, wherein said third layer is formed of a material with a high thermal conductivity.
17. The light source assembly of claim 14 further comprising a fourth layer connected to said third layer, wherein said fourth layer is a heat sink.
18. The light source assembly of claim 10 further comprising at least one thermal via extending through the first layer and a thermal transfer member extending through at least the second layer of the circuit board and being in thermal contact with the at least one thermal via, the thermal via thermally connecting the at least one light source to the thermal transfer member.
19. A light source assembly for dissipating heat comprising:
a circuit board having at least a first layer, a second layer, and a third layer;
at least one light source connected to said first layer of said circuit board;
said second layer of said circuit board operably connected to said at least one light source, wherein heat produced from said at least one light source is transferred from said first layer to said second layer; and
said third layer connected to said second layer, wherein heat produced from said at least one light source is transferred from said first layer, through said second layer, and to said third layer.
20. The light source assembly of claim 19 further comprising a fourth layer connected to said third layer, wherein said fourth layer is a heat sink.
21. The light source assembly of claim 19 further comprising at least one conductive trace connecting said light source to said circuit board.
22. The light source assembly of claim 21, wherein said conductive trace comprises a thermal sink, wherein said at least one thermal sink draws heat from said light source and transfers heat to said second layer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for producing carbon black from waste rubber, the method comprising:
thermal decomposition of waste rubber in a reactor;
separation of the decomposition products into gas-vapor products and solid carbon residues;
crushing of the carbon residues; and
combustion of the gas-vapor products with the crushed carbon residues by means of supplying the gas-vapor products into the combustion chamber, wherein the mass consumption ratio of the gas-vapor products and crushed carbon residues are between 1:(0.1-2).
2. The method for producing carbon black from waste rubber according to claim 1, wherein the gas-vapor products are burned with the crushed carbon residues in gaseous form or in liquid form after condensation.
3. The method for producing carbon black from waste rubber according to claim 2, wherein the gas-vapor products condensed in liquid form are separated into a first fraction having a boiling point less than or equal to 360\xb0 C. and a second fraction having a boiling point greater than 360\xb0 C., the first fraction being mixed with the crushed carbon residues in a ratio of 1:(0.1-2.0), the resulting mixture being burned, the combustion products being separated mechanically in a centrifugal force field into soot and ash.
4. The method for producing carbon black from waste rubber according to claim 3, wherein the second fraction undergoes thermal decomposition into soot and gas at temperatures between 850 and 2100\xb0 C.
5. The method for producing carbon black from waste rubber according to claim 3, wherein the combustion of the mixture of first fraction and carbon residues is carried out with an excess air coefficient between 0.20 and 0.35.
6. The method for producing carbon black from waste rubber according to any of the claim 1, wherein the carbon residues are crushed to produce particles of sizes between 0.1 and 2.0 mm.
7. The method for producing carbon black from waste rubber according to claim 1, wherein some or all of the crushed carbon residue is transported into the combustion chamber by means of gas-vapor products.
8. The method for producing carbon black from waste rubber according to claim 3, wherein the gases from the thermal decomposition of the second fraction and the combustion products of the mixture are burned together with the gas-vapor products, and the thermal energy produced is used for the thermal decomposition of the waste rubber in the reactor.
9. A device for producing carbon black from waste rubber, the device comprising a reactor having an outlet for carbon residues which is consecutively connected to a screw heat exchanger, a magnetic separator, a mill, a conveyor, a hopper with a metering unit, a tube heat exchanger, a turbulent burner mounted at the end of a cylindrical furnace on the axis of a combustion chamber, a reactor outlet for gas-vapor products being connected to the burners of the cylindrical furnace which are mounted tangentially and diametrically opposite in the combustion chamber, said outlet also being consecutively connected to the heat exchanger of the hopper with metering unit and to the turbulent burner.