1. A device for executing at least one transaction in a transaction processing system comprising a transaction monitor executable in an open-type execution environment, said at least one transaction being executed by a sequential execution of a plurality of transaction components, said device being characterized in that it comprises the following means:
means for receiving, from said transaction monitor, at least one command for executing at least one transaction component of said plurality of transaction components, said at least one transaction component being developed for a proprietary-type execution environment that is distinct from said open-type execution environment; and,
means for creating a proprietary-type execution space and executing said at least one transaction component.
2. A device according to claim 1, further comprising a working memory, said means for creating a proprietary-type execution space and for executing said at least one transaction component comprising means for the reading from andor the writing to said working memory of at least one item of data, said at least one item of data being used to execute at least one part of said at least one transaction.
3. A device according to claim 1, wherein said means for creating a proprietary-type execution space and for executing said at least one transaction component comprise means for managing an execution context of said at least one transaction.
4. A device according to claim 1, any one of the further comprising means for executing at least one second transaction component of said plurality of transaction components that is distinct from said at least one transaction component referred to as first transaction component, said at least one second transaction component being developed for said open-type execution environment.
5. A device according to claim 1, wherein said transaction monitor comprises communication means for exchanging data with an external system, said communication means being adapted to receive a command for executing at least one part of said at least one transaction.
6. A device according to claim 1, further comprising means for managing transaction components, said means for managing transaction components being adapted to receive a sequence of transaction component identifiers and to sequentially transmit commands for executing the transaction components corresponding to each of said received identifiers.
7. A device according to claim 1, further comprising connecting means adapted to transmit an execution command, received from a transaction component of said at least one transaction, to at least one external application.
8. A device according to claim 1, wherein said connection means are compatible with an architecture offering clientserver type services between applications executed in different environments.
9. A device according to claim 1, wherein said open-type execution environment comprises an application server used as interface between an external system and said transaction monitor.
10. A method of executing at least one transaction in a system comprising at least one transaction monitor executable in an open-type execution environment, said at least one transaction being executed by a sequential execution of a plurality of transaction components said method being characterized in that it comprises the following steps,
receiving, from said transaction monitor, at least one command for executing at least one transaction component of said plurality of transaction components, said at least one transaction component being developed for a proprietary-type execution environment that is distinct from said open-type execution environment;
creating a proprietary-type execution space; and,
executing said at least one transaction component in said created execution space.
11. A method according to claim 10, further comprising a step of reading or writing at least one item of data from or to a working memory of said system, said at least one item of data being used to execute at least one part of said at least one transaction.
12. A method according to claim 10, further comprising a step of executing at least one second transaction component of said plurality of transaction components that is distinct from said at least one transaction component referred to as first transaction component, said at least one second transaction component being developed for said open-type execution environment.
13. A method according to claim 10, further comprising a step of receiving at least one command for executing said at least one transaction.
14. A method according to claim 10, further comprising a step of transmitting at least one execution command received from a transaction component of said at least one transaction for executing an application external to said transaction monitor.
15. A non-transient computer readable medium comprising instructions, which when executed by the computer, cause the method of claim 10 to be performed.
16. Information storage means, removable or not, partially or totally readable by a computer or a microprocessor containing code instructions of a computer program for carrying out each of the steps of the method according to claim 10.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of making a printhead, the method comprising:
forming a resistor strip in a heating region of the printhead, including forming a resistive layer including a central resistor region interposed between two spaced apart conductive elements, wherein the resistive layer and a first conductive layer overlie a substrate in a side area of the heating region, the side area extending laterally outward from opposite side edges of the respective conductive elements and of the central resistor region of the resistive layer;
forming a bus region adjacent the heating region, the bus region including at least a second conductive layer;
removing at least the second conductive layer from a bus region of the printhead while protecting a first portion of the heating region, including preserving the resistive layer and the first conductive layer in at least a shoulder portion of the side area of the heating region immediately adjacent the opposite side edges of the central resistor region; and
removing the resistive layer and the first conductive layer from at least the shoulder portion of the side area of the heating region to define a sidewall of the central resistor region.
2. The method of claim 1 wherein forming the resistor strip of the heating region comprises forming the resistive layer to extend underneath the respective conductive elements.
3. The method of claim 1 wherein forming the resistor strip of the heating region comprises forming the resistive layer to overlie the respective conductive elements.
4. The method of claim 1 wherein the substrate supports an insulation layer and wherein a top surface of the central resistor region is vertically spaced above a top surface of the insulation layer in the completed formation of the heating region by a distance no more than twice a thickness of the central resistor region.
5. The method of claim 1 wherein removing the second conductive layer comprises protecting substantially the entire heating region of the printhead during removal of the second conductive layer from the bus region.
6. The method of claim 5 wherein removing the resistive layer and the first conductive layer from at least the shoulder portion of the side area comprises removing the resistive layer and the first conductive layer from substantially the entire side area of the heating region.
7. The method of claim 6 wherein a depth of removal of the second conductive layer of the bus region is substantially greater than a depth of removal of the resistive layer and the first conductive layer of the shoulder portion of the side area of the heating region.
8. The method of claim 7 wherein the depth of removal of the second conductive layer of the bus region is at least about 4000 Angstroms and the depth of removal of the resistive layer and the first conductive layer in the shoulder portion is about 2000 Angstroms.
9. The method of claim 1 wherein preserving at least the shoulder portion, during removal of the second conductive layer from the bus region, comprises the shoulder portion comprising less than one-half a width of the side area to permit removal of the resistive layer and the first conductive layer outside the shoulder portion of the side area of the heating region simultaneous with the removal of the second conductive layer from the bus region.
10. The method of claim 9 wherein removing the resistive layer and the first conductive layer from at least the shoulder portion of the side area comprises removing the resistive layer and the first conductive layer from the shoulder portion of the side area of the heating region without removing the first conductive layer from other portions of the side area.
11. The method of claim 10 wherein the depth of removal of the resistive layer and the first conductive layer outside the shoulder portion of the side area of the heating region is substantially equal to the depth of removal of the second conductive layer of the bus region.
12. The method of claim 1 wherein the respective conductive elements have a thickness substantially greater than a thickness of the first conductive layer.
13. The method of claim 12 wherein the thickness of the respective conductive elements is about 5000 Angstroms and the thickness of the first conductive layer is about 1000 Angstroms.