1. A method of fabricating a semiconductor structure, the method comprising:
providing a semiconductor wafer comprising a first scribe line and a second scribe line perpendicular to the first scribe line;
defining a free region in an intersection region of the first and the second scribe lines, wherein the free region is defined as a region that when a sawing tool is used to saw the semiconductor wafer through one of the first and the second scribe lines, a probability of the sawing tool sawing outside of the free region is less than about one percent; and
forming a test key comprising test pads in at least one of the first scribe line and the second scribe line, wherein two of the test pads are placed on opposite sides of the free region, and wherein the free region is free from test pads, and one of the test pads is formed in the intersection region and outside of the free region.
2. The method of claim 1 further comprising:
sawing through the first scribe line using the sawing tool; and
sawing through the second scribe line using the sawing tool to separate dies in the semiconductor wafer.
3. The method of claim 1, wherein the free region is smaller than the intersection region.
4. The method of claim 1 further comprising calculating the probability from accumulated data obtained from wafers sawed using the sawing tool.
5. The method of claim 1, wherein the forming the test pads comprises:
forming a plurality of dielectric layers;
forming the test pads in the plurality of dielectric layers; and
forming vias to connect to the test pads.
6. The method of claim 1, wherein the forming the test pads is performed using damascene processes.
7. The method of claim 1, wherein at least one of the test pads extends from outside the intersection region into the intersection region.
8. A method of fabricating a semiconductor structure, the method comprising:
providing a semiconductor wafer comprising a plurality of dies and a plurality of scribe lines separating the plurality of dies from each other, wherein the plurality of scribe lines comprises:
a first scribe line; and
a second scribe line perpendicular to the first scribe line, wherein the first scribe line intersects the second scribe line to define an intersection region;
forming a test line in the first scribe line, wherein the test line comprises a conductive line crossing through the intersection region; and
forming test pads in the test line, wherein the test pads are formed outside a free region defined within the intersection region, wherein no test pad is allowed to be formed in the free region, and wherein at least a portion of one of the test pads is disposed within the intersection region.
9. The method of claim 8, wherein a side of the free region has a distance from a respective side of the intersection region, and wherein the distance is greater than about 17.5 percent of a width of the first and the second scribe lines.
10. The method of claim 8, wherein the free region is defined by maximum kerf lines in the first and the second scribe lines, and wherein the maximum kerf lines are defined as regions wherein when a sawing tool is used to saw the semiconductor wafer, a probability of the sawing tool sawing outside of the maximum kerf lines is less than about one percent.
11. The method of claim 8, wherein the free region extends from a top surface of the semiconductor wafer to a bottom surface of the semiconductor wafer.
12. A method of fabricating a semiconductor structure, the method comprising:
defining a first maximum kerf region in a first scribe line of a semiconductor wafer, wherein the first maximum kerf region has a first width less than a width of the first scribe line;
defining second maximum kerf region in a second scribe line of the semiconductor wafer, wherein the second maximum kerf region has a second width less than a width of the second scribe line, wherein the second scribe line is perpendicular to the first scribe line, and wherein the first scribe line intersects the second scribe line at an intersection region;
defining a free region as an overlap region of the first and the second maximum kerf regions, respectively, the free region having a size smaller than the intersection region of the first scribe line and the second scribe line; and
forming a test line in the first scribe line, wherein the test line comprises a conductive line crossing through the intersection region, wherein all test pads in the test line are outside the free region, wherein a portion of at least one of the test pads is disposed within the intersection region, and wherein the at least one of the test pads extends from outside the intersection region into the intersection region.
13. The method of claim 12, wherein the test pads are located in a top metallization layer.
14. The method of claim 12, wherein the test pads are located in a metallization layer underlying a top metallization layer.
15. The method of claim 12 further comprises sawing through the first and the second scribe lines.
16. The method of claim 12, wherein the first maximum kerf region and the second maximum kerf region are defined as regions wherein when a sawing tool is used to saw the semiconductor wafer, a probability of the sawing tool sawing outside of the first maximum kerf region and the second maximum kerf region is less than one percent.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A computer-implemented method for claim denial conversion, comprising:
receiving, by a switch provider comprising one or more computers, a prescription claim from a pharmacy computer, wherein the prescription claim is associated with a product requested by a customer;
routing, by the switch provider, the prescription claim to a claims processor for adjudication, the claims processor associated with a third-party payor;
receiving, by the switch provider from the claims processor, a denied claim response for the claim request, the denied claim response indicating denial of any financial coverage for the prescription claim;
determining, by the switch provider, that funding is available to cover at least a portion of a price of the requested product;
converting, by the switch provider, the denied claim response to an approved claim response upon determination of the available funding; and
transmitting, by the switch provider, the approved claim response to the pharmacy computer, the approved claim response being responsive to the received prescription claim, wherein the denied claim response is not transmitted to the pharmacy computer.
2. The computer-implemented method of claim 1, wherein the available funding entirely covers the price of the requested product, or wherein the available funding covers only a portion of the price of the requested product, thereby leaving a customer-responsible amount.
3. The computer-implemented method of claim 2, wherein the approved claim transmitted to the pharmacy computer includes the customer-responsible amount.
4. The computer-implemented method of claim 1, further storing a financial record associated with the conversion of the denied claim response to the approved claim response, wherein the financial record specifies a payment amount for a pharmacy associated with the pharmacy computer.
5. The computer-implemented method of claim 1, wherein converting the denied claim response to the approved claim response is a denial conversion for the prescription claim, and further comprising:
receiving, by the switch provider, a coordination of benefits (COB) claim from the pharmacy computer;
determining, by the switch provider, that the COB claim is related to the denial conversion;
determining, by the switch provider, that the COB claim is associated with a government funded program; and
transmitting, by the switch provider, a second denied response for the COB claim to the pharmacy computer, wherein the second denied response includes a message to reverse the denial conversion for the prescription claim.
6. The computer-implemented method of claim 1, wherein the received coverage information indicates that the claim is rejected by the claims processor, and wherein the available discount or payment is associated with complete payment of the claim such that the amount payable by the customer is zero.
7. The computer-implemented method of claim 1, wherein determining that funding is available includes determining one or more of the following: (i) determining an eligible denial reason for denied claim, or (ii) determining that an identifier associated with the requested product is eligible for funding.
8. The computer-implemented method of claim 1, wherein determining that the funding is available includes determining one or more of the following: (i) determining that an eligible claims processor adjudicated the claim, or (ii) determining that the prescription claim is received from an eligible pharmacy.
9. The computer-implemented method of claim 1, wherein the funding is provided by a manufacturer associated with the requested product.
10. The computer-implemented method of claim 1, wherein determining that funding is available to cover at least a portion of a price of the requested product includes transmitting information associated with the prescription claim to a patient assistance program module and receiving a message from a patient assistance program module indicating the available funding.
11. A system for claim denial conversion, comprising:
at least one memory of a switch provider configured to store computer-executable instructions;
at least one computer processor of the switch provider in communication with the at least one memory, wherein the at least one computer processor of the switch provider is operable to execute the computer-executable instructions to:
receive a prescription claim from a pharmacy computer, wherein the prescription claim is associated with a product requested by a customer,
route the prescription claim to a claims processor for adjudication, the claims processor associated with a third-party payor,
receive, from the claims processor, a denied claim response for the claim request, the denied claim response indicating denial of any financial coverage for the prescription claim,
determine that funding is available to cover at least a portion of a price of the requested product,
convert the denied claim response to an approved claim response upon determination of the available funding, and
transmit the approved claim to the pharmacy computer, the approved claim response being responsive to the received prescription claim, wherein the denied claim response is not transmitted to the pharmacy computer.
12. The system of claim 11, wherein the available funding entirely covers the price of the requested product, or wherein the available funding covers only a portion of the price of the requested product, thereby leaving a customer-responsible amount.
13. The system of claim 12, wherein the approved claim transmitted to the pharmacy computer includes the customer-responsible amount.
14. The system of claim 11, wherein the processor is further operable to execute the computer-executable instructions to store in the memory a financial record associated with the conversion of the denied claim response to the approved claim response, wherein the financial record specifies a payment amount for a pharmacy associated with the pharmacy computer.
15. The system of claim 11, wherein the conversion of the denied claim response to the approved claim response is a denial conversion for the prescription claim, and wherein the processor is further operable to execute the computer-executable instructions to:
receive a coordination of benefits (COB) claim from the pharmacy computer;
determine that the COB claim is related to the denial conversion;
determine that the COB claim is associated with a government funded program; and
transmit a second denied response for the COB claim to the pharmacy computer, wherein the second denied response includes a message to reverse the denial conversion for the prescription claim.
16. The system of claim 11, wherein the received coverage information indicates that the claim is rejected by the claims processor, and wherein the available discount or payment is associated with complete payment of the claim such that the amount payable by the customer is zero.
17. The system of claim 11, wherein the processor is operable to execute the computer-executable instructions to determine that funding is available by (i) determining an eligible denial reason for denied claim, or (ii) determining that an identifier associated with the requested product is eligible for funding.
18. The system of claim 11, wherein the processor is operable to execute the computer-executable instructions to determine that funding is available by (i) determining that an eligible claims processor adjudicated the claim, or (ii) determining that the prescription claim is received from an eligible pharmacy.
19. The system of claim 11, wherein the funding is provided by a manufacturer associated with the requested product.
20. The system of claim 11, wherein the processor is operable to execute the computer-executable instructions to determine that funding is available by transmitting information associated with the prescription claim to a patient assistance program module and receiving a message from a patient assistance program module indicating the available funding.