1. An electronics assembly comprising:
a semiconductor die assembly, comprising:
a semiconductor die encapsulated in a molded material;
one or more conductive pillars on a top surface of the semiconductor die;
an encapsulation layer located over the top surface of the semiconductor die and surrounding the conductive pillars; and
at least one patterned metal layer and at least one dielectric layer over the encapsulation layer;
an enclosure affixed to the semiconductor die assembly, the enclosure defining first and second chambers over the semiconductor die assembly and including a wall between the first and second chambers;
first and second optical elements mounted in the first and second chambers, respectively, and electrically connected to the semiconductor die; and
wherein the encapsulation layer blocks optical crosstalk between the first and second chambers.
2. An electronics assembly as defined in claim 1, wherein the molded material and the encapsulation layer are formed of the same material.
3. An electronics assembly as defined in claim 1, wherein the molded material and the encapsulation layer are formed of different materials.
4. An electronics assembly as defined in claim 1, wherein the conductive pillars have a pillar height above the top surface of the semiconductor die and wherein the encapsulation layer has a thickness equal to the pillar height.
5. An electronics assembly as defined in claim 1, wherein the first and second optical elements are electrically connected to the semiconductor die by the conductive pillars.
6. An electronics assembly as defined in claim 1, wherein the first optical element comprises a light source and the second optical element comprises a light sensor.
7. An electronics assembly as defined in claim 6, wherein the semiconductor die comprises an image sensor processor.
8. An electronics assembly as defined in claim 1, wherein the enclosure includes a first lens positioned over the first optical element and a second lens positioned over the second optical element.
9. An electronics assembly as defined in claim 1, wherein a first portion of the semiconductor die is located under the first chamber and a second portion of the semiconductor die is located under the second chamber.
10. An electronics assembly as defined in claim 1, wherein the semiconductor die assembly further includes conductive vias through the molded material for electrically connecting front and rear surfaces of the molded material.
11. An electronics assembly as defined in claim 1, wherein the wall between the first and second chambers extends into an opening in the dielectric layer.
12. An electronics assembly as defined in claim 1, wherein the encapsulation layer is formed of a material that blocks light in an operating wavelength range of the electronics assembly.
13. An electronics assembly as defined in claim 1, wherein the enclosure is affixed to the semiconductor die assembly by an opaque adhesive that extends over an outer edge of the dielectric layer.
14. The electronics assembly as defined in claim 1, wherein the semiconductor die comprises a transparent passivation layer and the encapsulation layer blocks light from reaching the transparent passivation layer.
15. A semiconductor die assembly comprising:
a semiconductor die having a transparent passivation layer and being encapsulated in a molded material;
one or more conductive pillars on a top surface of the semiconductor die;
an encapsulation layer located on the top surface of the semiconductor die and surrounding the conductive pillars;
at least one patterned metal layer and at least one dielectric layer over the encapsulation layer; and
wherein the encapsulation layer blocks light from reaching the transparent passivation layer.
16. A semiconductor die assembly as defined in claim 15, wherein the conductive pillars have a pillar height above the top surface of the semiconductor die and wherein the encapsulation layer has a thickness equal to the pillar height.
17. A semiconductor die assembly as defined in claim 15, further comprising conductive vias through the molded material for electrically connecting front and rear surfaces of the molded material.
18. A semiconductor die assembly as defined in claim 15, wherein the encapsulation layer is formed of a material that blocks light in an operating wavelength range of the semiconductor die assembly.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electrical connector, comprising:
a base having a plurality of passageways;
a cover having a plurality of through holes corresponding to the passageways, the cover mounted to the base and slidably moveable relative to the base;
a cam mounted between the base and the cover, and rotatable to drive the cover to move relative to the base; and
a protecting mechanism comprising a cover plate mounted in the cover and a base element mounted in the base, the cover plate comprising a planar main portion, a via hole defined in a middle thereof, and a pair of stoppers bent toward the cover to engage with the cam and restrict the cam to rotate within a certain angle.
2. The electrical connector as claimed in claim 1, wherein the cover plate is made of metallic material by stamping, and the via hole is formed by drawing.
3. The electrical connector as claimed in claim 2, wherein the via hole has a shirting margin with a smooth inner surface extending from an edge of the via hole and passing into a cover hole of the cover.
4. The electrical connector as claimed in claim 3, wherein the stoppers are disposed at opposite sides of the main portion, a pair of stiffener portions extend from the main portion and parallel to the stoppers, respectively.
5. The electrical connector as claimed in claim 4, wherein each stiffener portion bends at a same direction of the stopper firstly and then extends parallel to the main portion.
6. The electrical connector as claimed in claim 1, wherein the cover has a head portion protruding from one end of the cover, and includes a first concave formed at the middle of a bottom surface of the head portion, a second concave formed on a top surface of the head portion corresponding to the first concave, and a cover hole passing through the first and the second concaves.
7. The electrical connector as claimed in claim 6, wherein the second concave is formed with two semicircles having different diameters, there are two vertical sidewalls on the two semicircles intersectant place.
8. The electrical connector as claimed in claim 7, wherein the first concave has accommodating recesses for receiving the stoppers, and the accommodating recesses are communicated with the second concave by through the vertical sidewalls to partially expose the stoppers to the second concave.
9. The electrical connector as claimed in claim 8, wherein the first concave has a corresponding shape with the cover plate and receives with the cover plate by tight fitting.
10. An electrical connector, comprising:
a base having a plurality of passageways;
a cover having a plurality of through holes corresponding to the passageways, the cover mounted to the base and slidably moveable relative to base;
a cam mounted between the base and the cover, and rotateable to drive the cover to move relative to the base; and
a protecting mechanism comprising a cover plate mounted in the cover and a base element mounted in the base, the cover plate being formed by stamping, the cover plate comprising a planar main portion, a via hole defined in a middle thereof and formed by drawing, and a pair of stoppers bent toward the cover for engaging with the cam.
11. The electrical connector as claimed in claim 10, wherein the cover plate and the cover are assembled together by tight fitting.
12. The electrical connector as claimed in claim 11, wherein the cover plate further comprises a pair of stiffener portions to enhance an engaging force between the cover plate and the cover.
13. The electrical connector as claimed in claim 12, wherein the via hole has a shirting margin extending into a cover hole of the cover for receiving the cam.
14. The electrical connector as claimed in claim 10, wherein the cam includes a protrusion thereof, the protrusion is stopped by the stoppers at 180 degree to limit the distance of the cover moving relative to the base.
15. An electrical connector comprising:
an insulative base defining a plurality of passageways and a through hole in a head portion thereof;
a plurality of contacts disposed in the corresponding passageways, respectively;
an insulative cover mounted upon the slidable relative to the base, said cover defining a plurality of through passages in vertical alignment with the corresponding passageways, respectively, and a through aperture in thereof a head section in vertical alignment with the corresponding through hole of the base;
a cam extending axially and vertically in both said through hole and said through aperture; and
a protecting mechanism including a metallic cover plate mounted to an undersurface of the cover and defining another through hole via a drawing process to form a tubular section extending upwardly into the through aperture and engaged with the cam for operation; wherein
said tubular section is sandwiched between the cam and the cover diametrically.
16. The electrical connector as claimed in claim 15, wherein said cover plate is further equipped with a pair of upwardly extending stoppers to fasten the cover plate to the cover.
17. The electrical connector as claimed in claim 15, wherein said cover plate is further equipped with a pair of horizontally extending stiffeners to upwardly abut against the cover.