1-13. (canceled)
14. A method of producing a polytetrafluoroethylene laminated article, wherein after a polytetrafluoroethylene sheet and heat-meltable resin film or sheet are directly subjected to thermo-fusing, a rapid temperature lowering is prevented to sufficiently crystallize molten polytetrafluoroethylene.
15-30. (canceled)
31. The production method of claim 14, wherein the laminated article is held within a temperature range of less than a melting point of polytetrafluoroethylene and not less than 300\xb0 C. to prevent a rapid temperature lowering.
32. The production method of claim 14, wherein a polytetrafluoroethylene sheet having a specific weight exceeding 2.175 is used as said polytetrafluoroethylene sheet.
33. The production method of claim 14, wherein a heat resistant woven fabric is overlaid on the opposite side of said heat-meltable resin film or sheet, and the heat-meltable resin film or sheet and the heat resistant woven fabric are subjected to thermo-fusing.
34. The production method of claim 33, wherein the heating is carried out from the side of heat resistant woven fabric.
35. (canceled)
36. The production method of claim 14, wherein a laminated article having a layered structure comprising a polytetrafluoroethylene sheet having an average specific weight of not less than 2.175 and a heat-meltable resin layer is produced by using a polytetrafluoroethylene sheet having a specific weight exceeding 2.175 as said polytetrafluoroethylene sheet.
37. The production method of claim 14, wherein a laminated article having a layered structure obtained by laminating a polytetrafluoroethylene sheet having an average specific weight of not less than 2.175 and a heat resistant woven fabric by interposing a heat-meltable resin layer therebetween is produced by using a polytetrafluoroethylene sheet having a specific weight exceeding 2.175 as said polytetrafluoroethylene sheet.
38. The production method of claim 14, wherein the heating is stopped at a time when an un-molten layer remains in said polytetrafluoroethylene sheet.
39. The production method of claim 14, wherein a polytetrafluoroethylene sheet surface reverse to the laminated surface thereof is heat-treated at a temperature of not less than a melting point of polytetrafluoroethylene before or after said thermo-fusing or at the same time as said thermo-fusing.
40. The production method of claim 14, wherein the laminated article is a backing sheet.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. Flip-flop circuitry comprising:
first and second inverter circuits;
first and second passgate circuits for respectively applying an input signal to the first inverter circuit and an output signal of the first inverter circuit to the second inverter circuit in response to respective first and second phases of a first control signal; and
a third passgate circuit connected in parallel with the second passgate circuit and responsive to a second control signal, wherein the parallel combination comprising the second and third passgate circuits is connected in series between the first and second inverter circuits.
2. The circuitry defined in claim 1 wherein the first control signal is a clock signal.
3. The circuitry defined in claim 1 wherein each of the inverter circuits consists essentially of a pair of CMOS transistors.
4. The circuitry defined in claim 1 wherein each of the first and second passgate circuits consists essentially of a pair of CMOS transistors.
5. The circuitry defined in claim 1 wherein the third passgate circuit consists essentially of a pair of CMOS transistors.
6. The circuitry defined in claim 1 further comprising:
a third inverter circuit for receiving the first phase of the first control signal and for producing therefrom the second phase of the first control signal.
7. The circuitry defined in claim 6 wherein the third inverter circuit consists essentially of a pair of CMOS transistors.
8. The circuitry defined in claim 6 wherein the flip-flop circuitry consists essentially of the first, second, and third inverter circuits and the first, second, and third passgate circuits.
9. The circuitry defined in claim 1 wherein the sole circuitry connected between a data output terminal of the first passgate circuit and a data input terminal of the second passgate circuit is a pair of CMOS transistors forming the first inverter circuit.
10. The circuitry defined in claim 1 wherein the sole circuitry connected between a data output terminal of the second passgate circuit and a data output terminal of the flip-flop circuitry is a pair of CMOS transistors forming the second inverter circuit.
11. A plurality of flip-flop circuitries as defined in claim 1 connected in a series with one another.
12. The plurality of flip-flop circuitries connected in a series as defined in claim 11 further comprising a plurality of scan flip-flop circuitries connected within the series.
13. The plurality of flip-flop circuitries connected in a series as defined in claim 11 further comprising circuitry for applying the second control signal of at least one of the flip-flop circuits,
wherein said circuitry applying increases or decreases an amount of time it takes for a signal to propagate through the series of flip-flop circuitries.
14. The plurality of flip-flop circuitries connected in a series as defined in claim 11 further comprising a plurality of combinatorial logic circuitries connected within the series.
15. The plurality of flip-flop circuitries connected in a series as defined in claim 11 further comprising a scan chain connected to the said plurality of flip-flop circuitries.
16. Scan chain circuitry comprising:
a first and a second plurality of scan flip-flop circuitries connected together to form a first and a second scan chain; and
a plurality of bypass flip-flop circuitries connected together to form at least one serial chain, wherein the at least one serial chain is connected between one of the first plurality of scan flip-flop circuitries and one of the second plurality of scan flip-flop circuitries, wherein each of the plurality of bypass flip-flop circuitries comprises:
first and second inverter circuits,
first and second passgate circuits for respectively applying an input signal to the first inverter circuit and an output signal of the first inverter circuit to the second inverter circuit in response to respective first and second phases of a first control signal, and
a third passgate circuit connected in parallel with the second passgate circuit and responsive to a second control signal, wherein the parallel combination comprising the second and third passgate circuits is connected in series between the first and second inverter circuits.
17. The scan chain circuitry of claim 16 further comprising combinatorial logic circuitries connected within the at least one serial chain.
18. The scan chain circuitry of claim 16 wherein a test vector is shifted into the first scan chain.
19. The scan chain circuitry of claim 16 wherein an output vector is shifted out of the second scan chain.
20. The scan chain circuitry of claim 16 wherein the plurality of bypass flip-flop circuitries are in bypass mode.
21. Flip-flop apparatus comprising:
first passgate means for applying an input signal to a first means for inverting in response to a first phase of a first control signal;
second passgate means for applying the output of the first means for inverting to a second means for inverting in response to a second phase of the first control signal; and
third passgate means for applying connected in parallel with the second passgate means for applying and responsive to a second control signal, wherein the parallel combination comprising the second and third passgate means for applying is connected in series between the first and second means for inverting.
22. The apparatus defined in claim 21 wherein the first control signal is a clock signal.
23. The apparatus defined in claim 21 wherein each of the means for inverting consists essentially of a pair of CMOS transistors.
24. The apparatus defined in claim 21 wherein each of the first and second passgate means for applying consists essentially of a pair of CMOS transistors.
25. The apparatus defined in claim 21 wherein the third passgate means for applying consists essentially of a pair of CMOS transistors.
26. The apparatus defined in claim 21 further comprising:
third means for inverting for receiving the first phase of the first control signal and for producing therefrom the second phase of the first control signal.
27. The apparatus defined in claim 26 wherein the third means for inverting consists essentially of a pair of CMOS transistors.
28. The apparatus defined in claim 26 wherein the flip-flop apparatus consists essentially of the first, second, and third means for inverting and the first, second, and third passgate means for applying.
29. The apparatus defined in claim 21 wherein the sole circuitry connected between a data output terminal of the first passgate means for applying and a data input terminal of the second passgate means for applying is a pair of CMOS transistors forming the first means for inverting.
30. The apparatus defined in claim 21 wherein the sole circuitry connected between a data output terminal of the second passgate means for applying and a data output terminal of the flip-flop apparatus is a pair of CMOS transistors forming the second means for inverting.
31. A plurality of flip-flop apparatuses as defined in claim 21 connected in a series with one another.
32. The plurality of flip-flop apparatuses connected in a series as defined in claim 31 further comprising a plurality of scan flip-flop apparatuses connected within the series.
33. The plurality of flip-flop apparatuses connected in a series as defined in claim 31 further comprising means for applying the second control signal of at least one of the flip-flop circuits,
wherein said means for applying increases or decreases an amount of time it takes for a signal to propagate through the series of flip-flop apparatuses.
34. The plurality of flip-flop apparatuses connected in a series as defined in claim 31 further comprising a plurality of combinatorial logic apparatuses connected within the series of flip-flop apparatuses.
35. The plurality of flip-flop apparatuses connected in a series as defined in claim 31 further comprising a scan chain apparatus connected to said plurality of flip-flop apparatuses.
36. Scan chain apparatus comprising:
a first and a second plurality of scan flip-flop means connected together to form a first and a second scan chain means; and
a plurality of bypass flip-flop means connected together to form at least one serial chain means, wherein the at least one serial chain means is connected between one of the first plurality of scan flip-flop means and one of the second plurality of scan flip-flop means, wherein each of the plurality of bypass flip-flop means comprises:
first passgate means for applying an input signal to a first means for inverting in response to a first phase of a first control signal,
second passgate means for applying the output of the first means for inverting to a second means for inverting in response to a second phase of the first control signal, and
third passgate means for applying connected in parallel with the second passgate means for applying and responsive to a second control signal, wherein the parallel combination comprising the second and third passgate means for applying is connected in series between the first and second means for inverting.
37. The scan chain apparatus of claim 36 further comprising combinatorial logic means connected within the at least one serial chain means.
38. The scan chain apparatus of claim 36 wherein a test vector means is shifted into the first scan chain means.
39. The scan chain apparatus of claim 36 wherein an output vector means is shifted out of the second scan chain means.
40. The scan chain apparatus of claim 36 wherein the plurality of bypass flip-flop means are in bypass mode.
41. A method of flip-flop circuit operation comprising:
applying with first passgate circuitry an input signal to a first inverter in response to a first phase of a first control signal;
using the first inverter to invert the input signal to produce a first inverter output signal;
further applying with second passgate circuitry the first inverter output signal to a second inverter in response to a second phase of the first control signal;
alternatively applying with third passgate circuitry the first inverter output signal to the second inverter in response to a second control signal; and
using the second inverter to invert the first inverter output signal as applied to the second inverter by the further applying or the alternatively applying.
42. The method of claim 41 wherein the first control signal is a clock signal.
43. The method of claim 41 wherein each of the inverters consists essentially of a pair of CMOS transistors.
44. The method of claim 41 wherein the first passgate circuitry consists essentially of a pair of CMOS transistors.
45. The method of claim 41 wherein the second passgate circuitry consists essentially of a pair of CMOS transistors.
46. The method of claim 41 wherein the third passgate circuitry consists essentially of a pair of CMOS transistors.
47. The method of claim 41 further comprising:
receiving the first phase of the first control signal with a third inverter; and
using the third inverter to invert the received first phase of the first control signal to produce therefrom the second phase of the first control signal.
48. The method of claim 47 wherein the third inverter consists essentially of a pair of CMOS transistors.
49. A method of scan chain operation comprising:
connecting a first and a second plurality of scan flip-flop circuitries together to form a first and a second scan chain;
connecting a plurality of bypass flip-flop circuitries together to form at least one serial chain; and
connecting the at least one serial chain between one of the first plurality of scan flip-flop circuitries and one of the second plurality of scan flip-flop circuitries, wherein the operation of each of the plurality of bypass flip-flop circuitries comprises:
applying with first passgate circuitry an input signal to a first inverter in response to a first phase of a first control signal,
using the first inverter to invert the input signal to produce a first inverter output signal,
further applying with second passgate circuitry the first inverter output signal to a second inverter in response to a second phase of the first control signal,
alternatively applying with third passgate circuitry the first inverter output signal to the second inverter in response to a second control signal, and
using the second inverter to invert the first inverter output signal as applied to the second inverter by the further applying or the alternatively applying.
50. The method of claim 49 further comprising connecting combinatorial logic circuitries within the at least one serial chain.
51. The method of claim 49 further comprising shifting a test vector into the first scan chain.
52. The method of claim 49 further comprising shifting an output vector out of the second scan chain.
53. The method of claim 49 further comprising putting the plurality of bypass flip-flop circuitries into bypass mode.