1. An apparatus comprising:
a housing, said housing comprising a substantially spherical shape;
at least one aperture, said at least one aperture being configured to at least partially receive an organ; and
at least one channel, said at least one channel being configured to extend from said at least one aperture into an inner portion of said housing, said at least one channel further being configured to engage said organ.
2. The apparatus of claim (1), in which said housing comprises at least one grip portion, said at least one grip portion being configured to be operable to be gripped by at least one finger.
3. The apparatus of claim (1), wherein said housing is configured to be operable to be held by a hand for manipulating the apparatus in at least a 180 degree range.
4. The apparatus of claim (1), in which said housing comprises a substance, said substance being configured to enhance stimulation of said organ.
5. The apparatus of claim (1), in which said housing comprises a casing, said casing being configured to help protect internal components of said apparatus.
6. The apparatus of claim (1), in which said housing comprises silicone.
7. The apparatus of claim (1), in which said housing comprises a diameter of 7 inches and a circumference of 21.99 inches.
8. The apparatus of claim (1), in which said at last one aperture comprises a perimeter, said perimeter comprising a semi-rigid boundary for providing structure to said at least one aperture.
9. The apparatus of claim (1), in which said at least one aperture comprises a female sexual organ shape and texture.
10. The apparatus of claim (1), in which said at least one aperture comprises a cover, said cover being configured to regulate access to said at least one channel.
11. The apparatus of claim (1), in which said at least one channel comprises a female sexual organ shape and texture.
12. The apparatus of claim (1), in wherein said at least one channel comprises different diameters.
13. The apparatus of claim (1), in which said at least one channel comprises different orientations.
14. The apparatus of claim (1), in which said at least one channel comprises a water vessel, said water vessel being configured to provide stimulation to said organ.
15. The apparatus of claim (1), in which said at least one channel comprises a plurality of waves, andor a plurality of dimples, andor a plurality of ridges.
16. The apparatus of claim (1), in which said at least one channel comprises a warming device, said warming device being configured to provide stimulation to said organ.
17. The apparatus of claim (1), in which said at least one channel comprises a vibrating device, said vibrating device being configured to provide stimulation to said organ.
18. The apparatus of claim (1), in which said at least one channel comprises a pressure chamber, said pressure chamber being configured to provide stimulation to said organ.
19. An apparatus comprising:
means for grasping a housing with at least one grip portion;
means for positioning an organ in proximity to said housing;
means for removing a cover from at least one aperture;
means for at least partially inserting said organ through said at least one aperture;
means for engaging said organ with at least one channel; and
means for manipulating said housing in a 180 degree range to stimulate said organ.
20. An apparatus consisting of:
a housing, said housing comprising a substantially spherical shape, said housing further comprising at least one grip portion, said at least one grip portion being configured to be operable to grip by at least one finger for manipulating said housing in a 180 degree range, said housing further comprising a substance, said housing further comprising silicone, said housing further comprising a casing, said casing further being configured to help protect internal components of said apparatus;
at least one aperture, said at least one aperture being configured to at least partially receive an organ, said at least one aperture comprising a cover for regulating access to said housing, said at least one aperture further comprising a perimeter, said perimeter comprising a semi-rigid boundary for providing structure to said at least one aperture, said at least one aperture further comprising a female sexual organ shape and texture; and
at least one channel, said at least one channel being configured to extend from said at least one aperture into an inner portion of said housing, said at least one channel further being configured to engage said organ, said at least one channel comprising different diameters, said at least one channel further comprising different textures, said at least one channel further comprising a water vessel, said at least one channel further comprising a pressure chamber.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A structure comprising:
an integrated circuit chip having a set of micro-channels;
an electro-rheological coolant fluid filling said micro-channels;
first and second parallel channel electrodes on opposite sides of at least one micro-channel, said first channel electrode connected to an output of an auto-compensating temperature control circuit, said second channel electrode connected to ground; and
said auto-compensating temperature control circuit comprising a temperature stable current source connected between a positive voltage rail and said output and having a temperature sensitive circuit connected between ground and said output, a leakage current of said temperature stable current source being essentially insensitive to temperature and a leakage current of said temperature sensitive circuit increasing with temperature.
2. The structure of claim 1, wherein said temperature stable current source comprises a PFET, a gate and a source of said PFET connected to said positive voltage rail and a drain of said PFET connected to said output.
3. The structure of claim 1, wherein said temperature stable current source comprises a bandgap voltage source, an output of said bandgap voltage source connected to said output.
4. The structure of claim 1, wherein said temperature sensitive current source is an NFET biased below pinch-off, a drain of said NFET connected to said output, a gate and a source of said NFET connected to ground and a body of said NFET connected to a body bias voltage signal.
5. The structure of claim 1, wherein said temperature sensitive current source comprises a set of n NFETs, each NFET of said set of NFETs biased below pinch off, drain of each NFET of said set of NFETs connected to said output, a source of each NFET of said set of NFETs connected to ground and a gate each NFET of said set of said NFETs connected to a select bias voltage signal.
6. The structure of claim 1, wherein:
said temperature stable current source comprises a PFET and one or more current mirror PFETS, sources of said PFET and said one more mirror PFETs connected to said positive voltage rail, gates of said PFET and said mirror PFETs and a drain of said PFET connected to ground through a temperature compensated current source, drains of said one or more mirror PFETs connected to a respective output of said auto-compensating temperature control circuit; and
said temperature stable current source comprises a PFET, a gate of and as source of said PFET connected to said positive voltage rail and a drain of said PFET connected to said output.
7. The structure of claim 1, wherein:
said temperature stable current source comprises a PFET and one or more current mirror PFETS, sources of said PFET and said one more mirror PFETs connected to said positive voltage rail, gates of said PFET and said mirror PFETs and a drain of said PFET connected to ground through a temperature compensated current source, drains of said one or more mirror PFETs connected to a respective output of said auto-compensating temperature control circuit; and
said temperature stable current source comprises a bandgap voltage source, an output of said bandgap voltage source connected to said output.
8. The structure of claim 1, wherein said coolant is an electro-rheological fluid having a lower viscosity in the absence of an electric field and a higher viscosity in the presence of an electric field.
9. The structure of claim 1, wherein said micro-channels are formed in a semiconductor layer proximate to a backside of said integrated circuit chip and functional circuits and said auto-compensating temperature control circuit are formed in said semiconductor layer of said integrated circuit chip proximate to a frontside of said integrated circuit chip.
10. The structure of claim 1, further including:
opposite ends of said micro-channels connected to first and second reservoirs in said semiconductor layer proximate to said backside of said integrated circuit chip;
means for circulating said electro-rheological coolant fluid from said first reservoir, through unblocked micro-channels to said second reservoir and back to said first reservoir; and
means for cooling said electro-rheological coolant fluid.
11. A method, comprising
providing an integrated circuit chip comprising:
a set of micro-channels;
an electro-rheological coolant fluid filling said micro-channels;
first and second parallel channel electrodes on opposite sides of at least one micro-channel, said first channel electrode connected to an output of an auto-compensating temperature control circuit, said second channel electrode connected to ground; and
said auto-compensating temperature control circuit comprising a temperature stable current source connected between a positive voltage rail and said output and having a temperature sensitive circuit connected between ground and said output, a leakage current of said temperature stable current source being essentially insensitive to temperature and a leakage current of said temperature sensitive circuit increasing with temperature; and
adjusting the flow of electro-rheological coolant fluid automatically based on the temperature of said auto-compensating temperature control circuit.
12. The method of claim 11, wherein said temperature stable current source comprises a PFET, a gate and a source of said PFET connected to said positive voltage rail and a drain of said PFET connected to said output.
13. The method of claim 11, wherein said temperature stable current source comprises a bandgap voltage source, an output of said bandgap voltage source connected to said output.
14. The method of claim 11, wherein said temperature sensitive current source is an NFET biased below pinch-off, a drain of said NFET connected to said output, a gate and a source of said NFET connected to ground and a body of said NFET connected to a body bias voltage signal.
15. The method of claim 11, wherein said temperature sensitive current source comprises a set of n NFETs, each NFET of said set of NFETs biased below pinch off, drain of each NFET of said set of NFETs connected to said output, a source of each NFET of said set of NFETs connected to ground and a gate each NFET of said set of said NFETs connected to a select bias voltage signal.
16. The method of claim 11, wherein:
said temperature stable current source comprises a PFET and one or more current mirror PFETS, sources of said PFET and said one more mirror PFETs connected to said positive voltage rail, gates of said PFET and said mirror PFETs and a drain of said PFET connected to ground through a temperature compensated current source, drains of said one or more mirror PFETs connected to a respective output of said auto-compensating temperature control circuit; and
said temperature stable current source comprises a PFET, a gate of and as source of said PFET connected to said positive voltage rail and a drain of said PFET connected to said output.
17. The method of claim 11, wherein:
said temperature stable current source comprises a PFET and one or more current mirror PFETS, sources of said PFET and said one more mirror PFETs connected to said positive voltage rail, gates of said PFET and said mirror PFETs and a drain of said PFET connected to ground through a temperature compensated current source, drains of said one or more mirror PFETs connected to a respective output of said auto-compensating temperature control circuit; and
said temperature stable current source comprises a bandgap voltage source, an output of said bandgap voltage source connected to said output.
18. The method of claim 11, wherein said coolant is an electro-rheological fluid having a lower viscosity in the absence of an electric field and a higher viscosity in the presence of an electric field and said auto-compensating temperature control circuit applies an electric field across said first and second channel electrodes that is a function of the temperature of said auto-compensating temperature control circuit.
19. The method of claim 11, wherein said micro-channels are formed in a semiconductor layer proximate to a backside of said integrated circuit chip and functional circuits and said auto-compensating temperature control circuit are formed in said semiconductor layer of said integrated circuit chip proximate to a frontside of said integrated circuit chip.
20. The method of claim 11, further including:
opposite ends of said micro-channels connected to first and second reservoirs in said semiconductor layer proximate to said backside of said integrated circuit chip;
circulating said electro-rheological coolant fluid from said first reservoir, through said micro-channels to said second reservoir and back to said first reservoir; and
cooling said electro-rheological coolant fluid during said circulation.