What is claimed is:
1. An electronic component comprising:
a base member having a plurality of electrode lands;
an electronic component element having a plurality of electrode pads and being electrically and mechanically joined to the base member;
a plurality of bumps located between the electronic component element and the base member, the plurality of electrode pads of the electronic component element and the corresponding electrode lands of the base member being respectively joined together via the bumps such that the electronic component is opposite to the base member; wherein
the bumps located at the peripheral portion of the electronic component element have a greater height than that of the bumps located in the approximate central portion of the electronic component element.
2. An electronic component according to claim 1, wherein the electrode land located at the approximate central portion of the base member has a larger thickness than thicknesses of the electrode lands located along the peripheral portion.
3. An electronic component according to claim 1, wherein the base member is arranged such that a forming portion of the electrode land located at the approximate central portion projects toward the electronic component element.
4. An electronic component according to claim 1, wherein the base member is curved so that a forming portion of the electrode land located at the approximate central portion is close to the electronic component element.
5. An electronic component according to claim 1, wherein the electrode pads located at the approximate central portion of the electronic component element have a larger thickness than those of the electrode pads located along the peripheral portion.
6. An electronic component according to claim 1, wherein the differences between heights of the bumps are about 1 m to about 10 m.
7. An electronic component according to claim 1, wherein the electronic component element is a surface acoustic wave element.
8. An electronic component according to claim 1, further comprising a cap member joined to the base member so as to cover the electronic component element and such that the electronic component element is hermetically sealed within a package defined by the base member and the cap member.
9. An electronic component according to claim 1, wherein the electrode lands are made of thick film electrodes of W or Mo and have Ni or Au plated thereon.
10. An electronic component according to claim 1, wherein the electrode pads are made of one of Al and an alloy including Al.
11. An electronic component according to claim 1, wherein the bumps are made of one of Au, a metal including Au as the main ingredient, and solder.
12. A method of manufacturing an electronic component, comprising the steps of:
providing a base member having a plurality of electrode lands;
providing an electronic component having a plurality of electrode pads and being electrically and mechanically joined to the base member;
forming a plurality of bumps on one of the base member and the electronic component member;
arranging the electronic component element opposite to the base member; and
joining the base member and the electronic component element via the plurality of bumps between the electronic component element and the base member, the plurality of electrode pads of the electronic component element and the corresponding electrode lands of the base member being respectively joined together via the bumps such that the electronic component is opposite to the base member; wherein
the step of forming the bumps includes forming the bumps located at the peripheral portion of the electronic component element to have a greater height than that of the bumps located in the approximate central portion of the electronic component element.
13. The method according to claim 12, wherein the electrode land located at the approximate central portion of the base member has a larger thickness than thicknesses of the electrode lands located along the peripheral portion.
14. The method according to claim 12, wherein the base member is arranged such that a forming portion of the electrode land located at the approximate central portion projects toward the electronic component element.
15. The method according to claim 12, wherein the base member is curved so that a forming portion of the electrode land located at the approximate central portion is close to the electronic component element.
16. The method according to claim 12, wherein the electrode pads located at the approximate central portion of the electronic component element have a larger thickness than those of the electrode pads located along the peripheral portion.
17. The method according to claim 12, wherein the differences between heights of the bumps are about 1 m to about 10 m.
18. The method according to claim 12, wherein the electronic component element is a surface acoustic wave element.
19. The method according to claim 12, further comprising applying at least one of heat and ultrasonic waves during the step of joining the base member and the electronic component member so as to fuse the bumps.
20. The method according to claim 12, further comprising forming the bumps on the electrode pads of the electronic component element via a ball bonding process.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of coding at least one integral image representative of at least one object in perspective in a scene, said method comprising the following steps performed by a coding device:
applying a discrete wavelet transform directly to the pixels of said integral image, thereby delivering a plurality of transformed coefficients; and
coding said delivered transformed coefficients.
2. The method of coding according to claim 1, wherein said step of applying a discrete wavelet transform is iterated a plurality of times.
3. The method of coding according to claim 1, wherein the coding of said transformed coefficients is performed in accordance with the MPEG-4 standard.
4. The method of coding according to claim 1, wherein during said coding step, said delivered transformed coefficients are quantified directly and then submitted to entropic coding.
5. The method of coding according to claim 1, wherein, during said coding step, among said delivered transformed coefficients:
only the delivered transformed coefficients that are representative of an approximation of the integral image are coded in accordance with the MPEG-4 standard; and
the other delivered transformed coefficients are quantified directly and then subjected to entropic coding.
6. A coder device for coding at least one integral image representative of at least one object in perspective in a scene, said device comprising:
calculation means for applying a discrete wavelet transform directly to the pixels of said integral image to deliver a plurality of transformed coefficients; and
coder means for coding said delivered transformed coefficients.
7. A non-transmissible computer readable data medium comprising a computer program stored thereon and including instructions for performing a method of coding at least one integral image representative of at least one object in perspective in a scene, when the instructions are executed on a computer, said method comprising:
applying a discrete wavelet transform directly to the pixels of said integral image, thereby delivering a plurality of transformed coefficients; and
coding said delivered transformed coefficients.
8. A method of decoding a data signal representative of at least one integral image that has previously been coded, said integral image being representative of at least one object in perspective in a scene, said method comprising the following steps performed by a decoding device:
decoding the data of said signal, to deliver a plurality of discrete wavelet transform coefficients; and
directly reconstructing the pixels of the integral image by applying an inverse discrete wavelet transform to said delivered discrete wavelet transform coefficients.
9. The method of decoding according to claim 8, wherein said step of applying an inverse discrete wavelet transform is iterated a plurality of times.
10. The method of decoding according to claim 8, wherein the decoding of the data of said signal is performed in accordance with the MPEG-4 standard.
11. The method of decoding according to claim 8, wherein during said decoding step, said delivered transformed coefficients are subjected solely to entropic decoding, and then to inverse quantification.
12. The method of decoding according to claim 8, wherein during said decoding step, from among said delivered transformed coefficients:
only the delivered transformed coefficients that are representative of an approximation of the integral image are decoded in accordance with the MPEG-4 standard; and
the other delivered transformed coefficients are subjected directly to entropic decoding, and then to inverse quantification.
13. A decoder device for decoding a data signal representative of at least one integral image that has previously been coded, said device comprising:
decoder means for decoding data of said signal to deliver a plurality of discrete wavelet transform coefficients; and
calculation means for directly reconstructing the pixels of the integral image by applying an inverse discrete wavelet transform to said delivered discrete wavelet transform coefficients.
14. A non-transmissible computer readable data medium comprising a computer program stored thereon and including instructions for performing a method of decoding a data signal representative of at least one integral image that has previously been coded, when the instructions are executed on a computer, said integral image being representative of at least one object in perspective in a scene, wherein said method comprises:
decoding the data of said signal, to deliver a plurality of discrete wavelet transform coefficients; and
directly reconstructing the pixels of the integral image by applying an inverse discrete wavelet transform to said delivered discrete wavelet transform coefficients.