1. A heat treatment apparatus for successive heat treatment of substrates, comprising:
a hot plate portion for subjecting the substrate to which a coating liquid is applied to heat treatment;
a cooling plate for cooling said substrate;
a drive mechanism for moving said cooling plate between a home position where said substrate is passed between said cooling plate and an external transfer mechanism and a position above said hot plate portion where said substrate is passed between said cooling plate and said hot plate portion;
a heating mechanism for heating said cooling plate;
a temperature detection portion for detecting a temperature of said cooling plate; and
a control unit outputting a control signal for controlling an amount of heat received by said cooling plate from said heating mechanism such that a temperature value detected by said temperature detection portion is set to a prescribed temperature before start of successive treatment of said substrate, said control unit outputting said control signal such that a surface temperature of said cooling plate immediately before reception from said hot plate portion, of said substrate to be treated first after start of the successive treatment of said substrates and a surface temperature of said cooling plate immediately before reception from said hot plate portion, of said substrate to be treated second are brought closer to each other.
2. The heat treatment apparatus according to claim 1, wherein
temperature difference between the surface temperature of said cooling plate immediately before reception from said hot plate portion, of said substrate to be treated first after start of the successive treatment and the surface temperature of said cooling plate immediately before reception from said hot plate portion, of said substrate to be treated second is within a range of 10\xb0 C.
3. The heat treatment apparatus according to claim 1, wherein
said heating mechanism is included in said hot plate portion, and said control signal includes a signal for controlling said drive mechanism in order to adjust a time period during which said cooling plate stays above said hot plate portion.
4. The heat treatment apparatus according to claim 1, wherein
said heating mechanism is provided in said cooling plate, and said control signal includes a signal for controlling an amount of heat generated by said heating mechanism.
5. The heat treatment apparatus according to claim 1, further comprising a cooling mechanism for forcibly cooling said cooling plate.
6. The heat treatment apparatus according to claim 5, wherein
said substrates include a first substrate and a second substrate treated next to the first substrate, and
if a temperature for heat treatment of said second substrate by said hot plate portion is lower than that of said first substrate, said control unit outputs said control signal such that the cooling plate is cooled by said cooling mechanism by a time when said cooling plate receives said second substrate from said external transfer mechanism, after said first substrate is passed from said cooling plate to said external transfer mechanism.
7. The heat treatment apparatus according to claim 5, wherein
said cooling mechanism cools said cooling plate by blowing a gas.
8. A heat treatment method of performing successive heat treatment of substrates using a heat treatment apparatus, said heat treatment apparatus including a hot plate portion for subjecting said substrate to which a coating liquid is applied to heat treatment, a cooling plate for cooling said substrate, a drive mechanism for moving said cooling plate, and a heating mechanism for heating said cooling plate, comprising the steps of:
moving said cooling plate, by means of said drive mechanism, between a home position where said substrate is passed between said cooling plate and an external transfer mechanism and a position above said hot plate portion where said substrate is passed between said cooling plate and said hot plate portion; and
heating said cooling plate with said heating mechanism before start of successive treatment of said substrate, in order to bring closer to each other a surface temperature of said cooling plate immediately before reception from said hot plate portion, of said substrate to be treated first after start of the successive treatment of said substrates and a surface temperature of said cooling plate immediately before reception from said hot plate portion, of said substrate to be treated second.
9. The heat treatment method according to claim 8, wherein
temperature difference between the surface temperature of said cooling plate immediately before reception from said hot plate portion, of said substrate to be treated first after start of the successive treatment and the surface temperature of said cooling plate immediately before reception from said hot plate portion, of said substrate to be treated second is within a range of 10\xb0 C.
10. The heat treatment method according to claim 8, wherein
said step of heating said cooling plate with said heating mechanism includes the step of heating said cooling plate by positioning said cooling plate above said hot plate portion serving as said heating mechanism.
11. The heat treatment method according to claim 8, wherein
said step of heating said cooling plate with said heating mechanism includes the step of heating said cooling plate with said heating mechanism provided in said cooling plate.
12. The heat treatment method according to claim 8, further comprising the step of forcibly cooling said cooling plate.
13. The heat treatment method according to claim 12, wherein
said substrates include a first substrate and a second substrate treated next to the first substrate, and
if a temperature for heat treatment of said second substrate by said hot plate portion is lower than that of said first substrate, said cooling plate is forcibly cooled by a time when said cooling plate receives said second substrate from said external transfer mechanism, after said first substrate is passed from said cooling plate to said external transfer mechanism.
14. The heat treatment method according to claim 12, wherein
said step of forcibly cooling said cooling plate includes the step of cooling said cooling plate by blowing a gas.
15. A recording medium storing a computer program used in a heat treatment apparatus,
said heat treatment apparatus including a hot plate portion for subjecting a substrate to which a coating liquid is applied to heat treatment, a cooling plate for cooling said substrate, a drive mechanism for moving said cooling plate, and a heating mechanism for heating said cooling plate, and
said computer program being configured to carry out the heat treatment method according to claim 8.
The claims below are in addition to those above.
All refrences to claims which appear below refer to the numbering after this setence.
What is claimed is:
1. A method for correcting a disc type determination, comprising the steps of:
detecting a tracking error signal; and
verifying accuracy of a disc type determination according to the tracking error signal.
2. The method of claim 1, before verifying the accuracy of a disc type determination, further comprising low-pass filtering of the tracking error signal and producing a low-pass filtered signal.
3. The method of claim 2, wherein verification of the accuracy of the disc type determination is performed by comparing the low-pass filtered signal with a predetermined threshold.
4. The method of claim 2, before verifying the accuracy of a disc type determination, further comprising a normalization process of the tracking error signal.
5. The method of claim 4, wherein verification of the accuracy of the disc type determination is performed by comparing a real gain produced in the normalization with a predetermined threshold gain.
6. The method of claim 4, wherein verification of the accuracy of the disc type determination is performed by determination of whether normalization time exceeds a predetermined limit.
7. A method for correcting an erroneous disc type determination, comprising:
low-pass filtering a tracking error signal and producing a low-pass filtered signal; and
verifying accuracy of a disc type determination according to the low-pass filtered signal.
8. The method of claim 7, wherein verification of the accuracy of the disc type determination is performed by identifying whether a highest filtered peak value of the low-pass filtered signal is less than a predetermined threshold.10. The method of claim 7, further comprising normalization of the track error signal.
9. The method of claim 7, wherein verification of the accuracy of the disc type determination is performed by identifying whether a real gain produced in the normalization excess a predetermined threshold gain.
10. The method of claim 7, wherein verification of the accuracy of the disc type determination is performed by identification of whether normalization time exceeds a predetermined limit.