What is claimed is:
1. A charged-particle-beam microlithography apparatus for transferring a pattern, defined on a segmented reticle in which the pattern is divided into multiple subfields each defining a respective portion of the pattern, to a sensitive substrate, the apparatus comprising:
a substrate stage configured to hold the substrate;
a reticle stage situated upstream of the substrate stage and configured to hold the reticle;
an illumination-optical system situated upstream of the reticle stage and configured to successively illuminate groups of subfields on the reticle using a charged-particle illumination beam, each group consisting of at least one respective subfield;
a projection-optical system situated between the reticle stage and the substrate stage, the projection-optical system being configured to direct an imaging beam, formed from particles of the illumination beam passing through the reticle, to the substrate such that respective images of the illuminated subfields are formed at respective positions on the substrate serving to stitch the images together; and
a main controller connected to the reticle stage, substrate stage, illumination-optical system, and projection-optical system, the main controller being configured to command one or both the illumination-optical system and the projection-optical system to perform a respective optical correction as each subfield is being exposed, the optical correction being based on respective reticle-pattern-inspection data for each of the subfields.
2. The apparatus of claim 1, wherein the optical correction is selected from a group consisting of shape-astigmatic aberration, focusing-astigmatic aberration, image focal point, image rotation, image magnification, and image position on the substrate.
3. The apparatus of claim 1, wherein the optical correction is made according to one or more respective correction values determined by actual measurement data of the pattern as defined on the reticle.
4. The apparatus of claim 3, wherein the correction values include one or more apparatus constants selected from a group consisting of beam-acceleration voltage, beam-current density, beam-divergence angle, and optical-system length.
5. A method for performing charged-particle-beam microlithography of a pattern to a sensitive substrate, the method comprising:
(a) defining the pattern on a segmented reticle in which the pattern is divided into multiple subfields each defining a respective portion of the pattern;
(b) successively illuminating groups of subfields on the reticle using a charged-particle illumination beam, each group consisting of at least one respective subfield;
(c) as each group of subfields is illuminated, directing an imaging beam, formed from particles of the illumination beam passing through the reticle, to the substrate such that respective images of the illuminated subfields are formed at respective positions on the substrate serving to stitch the images together; and
(d) as each subfield is exposed, performing a respective optical correction that is based on respective reticle-pattern-inspection data for each of the subfields.
6. The method of claim 5, wherein the optical correction is selected from a group consisting of shape-astigmatic aberration, focusing-astigmatic aberration, image focal point, image rotation, image magnification, and image position on the substrate.
7. The method of claim 5, wherein the optical correction is made according to one or more respective correction values determined by actual measurement data of the pattern as defined on the reticle.
8. The method of claim 7, wherein the correction values include one or more apparatus constants selected from a group consisting of beam-acceleration voltage, beam-current density, beam-divergence angle, and optical-system length.
9. A charged-particle-beam microlithography apparatus for transferring a pattern, defined on a segmented reticle in which the pattern is divided into multiple subfields each defining a respective portion of the pattern, to a sensitive substrate, the apparatus comprising:
a substrate stage configured to hold the substrate;
a reticle stage situated upstream of the substrate stage and configured to hold the substrate;
an illumination-optical system situated upstream of the reticle stage and configured to successively illuminate groups of subfields on the reticle using a charged-particle illumination beam, each group consisting of at least one respective subfield;
a projection-optical system situated between the reticle stage and the substrate stage, the projection-optical system being configured to direct an imaging beam, formed from particles of the illumination beam passing through the reticle, to the substrate such that respective images of the illuminated subfields are formed at respective positions on the substrate in a manner serving to stitch the images together; and
a main controller connected to the reticle stage, substrate stage, illumination-optical system, and projection-optical system, the main controller comprising a memory in which are stored index data for various subfields based on respective reticle-pattern-inspection data for the subfields, and optical-correction data for the various subfields corresponding to the reticle-pattern-inspection data, the index data and corresponding optical-correction data being stored as a look-up table that is consulted as each of the various subfields is being exposed so that exposure of each of the various subfields is optically corrected according to the recalled respective optical-correction data.
10. The apparatus of claim 9, wherein the optical correction is selected from a group consisting of shape-astigmatic aberration, focusing-astigmatic aberration, image focal point, image rotation, image magnification, and image position on the substrate.
11. The apparatus of claim 9, wherein the optical correction is made according to one or more respective correction values determined by actual measurement data of the pattern as defined on the reticle.
12. The apparatus of claim 11, wherein the correction values include one or more apparatus constants selected from a group consisting of beam-acceleration voltage, beam-current density, beam-divergence angle, and optical-system length.
13. The method of claim 9, wherein the index data are obtained from a previously performed reticle inspection made at time of reticle fabrication, the index data including one or more of image rotation and pattern-element positions within the respective subfields.
14. A method for performing charged-particle-beam microlithography of a pattern to a sensitive substrate, the method comprising:
(a) defining the pattern on a segmented reticle in which the pattern is divided into multiple subfields each defining a respective portion of the pattern;
(b) storing index data for various subfields based on respective reticle-pattern-inspection data for the subfields, and optical-correction data for the various subfields corresponding to the reticle-pattern-inspection data, the index data and corresponding optical-correction data being stored as a look-up table;
(c) successively illuminating groups of subfields on the reticle using a charged-particle illumination beam, each group consisting of at least one respective subfield;
(d) as each group of subfields is illuminated, directing an imaging beam, formed from particles of the illumination beam passing through the reticle, to the substrate such that respective images of the illuminated subfields are formed at respective positions on the substrate serving to stitch the images together; and
(e) as each of the various subfields is being exposed, consulting the look-up table to obtain respective optical-correction data for the subfield, and applying the optical-correction data to optically correct exposure of each of the various subfields.
15. The method of claim 14, wherein the index data are obtained from a previously performed reticle inspection made at time of reticle fabrication, the index data including one or more of image rotation and pattern-element positions within the respective subfields.
16. The method of claim 14, wherein the optical correction is selected from a group consisting of shape-astigmatic aberration, focusing-astigmatic aberration, image focal point, image rotation, image magnification, and image position on the substrate.
17. The method of claim 14, wherein the optical correction is made according to one or more respective correction values determined by actual measurement data of the pattern as defined on the reticle.
18. The method of claim 17, wherein the correction values include one or more apparatus constants selected from a group consisting of beam-acceleration voltage, beam-current density, beam-divergence angle, and optical-system length.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A switch pole of a circuit breaker, comprising:
two pole shells including an upper pole shell and a lower pole shell,
at least one switching contact between the two pole shells when the two pole shells are in an assembled state,
current-carrying elements,
an arc quenching device including an arc runner plate and at least one splitter plate delimiting an arc chute,
at least one first slot for accommodating at least one of the at least one splitter plate and the arc runner plate is provided between the pole shells, and
a functional component between the two pole shells, the functional component including at least one second slot spaced apart from the at least one first slot such that the at least one second slot is i) parallel to and aligned with the at least one first slot, and ii) located between the two pole shells at a center portion of the switch pole such that the at least one second slot is usable in cooperation with the at least one first slot to accommodate the at least one of the at least one splitter and the arc runner plate.
2. The switch pole of claim 1, wherein the functional component assumes the function of a cover.
3. The switch pole of claim 1, wherein the functional component is a slot motor cover.
4. The switch pole of claim 1, wherein the functional component is a cover cap of a slot motor side plate.
5. The switch pole of claim 1, wherein the functional component includes a comb-shaped extension in which at least one slot is provided for accommodating the at least one of the at least one splitter and the arc runner plate.
6. The switch pole of claim 1, further comprising a transition or press-fit, between the at least one of the at least one splitter and the arc runner plate and the slot of the functional component.
7. The switch pole of claim 1, wherein there is a slight play between the at least one of the at least one splitter and the arc runner plate and the slot of the upper pole shell placed on top as a lid.
8. The switch pole of claim 1, wherein the functional component is made of a thermoplastic material.
9. The switch pole of claim 1, wherein at least one of the lower and the upper pole shell is made of a thermoplastic material.
10. The switch pole of claim 8, wherein the plastic material is a polyamide.
11. The switch pole of claim 8, wherein the plastic material is a polyamide 66 (PA66).
12. The switch pole of claim 1, wherein the at least one second slot covers no more than 8 to 12% of the surface of the splitter or arc runner plate located in the slot.
13. The switch pole of claim 1, wherein the at least one first slot is provided inside at least one of the lower and upper pole shell.
14. The switch pole of claim 2, wherein the functional component is a slot motor cover.
15. The switch pole of claim 9, wherein the plastic material is a polyamide.