1. A perfluorocarbon decomposing apparatus comprising:
a reactor having inlet and outlet ports formed in the top and bottom sides thereof for receiving and discharging perfluorocarbons and harmful gas, a chamber having an internal passage, a ferrite core formed outside of the chamber and connected to an antenna, and a permanent magnet arranged around the ferrite core;
a gas supply portion for supplying a gas for decomposing the perfluorocarbons and harmful gas into the reactor; and
a generator and a controller for supplying electric power for the antenna of the reactor.
2. The perfluorocarbon decomposing apparatus as claimed in claim 1, wherein the internal passage of the chamber has a loop shape, the chamber having a donut shape.
3. The perfluorocarbon decomposing apparatus as claimed in claim 1, wherein at least two of the ferrite cores are arranged on either side of the chamber.
4. The perfluorocarbon decomposing apparatus as claimed in claim 1, wherein the permanent magnets are coupled to a frame formed on the top and bottom sides of the ferrite core and have a cylindrical or rod-like shape.
5. The perfluorocarbon decomposing apparatus as claimed in claim 1, wherein the permanent magnets are inserted in a hole formed in the inner wall of the chamber.
6. The perfluorocarbon decomposing apparatus as claimed in claim 4, wherein the permanent magnets are arranged to form a magnetic field in the direction of the passage of the chamber penetrating the ferrite core.
7. The perfluorocarbon decomposing apparatus as claimed in claim 1, wherein the permanent magnets on the top and bottom sides of the ferrite core are arranged to form a magnetic field in a same or opposite direction with each other.
8. The perfluorocarbon decomposing apparatus as claimed in claim 7, wherein the intensity of the magnetic field is at least 1,000 G per one permanent magnet.
9. The perfluorocarbon decomposing apparatus as claimed in claim 1, further comprising:
an inductive coupling plasma antenna mounted on the inlet and outlet ports of the reactor for inducing an inductive coupling plasma to do plasma confinement.
10. The perfluorocarbon decomposing apparatus as claimed in claim 9, wherein the antenna is connected to an antenna wound around the ferrite core and operated in a simultaneous manner.
11. The perfluorocarbon decomposing apparatus as claimed in claim 1, wherein an igniter is formed on the top rear side of the reactor, the igniter using CCP to cause an initial discharge.
12. The perfluorocarbon decomposing apparatus as claimed in claim 1, wherein the reactor has a plasma cooling device.
13. The perfluorocarbon decomposing apparatus as claimed in claim 12, wherein the plasma cooling device has a cooling water passage formed inside the wall of the chamber and a cooling water feeding portion formed outside the wall of the chamber.
14. The perfluorocarbon decomposing apparatus as claimed in claim 1, further comprising a DC break as an insulating means having an insulator function for separating the top and bottom portions of the chamber, when a material for the chamber is a conductor.
15. The perfluorocarbon decomposing apparatus as claimed in claim 1, wherein the apparatus further comprises a process chamber connected to the inlet port of the reactor, and a dry pump connected to the outlet port of the reactor.
16. The perfluorocarbon decomposing apparatus as claimed in claim 1, wherein a decomposing gas supplied from the gas supply portion is any one selected from the group consisting of argon, helium, water vapor, oxygen, methane, ammonia, and a mixture of at least two thereof.
17. The perfluorocarbon decomposing apparatus as claimed in claim 1, wherein a permanent magnet is inserted in the inlet and outlet ports.
18. The perfluorocarbon decomposing apparatus as claimed in claim 17, wherein the permanent magnet is arranged to form a magnetic field in the direction of the inlet and outlet ports.
19. The perfluorocarbon decomposing apparatus as claimed in claim 5, wherein the permanent magnets are arranged to form a magnetic field in the direction of the passage of the chamber penetrating the ferrite core.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electronics package comprising:
a quad flat no lead (QFN) electronics package having top and bottom surfaces,
the bottom surface including a plurality of bottom circuit contacts for electrical connection to corresponding package contacts of an underlying circuit structure, and
the top surface including a plurality of top circuit contacts for electrical connection to corresponding bottom circuit contacts of an overlying electronics package.
2. A package according to claim 1, wherein the top circuit contacts are the tops of leadframe pedestals of a leadframe including the bottom circuit contacts.
3. A package according to claim 2, wherein the leadframe pedestals have a height greater than the thickness of the leadframe.
4. A package according to claim 1, wherein the top circuit contacts are the tops of filled vias in the package.
5. A package according to claim 4, wherein the vias are filled with a solidified flow of electrically conductive material.
6. A package according to claim 4, wherein the vias are filled with electrically conductive pins.
7. A package according to claim 1, wherein a set of the top circuit contacts are electrically connected to a set of the bottom circuit contacts.
8. A method of creating an electronics package, the method comprising:
fabricating a quad flat no lead (QFN) electronic package having top and bottom surfaces wherein:
i. the bottom surface includes a plurality of bottom circuit contacts for electrical connection to corresponding package contacts of an underlying circuit structure, and
ii. the top surface includes a plurality of top circuit contacts for electrical connection to corresponding bottom circuit contacts of an overlying electronic package.
9. A method according to claim 8, wherein the top circuit contacts are the tops of leadframe pedestals of a leadframe including the bottom circuit contacts.
10. A method according to claim 9, wherein the leadframe pedestals have a height greater than the thickness of the leadframe.
11. A method according to claim 8, wherein the top circuit contacts are the tops of filled vias in the package.
12. A method according to claim 11, wherein the vias are filled with a solidified flow of electrically conductive material.
13. A method according to claim 11, wherein the vias are filled with electrically conductive pins.
14. A method according to claim 8, wherein a set of the top circuit contacts are electrically connected to a set of the bottom circuit contacts.
15. An electronics package comprising:
a quad flat no lead (QFN) electronic package having top and bottom surfaces,
the bottom surface including a plurality of bottom connecting means for electrical connection to corresponding package connecting means of an underlying circuit structure, and
the top surface including a plurality of top connecting means for electrical connection to corresponding bottom connecting means of an overlying electronic package.
16. A package according to claim 15, wherein the top connecting means include the tops of leadframe pedestals of a leadframe including the bottom connecting means.
17. A package according to claim 16, wherein the leadframe pedestals have a height greater than the thickness of the leadframe.
18. A package according to claim 15, wherein the top connecting means include the tops of filled vias in the package.
19. A package according to claim 18, wherein the vias are filled with a solidified flow of electrically conductive material.
20. A package according to claim 18, wherein the vias are filled with electrically conductive pins.
21. A package according to claim 15, wherein a set of the top connecting means are electrically connected to a set of the bottom connecting means.