1. A casket arrangement having a first configuration and a second configuration, comprising:
a bottom panel formed of a pliable material;
side panels formed intrinsically with the bottom panel of the pliable material, each side panel including a lower section and an upper section foldably attached thereto, the lower section extending vertically upward from the bottom panel, the upper section in the first configuration extending upward from the lower section and in the second configuration extending in a direction other than vertically upward from the lower section;
end panels formed intrinsically with the bottom panel of the pliable material, each end panel including a lower end panel, and an upper end panel, the lower end panel extending vertically upward from the bottom panel and fixed in position, the upper end panel in the first configuration extending upward from the lower end panel and operably coupled to the upper section of at least one side panel, and the upper end panel in the second configuration extending in a direction other than vertically upward from the lower end panel; and
wherein the bottom panel, the side panels and the end panels form a casket body at least in the first configuration.
2. The casket arrangement of claim 1, further comprising a lid configured to fit over the side panels and end panels in the first configuration and in the second configuration.
3. The casket arrangement of claim 1, wherein at least a first side panel further comprises an upper connecting extension coupled at one end to the upper section, and configured to couple to the upper end panel in the first configuration, and configured to be spaced apart from the upper end panel in a second configuration.
4. The casket arrangement of claim 3, wherein the upper connecting extension is configured such that a surface of the upper connecting extension abuts a surface of another portion of the side panel in the second configuration.
5. The casket arrangement of claim 1, wherein at least a first side panel further comprises a lower connecting extension coupled at one end to the lower section, and configured to be secured adjacent to and abutting the lower end panel in the first and second configuration.
6. The casket arrangement of claim 5, wherein the lower connecting extension is secured with a single fastener.
7. The casket arrangement of claim 6, wherein the fastener comprises a handle formed from a cable tie.
8. The casket arrangement of claim 5, wherein the lower connecting extension is outboard of the lower end panel in the first and second configuration.
9. The casket arrangement of claim 1, wherein at least one upper section is configured to engage the upper end panel in the first configuration.
10. The casket arrangement of claim 9, further comprising a coupling mechanism wherein the coupling mechanism is a slot.
11. The casket arrangement of claim 1, wherein at least one side panel is configured to be coupled to the upper end panel in the second configuration.
12. The casket arrangement of claim 11, further comprising a coupling mechanism wherein the coupling mechanism is a slot.
13. The casket arrangement of claim 1, wherein the pliable material is corrugated paperboard.
14. A lightweight casket arrangement comprising:
a bottom panel formed of a pliable material;
side panels formed intrinsically with the bottom panel of the pliable material, extending vertically upward from the bottom panel, each side panel having a plurality of handholds formed therein, wherein a mean distance of said handholds from an end of the casket is less than the distance from said end to the center of the side panel whereby the handholds are asymmetrically located at a distance from the center of the side panel; and
end panels formed intrinsically with the bottom panel of the pliable material, extending vertically upward from the bottom panel; and
wherein the bottom panel, the side panels and the end panels form a casket body.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A multilayer wiring board having a multilayer wiring structure formed on a substrate including at least one of a semiconductor, a conductor, and an insulator, the multilayer wiring board comprising:
a gas or an insulating material having a relative dielectric constant of not more than 2.5 on average and interposed between a first wiring layer and a second wiring layer formed above the first wiring layer in the multilayer wiring structure; a conductive connector arranged between at least one wiring of the first wiring layer and at least one wiring of the second wiring layer; and an insulating heat conductor having a relative dielectric constant of not more than 5 and arranged between a predetermined wiring of the first wiring layer and a predetermined wiring of the second wiring layer.
2. The multilayer wiring board as claimed in claim 1, wherein the insulating material is interposed between the first wiring layer and the second wiring layer and the insulating heat conductor has a thermal conductivity greater than the thermal conductivity of the insulating material.
3. The multilayer wiring board as claimed in claim 2, wherein the insulating material interposed between the first wiring layer and the second wiring layer includes a material containing carbon and fluorine.
4. The multilayer wiring board as claimed in claim 2, wherein the insulating material interposed between the first wiring layer and the second wiring layer includes a material containing carbon and hydrogen.
5. The multilayer wiring board as claimed in claim 1, wherein the insulating heat conductor includes a material containing silicon, carbon, and nitrogen.
6. The multilayer wiring board as claimed in claim 5, wherein the insulating heat conductor includes SiCN.
7. A semiconductor device having a multilayer wiring structure formed on a substrate in which a plurality of semiconductor elements are formed, the semiconductor device comprising:
a gas or an insulating material having a relative dielectric constant of not more than 2.5 on average and interposed between a first wiring layer and a second wiring layer formed above the first wiring layer in the multilayer wiring structure; a conductive connector arranged between at least one wiring of the first wiring layer and at least one wiring of the second wiring layer; and an insulating heat conductor having a relative dielectric constant of not more than 5 and arranged between a predetermined wiring of the first wiring layer and a predetermined wiring of the second wiring layer.
8. The semiconductor device as claimed in claim 7, wherein the insulating material is interposed between the first wiring layer and the second wiring layer and the insulating heat conductor has a thermal conductivity greater than the thermal conductivity of the insulating material.
9. The semiconductor device as claimed in claim 8, wherein the insulating material interposed between the first wiring layer and the second wiring layer includes a material containing carbon and fluorine.
10. The semiconductor device as claimed in claim 8, wherein the insulating material interposed between the first wiring layer and the second wiring layer includes a material containing carbon and hydrogen.
11. The semiconductor device as claimed in claim 7, wherein the insulating heat conductor includes a material containing silicon, carbon, and nitrogen.
12. The semiconductor device as claimed in claim 11, wherein the insulating heat conductor includes SiCN.