What is claimed is:
1. A heat dissipation device, comprising:
a base portion having at least one conduit defined therein, said base portion having a dissipation surface;
said at least one conduit having at least one outlet on at least one side of said base portion; and
at least one conduit opening extending from said base portion dissipation surface to said at least one conduit.
2. The heat dissipation device of claim 1, further including a fan positioned to blow air substantially toward said conduit opening.
3. The heat dissipation device of claim 1, further including a plurality of projections extending from said base portion dissipation surface.
4. The heat dissipation device of claim 3, wherein said plurality of projections extends substantially perpendicularly to said base portion dissipation surface.
5. The heat dissipation device of claim 3, further including a fan mounted on at least a portion of said projections to blow air substantially toward said conduit opening.
6. The heat dissipation device of claim 1, wherein said conduit comprises a plurality of said outlets.
7. A microelectronic assembly, comprising:
a microelectronic die having a back surface; and
a heat dissipation device, comprising:
a base portion having at least one conduit defined therein, said base portion having a dissipation surface;
said at least one conduit having at least one outlet on at least one side of said base portion; and
at least one conduit opening extending from said base portion dissipation surface to said at least one conduit.
8. The microelectronic assembly of claim 7, wherein said heat dissipation device further includes a fan positioned to blow air substantially toward said conduit opening.
9. The microelectronic assembly of claim 7, wherein said heat dissipation device further includes a plurality of projections extending from said base portion dissipation surface.
10. The microelectronic assembly of claim 9, wherein said plurality of projections extends substantially perpendicularly from said base portion dissipation surface.
11. The microelectronic assembly of claim 9, further including a fan mounted on at least a portion of said plurality of projections to blow air substantially toward said conduit opening.
12. The microelectronic assembly of claim 7, wherein said conduit comprises a plurality of said outlets.
13. The microelectronic assembly of claim 7, wherein said conduit is positioned proximate a hotspot within said microelectronic device.
14. The microelectronic assembly of claim 7, wherein said conduit opening is positioned proximate a hotspot within said microelectronic device.
15. A method of cooling a microelectronic die, comprising:
providing a heat dissipation device, comprising:
a base portion having at least one conduit defined therein, said base portion having a dissipation surface;
said at least one conduit having at least one outlet on at least one side of said base portion; and
at least one conduit opening extending from said base portion dissipation surface to said at least one conduit;
attaching said heat dissipation device to a back surface of said microelectronic die; and
forcing air into said at least one conduit opening, such that air flows through said at least one conduit to exit said at least one conduit outlet.
16. The method of claim 15, wherein forcing air into said at least one conduit opening comprises providing a fan positioned to blow air substantially toward the conduit opening and activating said fan.
17. The method of claim 15, wherein providing said heat dissipation device further includes providing said heat dissipation device having a plurality of projections extending from said base portion dissipation surface.
18. The method of claim 17, wherein providing said heat dissipation device having a plurality of projections further includes providing said heat dissipation device wherein said plurality of projections extend substantially perpendicularly from said base portion dissipation surface.
19. The method of claim 17, wherein forcing air into said at least one conduit opening comprises providing a fan mounted to at least a portion of said plurality of projections to blow air substantially toward said conduit opening and activating said fan.
20. The method of claim 15, wherein providing said heat dissipation device further includes providing said heat dissipation device having a plurality of conduit outlets.
21. The method of claim 15, further including positioning said heat dissipation device on said microelectronic device such that said conduit is positioned proximate a hotspot within said microelectronic device.
22. The method of claim 15, further including positioning said heat dissipation device on said microelectronic device such that said conduit opening is positioned proximate a hotspot within said microelectronic device.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A 3D camera system with a field of view adapted to capture a composite 3D image of a figure of interest within said field of view, the 3D camera system comprising:
a computer adapted to generate a clock signal and an initiation signal to start data acquisition following the emission of an illuminating light pulse;
a pulsed light source having a beam shaping element, said pulsed light source emitting at least one light pulse illuminating the figure of interest within said field of view;
a digital memory circuit connected to said computer and to a 3D sensor;
a 2D camera having an overlapping field of view, and a 2D image output connected to said computer;
a 3D sensor connected to the computer and adapted both to acquire a ladar 3D image of said field of view and to store the ladar 3D image in said digital memory;
wherein said 3D sensor includes:
a 3D focal plane array;
a sensor housing;
a lens system which collects light pulse signals reflected from said figure of interest and directs said collected light pulse signals onto the 3D focal plane array,
said 3D focal plane array including:
an array of optical detectors having a regular geometric arrangement, positioned in a focal plane of said lens system, and each detector converting an incident light pulse signal into an electrical pulse signal; and
a readout circuit, including an array of unit cell electrical circuits with corresponding regular geometric arrangement;
wherein each unit cell electrical circuit has an input electrically connected to a terminal of a companion optical detector of said array of optical detectors, said unit cell electrical circuit adapted to amplify said electrical pulse signals and having a trigger circuit adapted to detect the presence of said electrical pulse signal and thereupon to produce an acquisition termination signal, wherein each unit cell electrical circuit further includes a unit cell timing circuit initiated by said initiation signal, said unit cell timing circuit being terminated by said acquisition termination signal, thereby measuring the time of flight of a light pulse to the unit cell, said unit cell timing circuit having a unit cell time of flight output connected to the periphery of the readout circuit, and the readout circuit having a ladar 3D image output comprised of the unit cell time of flight outputs;
wherein the computer is adapted to develop a composite 3D image from the ladar 3D image output and the 2D image output.
2. The 3D camera system of claim 1, wherein the readout circuit includes at least one digital processor.
3. The 3D camera system of claim 1, wherein the 3D sensor includes an embedded computer.
4. The 3D camera system of claim 1, wherein the 2D camera is an infrared sensor.
5. The 3D camera system of claim 1, wherein the timing circuit is a count accumulator driven by a dock.
6. The 3D camera system of claim 1, wherein the initiation signal is coincident with the emission of an illuminating light pulse from the pulsed light source.
7. The 3D camera system of claim 1, wherein the unit cell electrical circuit includes an analog to digital converter of at least one bit.
8. The 3D camera system of claim 1, wherein the computer develops the composite 3D image by employing a method selected from the set consisting of: overlaying, and texturing.
9. The 3D camera system of claim 1, wherein each unit cell electrical circuit includes an electrical amplifier, said electrical amplifier having an input connected through a conductive bump to a terminal of a companion optical detector of said array of optical detectors, said electrical amplifier having an output connected to a unit cell trigger circuit, the unit cell trigger circuit adapted to detect the presence of said electrical pulse signal and to produce an acquisition termination signal, and said electrical amplifier output further connected to a plurality of normally-off switch inputs, and the output of each switch further connected to a memory capacitor, and a logic circuit for selecting a control input located on each of the switches, and adapted to turn on said switches in a sequence, thereby producing a set of analog samples of said electrical pulse signal;
wherein the unit cell timing circuit is initiated by said initiation signal following the emission of an illuminating pulse and is terminated by said acquisition termination signal, thereby measuring the time of flight of an illuminating pulse to the unit cell;
wherein the unit cell timing circuit further includes a unit cell time of flight output adapted to drive said unit cell time of flight values to the periphery of the readout circuit, and a unit cell output circuit having an input connecting to each of said memory capacitors and an output connecting to an analog sample output circuit adapted to drive said analog samples to the periphery of the readout circuit.
10. The 3D camera system of claim 9, wherein the analog sample output is connected to an analog to digital converter.
11. The 3D camera system of claim 9, wherein the logic circuit for selecting and turning on each of the switches in a sequence is a circular selector driven by a clock.
12. A 3D camera system with a field of view adapted to capture composite a 3D image of a figure within said field of view, the 3D camera system comprising:
a computer adapted to generate a dock signal and an initiation signal to start data acquisition following the emission of an illuminating light pulse;
a pulsed light source having a beam shaping element, said pulsed light source emitting at least one light pulse illuminating a figure of interest within said field of view;
an electronically controlled mirror connected to the computer, and adapted to deflect said light pulse throughout the field of view upon instruction of the computer;
a digital memory circuit connected both to said computer and to a 3D sensor;
a 2D camera having an overlapping field of view and a 2D image output connected to said computer;
a 3D sensor connected to the computer and adapted both to acquire a ladar 3D image of said field of view and to store the ladar 3D image in said digital memory;
wherein said 3D sensor includes:
a 3D focal plane array;
a sensor housing;
a lens system adapted both to collect light pulse signals reflected from said figure of interest and to direct said collected light pulse signals onto the 3D focal plane array, said 3D focal plane array including:
an array of optical detectors having a regular geometric arrangement, positioned in a focal plane of said lens system, each detector adapted to convert an incident light pulse signal into an electrical pulse signal; and
a readout circuit having an array of unit cell electrical circuits with corresponding regular geometric arrangement;
wherein each unit cell electrical circuit has an input electrically connected to a terminal of a companion optical detector of said array of optical detectors, said unit cell electrical circuit adapted to amplify said electrical pulse signals and having a trigger circuit adapted to detect the presence of said electrical pulse signal and thereupon to produce an acquisition termination signal, wherein each unit cell electrical circuit further includes a unit cell timing circuit initiated by said initiation signal, said unit cell timing circuit being terminated by said acquisition termination signal, thereby measuring the time of flight of a light pulse to the unit cell, said unit cell timing circuit having a unit cell time of flight output connected to the periphery of the readout circuit, and the readout circuit having a ladar 3D image output corresponding to the unit cell time of flight outputs;
wherein the computer is adapted to develop a composite 3D image from the ladar 3D image output and the 2D image output.
13. The 3D camera system of claim 12, wherein the readout circuit includes at least one digital processor.
14. The 3D camera system of claim 12, wherein the 3D sensor includes an embedded computer.
15. The 3D camera system of claim 12, wherein the timing circuit is a count accumulator driven by a dock.
16. The 3D camera system of claim 12, wherein the initiation signal is coincident with the emission of an illuminating light pulse.
17. The 3D camera system of claim 12, wherein the computer develops the composite 3D image by employing a method selected from the set consisting of: overlaying, and texturing.
18. A 3D camera system with a field of view adapted to capture 3D images of figures within said field of view, the 3D camera system comprising:
a computer adapted to generate a clock signal and an initiation signal to start data acquisition following the emission of an illuminating light pulse;
a pulsed light source having a beam shaping element, said pulsed light source emitting at least one light pulse illuminating a figure of interest within said field of view;
an electronically controlled mirror connected to the computer, and adapted to deflect said light pulse throughout the field of view;
a digital memory circuit connected both to said computer and to a 3D sensor;
a 3D sensor connected to the computer, and adapted both to acquire a 3D image of said field of view and to store the 3D image in said digital memory;
wherein said 3D sensor includes:
a 3D focal plane array;
a sensor housing;
a lens system which collects light pulse signals reflected from said figure of interest and directs said collected light pulse signals onto the 3D focal plane array,
said 3D focal plane array including:
an array of optical detectors having a regular geometric arrangement, positioned in a focal plane of said lens system, and each detector converting an incident light pulse signal into an electrical pulse signal; and
a readout circuit, including an array of unit cell electrical circuits with corresponding regular geometric arrangement;
wherein each unit cell electrical circuit has an input electrically connected to a terminal of a companion optical detector of said array of optical detectors, said unit cell electrical circuit adapted to amplify said electrical pulse signals and having a trigger circuit adapted to detect the presence of said electrical pulse signal and thereupon to produce an acquisition termination signal, wherein each unit cell electrical circuit further includes a unit cell timing circuit initiated by said initiation signal, said unit cell timing circuit being terminated by said acquisition termination signal, thereby measuring the time of flight of a light pulse to the unit cell, said unit cell timing circuit having a unit cell time of flight output connected to the periphery of the readout circuit, and the readout circuit having a 3D image output comprised of the unit cell time of flight outputs;
wherein the computer is adapted to capture three dimensional motion data of said figure of interest from the ladar 3D image output.
19. The 3D camera system of claim 18, wherein the captured three dimensional motion data is incorporated into a video game.
20. The 3D camera system of claim 18, wherein a computer program is adapted to rotate and approach the captured three dimensional motion data from different geometrical points of view.