1. A method of implementing a microcircuit, the method comprising the steps of:
(a) fabricating an interconnection network on a substrate having a first side and a second side;
(b) mounting one or more active components to the first side of the substrate;
(c) sealing hermetically the one or more active components with a cover;
(d) mounting one or more passive components to the second side of the substrate in such a manner that the one or more passive components are removable and replaceable;
(e) testing the microcircuit for a desired performance; and
(f) removing and replacing, as necessary, one or more of the one or more passive components so as to achieve the desired performance.
2. The method as set forth in claim 1, wherein step (a) includes\u2014
(a1) cutting one or more tape layers from a roll of a ceramic tape substrate material;
(a2) drilling one or more holes through the substrate to allow for electrically interconnecting the one or more active components and the one or more passive components;
(a3) printing and drying a via fill;
(a4) printing and drying one or more connectors;
(a5) collating and laminating the interconnection network;
(a6) cofiring one or more conductors;
(a7) printing, drying, and firing one or more conductors and one or more resistors;
(a8) trimming the one or more resistors; and
(a9) scribing the interconnection network.
3. The method as set forth in claim 1, wherein step (b) includes\u2014
(b1) cleaning the interconnection network to facilitate proper mounting of the one or more active components;
(b2) dispensing an adhesive onto one or more predetermined locations on the first side of the substrate;
(b3) positioning the one or more active components so as to contact the adhesive;
(b4) curing the adhesive; and
(b5) wire-bonding the one or more active components.
4. The method as set forth in claim 1, wherein step (d) includes\u2014
(d1) dispensing a solder onto one or more predetermined soldering sites on the second side of the substrate;
(d2) positioning the one or more passive components so as to contact the solder;
(d3) reflowing the solder; and
(d4) cleaning any solder flux residue from the microcircuit.
5. The method as set forth in claim 1, wherein the microcircuit is a multi-chip module.
6. The method as set forth in claim 1, wherein the substrate is a low-temperature co-fired ceramic.
7. The method as set forth in claim 1, wherein the one or more active components are selected from the group consisting of: integrated circuits, transistors, and diodes.
8. The method as set forth in claim 1, wherein the one or more passive components include one or more passive surface mount components.
9. The method as set forth in claim 1, wherein the one or more passive surface components are selected from the group consisting of: capacitors, resistors, inductors, and memory modules.
10. A method of implementing a design for a multi-chip module, the method comprising the steps of:
(a) fabricating an interconnection network on a low-temperature co-fired ceramic substrate having a first side and a second side;
(b) wire-bonding one or more integrated circuits to the first side of the low-temperature co-fired ceramic substrate;
(c) sealing hermetically the one or more active components with a cover;
(d) reflow-soldering one or more passive surface mount components to the second side of the low-temperature co-fired ceramic substrate in such a manner that the one or more passive surface mount components are removable and replaceable;
(e) connecting the one or more integrated circuits with the one or more passive surface mount components through one or more vias in the low-temperature co-fired ceramic substrate;
(f) testing the microcircuit for a desired performance; and
(g) removing and replacing, as necessary, one or more of the one or more passive surface mount components so as to achieve the desired performance.
11. The method as set forth in claim 10, wherein the one or more passive surface mount components are selected from the group consisting of: capacitors, resistors, inductors, and memory modules.
12. A method of implementing a microcircuit, the method comprising the steps of:
(a) fabricating an interconnection network on a substrate having a first side and a second side;
(b) wire-bonding one or more active components to the first side of the substrate;
(c) sealing hermetically the one or more active components with a cover;
(d) mounting one or more passive components to the second side of the substrate in such a manner that the one or more passive components are removable and replaceable;
(e) testing the microcircuit for a desired performance; and
(f) removing and replacing, as necessary, one or more of the one or more passive components so as to achieve the desired performance.
13. A method of implementing a microcircuit, the method comprising the steps of:
(a) fabricating an interconnection network on a substrate having a first side and a second side;
(b) mounting one or more active components to the first side of the substrate;
(c) sealing hermetically the one or more active components with a cover;
(d) reflow-soldering one or more passive components to the second side of the substrate so that the one or more passive components are removable and replaceable;
(e) testing the microcircuit for a desired performance; and
(f) removing and replacing, as necessary, one or more of the one or more passive components so as to achieve the desired performance.
14. A method of implementing a microcircuit, the method comprising the steps of:
(a) fabricating an interconnection network on a substrate having a first side and a second side;
(b) mounting one or more active components to the first side of the substrate;
(c) sealing hermetically the one or more active components with a cover;
(d) mounting one or more passive components to the second side of the substrate in such a manner that the one or more passive components are removable and replaceable;
(e) connecting the one or more active components with the one or more passive components through vias in the substrate;
(f) testing the microcircuit for a desired performance; and
(g) removing and replacing, as necessary, one or more of the one or more passive components so as to achieve the desired performance.
15. A method of implementing a microcircuit, the method comprising the steps of:
(a) fabricating an interconnection network on a substrate having a first side and a second side;
(b) mounting one or more active components to the first side of the substrate;
(c) sealing hermetically the one or more active components with a cover;
(d) mounting one or more passive components to the second side of the substrate in such a manner that the one or more passive components are removable and replaceable;
(e) connecting the one or more active components with the one or more passive components using one or more edge connectors;
(f) testing the microcircuit for a desired performance; and
(g) removing and replacing, as necessary, one or more of the one or more passive components so as to achieve the desired performance.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for measuring an absolute distance and planar angles for an at least one object relative to an optic sensor assembly, the method comprising the steps of:
a) calibrating the optic sensor assembly by mounting the optic sensor assembly in a fixture and capturing a response of each sensor from the optic sensor assembly from a known target;
b) mounting a structure adjacent to the object;
c) locating the calibrated optic sensor assembly upon the mounting structure, the calibrated optic sensor assembly comprising a plurality of at least four sensors;
d) providing a transmitter for transmitting optic signals;
e) locating at least one target on a surface portion of the object;
f) using control electronics to communicate with the transmitter and each sensor of the calibrated optic sensor assembly by a communications bus, each sensor measuring an intensity of reflected light from the at least one target;
g) processing measured reflected light intensity information and the captured response from each sensor of the calibrated optic sensor assembly by signal processing software means, loaded and stored in the control electronics; and
h) computing the absolute distance and the planar angles; and
i) repeating steps e) through h) for a next object.
2. The method of claim 1 wherein the step of providing a transmitter comprises providing the transmitter within the optic sensor assembly.
3. The method of claim 1 wherein the optic sensor assembly comprises a sectioned sensor assembly.
4. The method of claim 1 wherein the at least one target comprises a reflective surface.
5. The method of claim 1 further comprising directing the optic signals by the transmitter to a plurality of mirrored surfaces optically connected to the optic sensor assembly for separating predetermined areas of the optic signals to the at least one target and for detecting the optic signals from the at least one target.
6. The method of claim 1 further comprising the step of measuring an absolute distance and planar angles for a next object relative to the calibrated optic sensor assembly.
7. A system for measuring an absolute optical distance and planar angles for an at least one object relative to a plurality of sensors in an optic sensor assembly the system comprising:
a means for calibrating each sensor in said optic sensor assembly, said optic sensor assembly comprising at least four optic sensors;
a mounting structure affixed adjacent to the object;
said optic sensor assembly disposed on the mounting structure;
a transmitter for transmitting optic signals;
at least one target disposed on a surface portion of the object for reflecting the transmitted optic signals;
control electronics in communication with the transmitter and each sensor of the optic sensor assembly with a communications bus, said each sensor measuring an intensity of reflected light from the at least one target; and
signal processing software means loaded and stored in the control electronics for processing measured reflected light intensity information from said each sensor of the optic sensor assembly, a calibrated response of each sensor and for computing the absolute distance and the planar angles.
8. The invention of claim 7 wherein said plurality of sensors comprises a sectioned sensor assembly.
9. The invention of claim 8 wherein the sectioned optic sensor assembly comprising a plurality of receiver sections comprises equally distributed sections with predetermined areas.
10. The invention of claim 8 wherein each of the sections of the plurality of sections comprise optical fiber.
11. The invention of claim 7 wherein said object comprises a stationary object.
12. The invention of claim 7 wherein said object comprises a moving object.
13. The invention of claim 7 wherein said at least one target comprises a predetermined area of the object.
14. The invention of claim 7 wherein said at least one target comprises a reflective surface.
15. The invention of claim 7 further comprising a plurality of mirrored surfaces optically connected to the optic sensor assembly for separating predetermined areas of light from the transmitter and for detecting the optic signals from the at least one target.
16. The invention of claim 7 wherein said means for calibrating comprises a fixture for placing said sensor assembly and a known target.
17. The invention of claim 7 further comprising the system for measuring an absolute optical distance and planar angles for a next object relative to the plurality of calibrated sensors in the optic sensor assembly.