1. A light emitting element, comprising:
a light emitting diode (LED) chip having an upper surface; and
a wavelength-converting layer having a top surface, an opposing bottom surface, and sidewalls extending from the top surface to the bottom surface, the bottom surface being disposed on the upper surface of the LED chip, the wavelength-converting layer configured to convert a wavelength of light emitted from the LED chip, wherein,
a total area of the bottom surface is less than or equal to a total area of the upper surface,
a total area of a first horizontal cross-section of the wavelength-converting layer, taken between the top and bottom surfaces, is greater than a total area of the upper surface of the LED chip, and
the sidewalls comprise protrusions having a rectangular vertical cross-section, or the sidewalls protrude outwardly so as to have a V-shaped vertical cross-section.
2. The light emitting element of claim 1, wherein the top surface is curved or substantially parallel to the bottom surface.
3. The light emitting element of claim 1, wherein the total area of the top surface is equal to the total area of the bottom surface.
4. The light emitting element of claim 1, further comprising an adhesive material disposed between the wavelength-converting layer and the upper surface of the LED chip.
5. The light emitting element of claim 1, wherein the wavelength-converting layer comprises a hole exposing a bonding pad arranged on the upper surface of the LED chip.
6. The light emitting element of claim 5, further comprising a wire electrically connected to the bonding pad.
7. The light emitting element of claim 1, further comprising a first lead frame and a second lead frame spaced apart from each other and connected to the LED chip.
8. The light emitting element of claim 1, wherein the wavelength-converting layer is disposed entirely above a plane of the upper surface of the LED chip.
9. A light emitting element, comprising:
a light emitting diode (LED) chip having an upper surface; and
a wavelength-converting layer having a top surface, an opposing bottom surface, and sidewalls extending from the to surface to the bottom surface, the bottom surface being disposed on the upper surface of the LED chip, the wavelength-converting layer configured to convert a wavelength of light emitted from the LED chip, wherein,
a total area of the bottom surface is less than or equal to a total area of the upper surface,
a total area of a first horizontal cross-section of the wavelength-converting layer, taken between the top and bottom surfaces, is greater than a total area of the upper surface of the LED chip, and
a total area of a second horizontal cross-section of the wavelength-converting layer, taken between the first horizontal cross-section and the bottom surface, is equal to the total area of the bottom surface.
10. The light emitting element of claim 9, wherein a total area of a third horizontal cross-section of the wavelength-converting layer, taken between the first horizontal cross-section and the top surface, is equal to the total area of the bottom surface.
11. The light emitting element of claim 9, wherein a total area of a third horizontal cross-section of the wavelength-converting layer, taken between the first horizontal cross-section and the top surface, is greater than the total area of the first horizontal cross-section.
12. The light emitting element of claim 9, wherein a total area of a third horizontal cross-section of the wavelength-converting layer, taken between the first horizontal cross-section and the top surface, is equal to the total area of the first horizontal cross-section.
13. A light emitting element, comprising:
a light emitting diode (LED) chip having an upper surface; and
a wavelength-converting layer having a top surface, an opposing bottom surface, and sidewalls extending from the to surface to the bottom surface, the bottom surface being disposed on the upper surface of the LED chip, the wavelength-converting layer configured to convert a wavelength of light emitted from the LED chip, wherein,
a total area of the bottom surface is less than or equal to a total area of the upper surface,
a total area of a first horizontal cross-section of the wavelength-converting layer, taken between the top and bottom surfaces, is greater than a total area of the upper surface of the LED chip,
a total area of a second horizontal cross-section of the wavelength-converting layer, taken between the first horizontal cross-section and the bottom surface, is greater than the total area of the bottom surface and is less than the total area of the first horizontal cross section, and;
a total area of a third horizontal cross-section of the wavelength-converting layer, taken between the first horizontal cross-section and the top surface, is greater than the total area of the bottom surface and is less than the total area of the first horizontal cross section.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A kettle assembly for soup comprising a kettle part and a lid, characterised in that the kettle part comprises a cylindrical outer container and a cylindrical inner container fitting inside said outer container, said inner container having therein a vertical separating plate, such that at least two compartments are formed and that the lid comprises a hinge, such that each of the compartments of the inner container can be opened separately.
2. A kettle assembly according to claim 1, wherein the inner container comprises two compartments.
3. A kettle assembly according to claim 1, wherein the outer container comprises two handles.
4. A kettle assembly according to claim 1, comprising electrical heating means in the bottom of the outer container.
5. A kettle assembly according to claim 4, wherein the electrical heating means also comprise temperature control means.
6. A kettle assembly according to claim 4, wherein the temperature control means comprise a bimetallic mechanism type of soup by using the kettle assembly for soup according to claim 1.