1. A chip stack structure having a shielding capability, comprising:
a wiring substrate, the wiring substrate including a ground layer;
a first chip attached on an upper surface of the wiring substrate and electrically connected to the ground layer;
a plurality of first bonding wires which electrically connect the first chip to the wiring substrate;
a shield plate attached to the first chip and detached from at least one of the plurality of first bonding wires, the shield plate being configured to cover the first chip and at least one of the plurality of first bonding wires;
a grounding wire which connects the shield plate to the ground layer of the wiring substrate;
a second chip attached to and supported by the shield plate; and
a plurality of second bonding wires which connect the second chip directly or via the shield plate to the wiring substrate.
2. The chip stack structure of claim 1, further comprising a conductive adhesive which attaches the first chip to the upper surface of the wiring substrate and electrically connects the first chip to the ground layer of the wiring substrate.
3. The chip stack structure of claim 2, wherein the shield plate comprises:
a conductive reinforcement plate which covers the first chip and a region of the wiring substrate where the plurality of first bonding wires are bonded; and
a non-conductive adhesion layer formed at a lower surface of the reinforcement plate and facing the first chip, wherein the non-conductive adhesion layer attaches the reinforcement plate to the first chip and isolates the lower surface of the reinforcement plate from at least one of the plurality of first bonding wires.
4. The chip stack structure of claim 3, wherein at least a region of an upper surface of the reinforcement plate where the grounding and plurality of second bonding wires are bonded is plated with at least one of nickel-gold, nickel-silver, and nickel-palladium.
5. The chip stack structure of claim 4, wherein a thickness of the adhesion layer of the shield plate is greater than the heights of the plurality of first bonding wires above the upper surface of the first chip.
6. The chip stack structure of claim 5, wherein the adhesion layer of the shield plate is a non-conductive adhesive tape.
7. The chip stack structure of claim 6, wherein the reinforcement plate of the shield plate includes:
an insulating layer;
metal layers formed at two surfaces of the insulating layer; and
vias penetrating the insulating layer to interconnect the metal layers.
8. The chip stack structure of claim 1, wherein the first chip is smaller than the second chip.
9. The chip stack structure of claim 8, wherein the first chip is a radio frequency (RF) device and the second chip is a baseband device.
10. The chip stack structure of claim 8, further comprising at least one semiconductor chip stacked on the second chip.
11. The chip stack structure of claim 1, wherein the first chip is larger than the second chip.
12. The chip stack structure of claim 11, further comprising at least one semiconductor chip stacked on the second chip.
13. The chip stack structure of claim 1, wherein the wiring substrate is any one of a printed circuit board, tape circuit substrate, ceramic substrate, silicon substrate, and leadframe.
14. A system-in-package module having a shielding capability, comprising: a chip stack structure having a shielding capability comprising:
a wiring substrate, the wiring substrate including a ground layer;
a first chip attached on an upper surface of the wiring substrate and electrically connected to the ground layer;
a plurality of first bonding wires which electrically connect the first chip to the wiring substrate;
a shield plate attached to the first chip and detached from at least one of the plurality of first bonding wires, the shield plate being configured to cover the first chip and at least one of the plurality of first bonding wires;
a grounding wire which connects the shield plate to the ground layer of the wiring substrate;
a second chip attached to and supported by the shield plate;
a plurality of second bonding wires which connect the second chip directly or via the shield plate to the wiring substrate;
a molding compound which encapsulates the first chip stacked on the wiring substrate, the second chip, and the plurality of first and second bonding wires; and
a plurality of external interface terminals formed outside the molding compound and connected to the wiring substrate.
15. The system-in-package module of claim 14, wherein the first chip is smaller than the second chip.
16. The system-in-package module of claim 15, wherein the first chip is a radio frequency (RF) device and the second chip is a baseband device.
17. The system-in-package module of claim 15, further comprising at least one semiconductor chip stacked on the second chip.
18. The system-in-package module of claim 14, wherein the first chip is larger than the second chip.
19. The system-in-package module of claim 18, further comprising at least one semiconductor chip stacked on the second chip.
20. The system-in-package module of claim 14, wherein the wiring substrate is any one of a printed circuit board, tape circuit substrate, ceramic substrate, silicon substrate, and leadframe.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An automatic transmission comprising:
an input shaft rotatably supported inside a transmission case and rotatable by a driving force received from a drive source, a rotational speed of the input shaft being changeable into a plurality of rotational speeds through a plurality of gear ratios to be output from an output member;
a first planetary gear set including a first sun gear, a first carrier, and a first ring gear defined as a first element, a second element, and a third element in a collinear diagram representing relative rotational speed ratios of the first to third elements using straight lines, the first to third elements being arranged in the collinear diagram in sequence from one side of the collinear diagram at intervals corresponding to transmission gear ratios of the collinear diagram;
a second planetary gear set including a second sun gear, a second carrier, and a second ring gear defined as a fourth element, a fifth element, and a sixth element in the collinear diagram representing relative rotational speed ratios of the fourth to sixth elements using straight lines, the fourth to sixth elements being arranged in sequence from one side of the collinear diagram at intervals corresponding to transmission gear ratios of the collinear diagram;
a third planetary gear set including a third sun gear, a third carrier, and a third ring gear defined as a seventh element, an eighth element, and a ninth element in the collinear diagram representing relative rotational speed ratios of the seventh to ninth elements using straight lines, the seventh to ninth elements being arranged in sequence from one side of the collinear diagram at intervals corresponding to transmission gear ratios of the collinear diagram;
a fourth planetary gear set including a fourth sun gear, a fourth carrier, and a fourth ring gear defined as a tenth element, an eleventh element, and a twelfth element in the collinear diagram, the tenth to twelfth elements being arranged in sequence from one side of the collinear diagram at intervals corresponding to transmission gear ratios of the collinear diagram, the first element being connected to the input shaft, the tenth element being connected to the output member, the second element being connected to the fifth and ninth elements to form a first connected member, the third element being connected to the twelfth element to form a second connected member, the eighth element being connected to the eleventh element to form a third connected member; and
an engagement mechanism comprising:
a first engagement device switchable between an engagement mode in which the first element is connected to the third connected member and a release mode in which the first element is disconnected from the third connected member;
a second engagement device switchable between an engagement mode in which the first element is connected to the fourth element and a release mode in which the first element is disconnected from the fourth element;
a third engagement device switchable between an engagement mode in which the sixth element is connected to the second connected member and a release mode in which the sixth element is disconnected from the second connected member;
a fourth engagement device switchable between an engagement mode in which any two of the tenth element, the second connected member, and the third connected member are connected to each other and a release mode in which said two of the tenth element, the second connected member, and the third connected member are disconnected from each other;
a fifth engagement device switchable between an engagement mode in which the seventh element is connected to the transmission case and a release mode in which the seventh element is disconnected from the transmission case;
a sixth engagement device switchable between an engagement mode in which the sixth element is connected to the transmission case and a release mode in which the sixth element is disconnected from the transmission case; and
a seventh engagement device switchable between an engagement mode in which the fourth element is connected to the transmission case and a release mode in which the fourth element is disconnected from the transmission case, nine or more forward transmission gear ratios being established by setting each of at least three engagement devices among the first to seventh engagement devices in the engagement mode.
2. The automatic transmission according to claim 1,
wherein the first ring gear of the first planetary gear set is defined as the third element,
wherein the fourth sun gear of the fourth planetary gear set is defined as the twelfth element,
wherein the fourth planetary gear set is disposed outward of the first planetary gear set in a radial direction, and
wherein the fourth sun gear of the fourth planetary gear set and the first ring gear of the first planetary gear set are integrated with each other to form the second connected member.
3. The automatic transmission according to claim 1, wherein at least one of the fourth engagement device, the fifth engagement device, and the seventh engagement device comprises a meshing mechanism.
4. The automatic transmission according to claim 1, further comprising:
a one-way clutch to allow a normal rotation of the fourth element and to inhibit a reverse rotation of the fourth element,
wherein the seventh engagement device comprises a friction engagement clutch, and
wherein the one-way clutch is disposed parallel to the friction engagement clutch.
5. The automatic transmission according to claim 1, further comprising:
a start clutch to transfer the driving force of the drive source to the input shaft.
6. The automatic transmission according to claim 1, further comprising:
a torque converter to transfer the driving force of the drive source to the input shaft.
7. The automatic transmission according to claim 1,
wherein the first sun gear of the first planetary gear set is defined as the first element,
wherein the first carrier of the first planetary gear set is defined as the second element, and
wherein the first ring gear of the first planetary gear set is defined as the third element.
8. The automatic transmission according to claim 1,
wherein the second sun gear of the second planetary gear set is defined as the sixth element,
wherein the second carrier of the second planetary gear set is defined as the fifth element, and
wherein the second ring gear of the second planetary gear set is defined as the fourth element.
9. The automatic transmission according to claim 1,
wherein the third sun gear of the third planetary gear set is defined as the seventh element,
wherein the third carrier of the third planetary gear set is defined as the eighth element, and
wherein the third ring gear of the third planetary gear set is defined as the ninth element.
10. The automatic transmission according to claim 1,
wherein the fourth sun gear of the fourth planetary gear set is defined as the twelfth element,
wherein the fourth carrier of the fourth planetary gear set is defined as the eleventh element, and
wherein the fourth ring gear of the fourth planetary gear set is defined as the tenth element.