1. Method for producing a zeroth-order or low-order phase delay: element, in particular a phase delay element for wavelengths \u03bb<200 nm, the phase delay element being formed from a birefringent crystalline material, in which
a) an anisotropic crystal plate connected via a first connecting layer to a first carrier plate is connected to a second carrier plate on the side averted from the first carrier plate by means of a second connecting layer,
b) after which the two connecting layers are sequentially removed, and
c) an immersion liquid is respectively applied to the exposed surfaces of the anisotropic crystal plate and a support plate is mounted in each case.
2. Method according to claim 1, wherein said anisotropic crystal plate and the two support plates are interconnected mechanically.
3. Method according to claim 1, wherein
a) said first carrier plate is detached in a first step in the region of the first connecting layer, after which
b) said first connecting layer is removed by means of a first solvent, after which
c) the immersion liquid is applied to the exposed first surface of said anisotropic crystal plate, and said first support plate is subsequently mounted, after which
d) said second connecting layer is removed with the aid of a second solvent, and after which
e) said second support plate is mounted on the exposed second surface of the anisotropic crystal plate, immersion liquid likewise being introduced between said second support plate and the second surface of said anisotropic crystal plate.
4. Method according to claim 1, wherein said anisotropic crystal plate connected to said first carrier plate is produced in that
said first carrier plate is firstly provided with a plane-processed surface,
said anisotropic crystal plate is connected to said first carrier plate via the first connecting layer,
after which a large part of the anisotropic crystal plate is detached except for a residual layer, and after which
an end thickness of said anisotropic crystal plate is achieved by means of further production and polishing methods.
5. Method according to claim 1, wherein said first solvent is selected such that it does not attack said second connecting layer.
6. Method according to claim 2, wherein said second solvent is simultaneously used as immersion liquid.
7. Method according to claim 3, wherein said second solvent is an organic solvent.
8. Method according to claim 3, wherein said second solvent is cyclohexane.
9. Method according to claim 1, wherein after the detachment of said first carrier plate residues of said carrier plate remaining on said first connecting layer are removed by a lapping operation.
10. Method according to claim 1, wherein said second connecting layer has a thickness of 0.2-0.5 mm.
11. Zeroth-order or low-order phase delay element, in particular for use in semiconductor lithography, comprising an anisotropic crystal plate, the anisotropic crystal plate being mechanically fixed between two support plates, and an immersion liquid being located between the support plates and the anisotropic crystal plate.
12. Phase delay element according to claim 11, wherein said anisotropic crystal plate is formed from Al2O3, MgF2, SiO2 or LaF3.
13. Phase delay element according to claim 11 or 12, wherein said anisotropic crystal plate has a thickness in the range from 2 \u03bcm to 13 \u03bcm.
14. Phase delay element according to claim 11, wherein an organic liquid is provided as immersion liquid.
15. Phase delay element according to claim 11, wherein said immersion liquid is cyclohexane.
16. Phase delay element according to claim 11, wherein said immersion liquid is formed on both sides of the anisotropic crystal plate as a film with a thickness of 5-50 \u03bcm.
17. Phase delay element according to claim 11, wherein said support plates are constructed as silica glass plates.
18. Phase delay element according to claim 11, wherein said support plates and said anisotropic crystal plate are fixed in plane-parallel fashion in a mechanical mount, the mechanical mount sealing from the outside an immersion space, filled with immersion liquid, around the anisotropic crystal plate.
19. Phase delay element according to claim 18, wherein said mechanical mount has at least one closable bore through which immersion liquid can be fed or discharged.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A system for attachment of an electrode for igniting a flame in gas hobs, boilers or the like, comprising: a burner body from which there laterally extends a support connected to the burner body, the support being provided with a seat for housing an electrode, the electrode being provided with a groove for housing an element for attachment of the electrode, wherin the system comprises a deformable attachment element for the electrode of substantially annular shape, the deformable attachment member being housed in the groove in the electrode in such that when the electrode fitted with the deformable attachment element is inserted into the seat following the application of an axial insertion force deformable attachment element deforms within the seat reversibly attaching the electrode in an operating position within the seat of the support of the burner body.
2. The system according to claim 1, in which the deformable attachment element is a material capable of supporting a working temperature within the range from 150\xb0 C. to 200\xb0 C.
3. The system according to claim 2, in which the deformable attachment element is a silicone material.
4. The system according to claim 1, in which the support is one piece with the burner body
5. The system according to claim 1, in which the seat for attachment of the electrode also comprises a groove opposite the groove, the groove and the said groove being capable of holding the deformable attachment element in a sealing position.
6. The system according to claim 1, wherein the electrode has an abutting edge which can engage a top surface of the support.
7. The system according to claim 1, in which the electrode has a further seat for resilient attachment of electrode to an underside of the support by means of a resilient clip.
8. An electrode for igniting the flame of a burner of a gas hob comprising an insulating body, a conductor enclosed in the insulating body, a groove to receive electrode fixing means, wherein the fixing means comprises resilient attachment means in the groove, the resilient attachment means of substantially annular shape being such as to permit reversible attachment of the electrode to a burner body when in use following application of an axial insertion force.
9. The electrode according to claim 6, in which the resilient attachment means is a seal of resilient material of circular section.
10. The electrode according to claim 6, in which the groove is provided in the said insulating body.
11. The electrode according to claim 6, further comprising a further seat for attachment of the electrode to the support through a resilient clip.
12. The electrode according to claim 6, wherein the burner body with a support which is connected thereto, the support being provided with a seat for thee electrode, wherein the seat also comprises a groove opposite the groove for further housing a resilient attachment element for the electrode and a notch for the passage of a connection cable for the electrode.