1-20. (canceled)
21. A network device for use in a host on a network, the network device comprising:
a network port adapted to send and receive network information; and
a module that disables at least one of transmit and receive functionality to the network port of the network device until the network device is notified that the host has been authenticated.
22. The network device of claim 21, further comprising a firewall adapted to prevent the network device from communicating with other devices according to firewall policy information stored at the firewall.
23. The network device of claim 22, further comprising nonvolatile memory, and wherein the firewall policy information is stored in the nonvolatile memory.
24. The network device of claim 22, wherein the network device is adapted to receive firewall policy information from a firewall policy server.
25. The network device of claim 21, wherein the network device is embodied as a network interface card.
26. The network device of claim 25, wherein the network device is embodied as a Secure CardBus network card.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1-117. (canceled)
118. A method of reducing phononic coupling between a graphene monolayer and a substrate, comprising:
providing a substrate formed of aerogel; and
placing a monolayer film of graphene in contact with the substrate.
119. The method of claim 118, further comprising co-forming the film of graphene with the aerogel.
120. The method of claim 118, further comprising forming the graphene film separately from the aerogel substrate.
121. The method of claim 120, further comprising configuring the graphene film and the aerogel substrate such that the graphene film and the aerogel substrate chemically bond.
122. The method of claim 120, further comprising mechanically coupling the graphene film to the aerogel substrate.
123. The method of claim 118, further comprising heating the graphene film prior to placing the graphene film in contact with the aerogel substrate.
124. The method of claim 118, further comprising cooling the graphene film prior to placing the graphene film in contact with the aerogel substrate.
125. The method of claim 118, further comprising forming the graphene at a first temperature;
wherein the graphene film is configured to be operated at a second temperature lower than the first temperature.
126. The method of claim 118, further comprising forming the graphene at a first temperature;
wherein the graphene film is configured to be operated at a second temperature higher than the first temperature.
127. The method of claim 118, further comprising configuring the aerogel substrate such that it provides a tensile force to the graphene film.
128. The method of claim 118, further comprising configuring the aerogel substrate such that it provides a compressive force to the graphene film.
129. The method of claim 118, further comprising applying a first tensile force to the graphene film in a first direction.
130. (canceled)
131. (canceled)
132. The method of claim 118, further comprising forming the aerogel using a sol-gel process.
133. The method of claim 118, wherein the aerogel substrate comprises silica.
134. The method of claim 118, wherein the aerogel substrate comprises carbon.
135. The method of claim 134, wherein the aerogel substrate comprises carbon nanotubes.
136. (canceled)
137. (canceled)
138. The method of claim 118, further comprising disposing a second graphene film on the first graphene film opposite the aerogel substrate.
139. The method of claim 138, wherein the second graphene film comprises a monolayer film of graphene.
140. The method of claim 118, wherein the aerogel substrate comprises a first side and a second side, the first graphene film disposed on the first side; and
further comprising disposing a second graphene film on the second side of the aerogel substrate.
141-143. (canceled)
144. The method of claim 118, wherein the aerogel substrate comprises a first substantially homogeneous surface disposed adjacent the first monolayer film of graphene.
145. (canceled)
146. (canceled)
147. The method of claim 118, wherein the aerogel substrate comprises a first substantially structured surface disposed adjacent the first monolayer film of graphene.
148. (canceled)
149. (canceled)
150. The method of claim 118, further comprising providing at least one support structure at a lateral edge of the monolayer film of graphene.
151-153. (canceled)
154. The method of claim 118, wherein the aerogel substrate comprises a surface layer and a bulk layer, and wherein the properties of the surface layer differ from the properties of the bulk layer.
155. The method of claim 118, further comprising disposing a second aerogel substrate on a second side of the monolayer film of graphene.
156. The method of claim 118, wherein the monolayer film of graphene comprises a macroscopic film.
157. The method of claim 118, further comprising doping the graphene film with a non-carbon atom.
158. The method of claim 118, further comprising doping the graphene film with a functional group extending out of the graphene plane.
159-167. (canceled)
168. The method of claim 118, further comprising cooling the substrate prior to placing the monolayer film of graphene in contact with the substrate.
169. The method of claim 118, further comprising heating the substrate prior to placing the monolayer film of graphene in contact with the substrate.
170. A method of preserving electronic properties in a mechanically supported graphene sheet, comprising:
providing a substrate formed of aerogel;
providing a graphene film comprising one or more devices disposed thereon; and
disposing the graphene film on the substrate.
171. The method of claim 170, wherein the device comprises a photonic circuit.
172. The method of claim 170, wherein the device comprises a plasmonic circuit.
173. The method of claim 170, wherein the device comprises an electronic circuit.
174. The method of claim 170, wherein the device comprises an integrated circuit.
175. The method of claim 170, wherein the device comprises a microelectromechanical device.
176. The method of claim 170, wherein the graphene film comprises a monolayer of graphene.
177. The method of claim 170, further comprising disposing a second graphene film on the substrate.
178-183. (canceled)
184. The method of claim 170, wherein the aerogel substrate comprises a first substantially homogeneous surface disposed adjacent the first graphene film.
185. (canceled)
186. (canceled)
187. The method of claim 170, wherein the aerogel substrate comprises a first substantially structured surface disposed adjacent the first graphene film.
188. (canceled)
189. (canceled)
190. The method of claim 170, further comprising providing at least one support structure at a lateral edge of the monolayer film of graphene.
191-194. (canceled)
195. The method of claim 170, wherein the aerogel substrate comprises a surface layer and a bulk layer, and wherein the properties of the surface layer differ from the properties of the bulk layer.
196. The method of claim 170, further comprising disposing a second aerogel substrate on a side of the graphene film opposite the first substrate.
197. The method of claim 170, wherein the graphene film comprises a macroscopic film.
198. The method of claim 170, further comprising doping the graphene film with a non-carbon atom.
199. The method of claim 170, further comprising doping the graphene film with a functional group extending out of the graphene plane.
200-204. (canceled)
205. The method of claim 170, further comprising bonding the graphene film to the substrate.
206. The method of claim 170, further comprising mechanically coupling the graphene film to the substrate.
207. (canceled)
208. A method of forming a circuit board, comprising:
providing a graphene film having one or more devices disposed thereon;
providing a substrate formed of aerogel, the substrate comprising a first side and a second side opposite the first side;
disposing a first portion of the graphene film to the first side of the substrate; and
disposing a second portion of the graphene film on the second side of the substrate.
209. The method of claim 208, wherein the device comprises a photonic circuit.
210. The method of claim 208, wherein the device comprises a plasmonic circuit.
211. The method of claim 208, wherein the device comprises an electronic circuit.
212. The method of claim 208, wherein the device comprises an integrated circuit.
213. The method of claim 208, further comprising:
providing a second substrate formed of aerogel, the second substrate comprising a first side and a second side opposite the first side; and
disposing the first side of the second substrate on the second portion of the graphene film opposite the first substrate; and
disposing a third portion of the graphene film on the second side of the second substrate.
214. The method of claim 208, further comprising:
providing a second substrate formed of aerogel, the second substrate comprising a first side and a second side opposite the first side; and
disposing the first side of the second substrate on the first portion of the graphene film opposite the first substrate; and
disposing a third portion of the graphene film on the second side of the second substrate.
215. The method of claim 208, further comprising folding the graphene film over the substrate.
216. A circuit board, comprising:
a first substrate formed of aerogel, the first substrate comprising a first side and a second side opposite the first side;
a graphene film comprising a first portion and a second portion and having one or more devices disposed thereon;
wherein the first portion of the graphene film is disposed adjacent the first side of the substrate, and wherein the second portion of the graphene film is disposed adjacent the second side of the substrate.
217. The circuit board of claim 216, wherein the device comprises a photonic circuit.
218. The circuit board of claim 216, wherein the device comprises a plasmonic circuit.
219. The circuit board of claim 216, wherein the device comprises an electronic circuit.
220. The circuit board of claim 216, wherein the device comprises an integrated circuit.
221. The circuit board of claim 216, further comprising:
a second substrate formed of aerogel, the second substrate comprising a first side and a second side opposite the first side; and
wherein the first side of the second substrate is disposed adjacent the second portion of the graphene film opposite the first substrate; and
wherein a third portion of the graphene film is disposed adjacent the second side of the second substrate.
222. The circuit board of claim 216, further comprising:
a second substrate formed of aerogel, the second substrate comprising a first side and a second side opposite the first side; and
wherein the first side of the second substrate is disposed adjacent the first portion of the graphene film opposite the first substrate; and
wherein a third portion of the graphene film is disposed adjacent the second side of the second substrate.
223. The circuit board of claim 216, wherein a lateral end of the first substrate is formed to support a portion of the graphene film between the first portion and the second portion.