1. A computing device configured to display a graphical user interface of money management information related to a tradeable object being traded in an electronic trading environment, the computing device comprising:
a processing device programmed to display a graphical user interface having:
a first axis representing a profit level for the tradeable object;
a second axis representing a quantity level for the tradeable object;
a plurality of money management regions associated with a plurality of money management parameters for controlling order parameters, each money management region being displayed in relation to the first axis and the second axis, and each money management region being associated with a range of profit levels on the first axis and a range of quantities on the second axis for order quantities of orders submitted to an electronic exchange when each of the plurality of money management regions controls a trader’s order;
a profit level indicator representing a particular profit level for a trading entity incurred up to a current time and being dynamically displayed in a first location of one of the plurality of the money management regions along the first axis based on the particular profit level, wherein the profit level indicator is dynamically displayed in different locations of the plurality of money management regions as the particular profit level changes, and wherein the first location corresponds to a first set of money management parameters of the one of the plurality of money management regions being currently used to control trader’s orders before the orders are sent to the electronic exchange; and
a potential profit indicator displayed in relation to the profit level indicator, the potential profit indicator corresponding to a potential profit or a potential loss that would be incurred when an order for a specific order quantity is submitted to the electronic exchange while a preset market movement is detected in relation to a position created with the specific order quantity.
2. The computing device of claim 1, wherein the particular profit level is based on a realized profit level representing a difference between (a total sell price\xd7quantity bought) and (a total buy price\xd7quantity bought) associated with trades up to the current time.
3. The computing device of claim 1, wherein the profit level indicator moves relative to the first axis when the particular profit level changes.
4. The computing device of claim 1, further comprising:
another potential profit indicator in relation to the profit level indicator, the another potential profit indicator corresponding to another potential profit or a potential loss that would be incurred when the order for the specific order quantity is submitted to the electronic exchange while another preset market movement is detected in relation to the position created with the specific order quantity.
5. The computing device of claim 1, wherein the profit level indicator comprises a graphical indicator positioned in the first location, and wherein the graphical indicator comprises a line perpendicular to the first axis.
6. The computing device of claim 1, wherein the potential profit indicator comprises a graphical indicator positioned in relation to the profit level indicator, and wherein the graphical indicator comprises a line.
7. The computing device of claim 6, wherein the line is positioned at an angle corresponding to the preset market movement.
8. The computing device of claim 1, wherein the preset market movement comprises a preset price movement.
9. The computing device of claim 1, wherein the plurality of money management parameters for controlling order parameters comprises a maximum net position.
10. The computing device of claim 9, wherein the range of quantities corresponding to each money management region is based on the maximum net position associated with each money management region.
11. The computing device of claim 1, wherein the plurality of money management parameters for controlling order parameters comprises a maximum order quantity for orders to be submitted to the electronic exchange.
12. The computing device of claim 10, wherein the range of quantities corresponding to each money management region is based on the maximum order quantity associated with each money management region.
13. The computing device of claim 11, further comprising:
displaying a maximum order quantity indicator in relation to each money management region.
14. A computer readable medium having stored therein instructions executable by a processor to perform a method for displaying money management information related to a tradeable object being traded in an electronic trading environment comprising:
displaying, on a display device associated with the processor, a graphical user interface having a first axis representing a profit level for the tradeable object;
displaying on the graphical user interface a second axis representing a quantity level for the tradeable object;
displaying a plurality of money management regions associated with a plurality of money management parameters for controlling order parameters, each money management region being displayed in relation to the first axis and the second axis, and each money management region being associated with a range of profit levels on the first axis and a range of quantities on the second axis for order quantities of orders submitted to an electronic exchange when each of the plurality of money management regions controls a trader’s order;
displaying a profit level indicator representing a particular profit level for a trading entity incurred up to a current time and being dynamically displayed in a first location of one of the plurality of the money management regions along the first axis based on the particular profit level, wherein the profit level indicator is dynamically displayed in different locations of the plurality of money management regions as the particular profit level changes, and wherein the first location corresponds to a first set of money management parameters of the one of the plurality of money management regions being currently used to control trader’s orders before the orders are sent to the electronic exchange; and
displaying a potential profit indicator displayed in relation to the profit level indicator, the potential profit indicator corresponding to a potential profit or a potential loss that would be incurred when an order for a specific order quantity is submitted to the electronic exchange while a preset market movement is detected in relation to a position created with the specific order quantity.
15. The computer readable medium of claim 14, wherein the particular profit level is based on a realized profit level representing a difference between (a total sell price\xd7quantity bought) and (a total buy price\xd7quantity bought) associated with trades up to the current time.
16. The computer readable medium of claim 14, wherein the profit level indicator moves relative to the first axis when the particular profit level changes.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An apparatus comprising:
a dual microstrip feed line circuitry underneath a bottom dielectric substrate;
a ground plane layer overlying the bottom dielectric substrate, the ground plane layer having coupling apertures etched to the ground plane layer;
a middle dielectric substrate overlying the bottom dielectric substrate and the ground plane layer;
a middle metallized patch layer stacked over the middle dielectric substrate;
a top dielectric substrate over the middle dielectric substrate and the middle metallized patch layer;
a top metallized patch layer stacked underneath the top dielectric substrate and above the middle metallized patch layer for generating two polarized beams with the middle metallized patch layer; and
an air layer between the middle dielectric substrate and the top dielectric substrate separating the middle metallized patch layer and the top metallized patch layer,
wherein the dual microstrip feed line circuitry is configured to utilize corner-feeding techniques to enable diagonal modes of the patch layers, and each of the coupling apertures of the ground plane layer are configured with a non-resonant bow-tie shape to enable aperture coupling between the microstrip feed line circuitry and the middle metallized patch layer and the top metallized patch layer.
2. The apparatus of claim 1, wherein feed lines of the dual microstrip feed line circuitry are positioned parallel to each other.
3. The apparatus of claim 1, wherein feed lines of the dual microstrip feed line circuitry each include a matching stub that extends towards the center of the middle metallized patch layer, wherein the matching stubs are spaced from each other.
4. The apparatus of claim 3, wherein each matching stub includes a tip bending ninety degrees in relation to the matching stub and extending outwards from a center of the bottom dielectric substrate.
5. The apparatus of claim 3, wherein each matching stub is bent forty-five degrees in relation to first parts of the feed lines.
6. The apparatus of claim 1, wherein the bow-tie shape of each of the coupling apertures of the ground plane comprises a middle part and two end parts, and wherein each of the coupling apertures are continuously narrowed towards the middle part with respect to the end parts.
7. The apparatus of claim 1, wherein the coupling apertures are in perpendicular alignment with respect to respective matching stubs.
8. The apparatus of claim 1, wherein a middle part of each of the coupling apertures and respective matching stubs are opposed.
9. The apparatus of claim 1, wherein the ground plane layer is provided with an electromagnetic bandgap ground plane for reducing mutual coupling between antenna elements.
10. The apparatus of claim 1, wherein the middle dielectric substrate and the top dielectric substrate are equal in thickness and a thickness of the bottom dielectric substrate is less than or equal to half of the thickness of the middle or top dielectric substrate.
11. The apparatus of claim 1, wherein the bottom dielectric substrate has a thickness of 0.5-1.0 mm and a dielectric constant of 3-4, the middle dielectric substrate has a thickness of 1-2 mm and a dielectric constant of 2-2.5, and the top dielectric substrate has a thickness of 1-2 mm and a dielectric constant of 2-2.5.
12. The apparatus of claim 1, wherein the dual microstrip feed line circuitry, the ground plane layer, the middle metallized patch layer and the top metallized patch layer each have a thickness of 18-35 \u03bcm.
13. The apparatus of claim 1, wherein a total height of the dual-polarized microstrip patch antenna structure is 12.5-19 mm.
14. The apparatus of claim 1, wherein the air layer comprises an air gap or a foam layer.
15. The apparatus of claim 1, wherein the air layer has a height of 10-14 mm.
16. The apparatus of claim 1, wherein a surface area of the middle metallized patch layer is 1849-2209 mm2 and the surface area of the top metallized patch layer is 2401-2809 mm2.
17. The apparatus of claim 16, wherein the surface area of the middle dielectric substrate is 3025-6400 mm2.
18. The apparatus of claim 1, wherein a surface area of the middle dielectric substrate is larger than that of the middle metallized patch layer.
19. The apparatus of claim 1, wherein the middle metallized patch layer andor the top metallized patch layer are 0.5-1.5-mm-thick brass or aluminum.
20. A method comprising:
assembling a dual microstrip feed line circuitry underneath a bottom dielectric substrate;
providing a ground plane layer over the bottom dielectric substrate, the ground plane layer having coupling apertures etched to the ground plane layer;
providing a middle dielectric substrate over the bottom dielectric substrate and the ground plane layer;
assembling a middle metallized patch layer over the middle dielectric substrate;
providing a top dielectric substrate over the middle dielectric substrate and the middle metallized patch layer;
assembling a top metallized patch layer underneath the top dielectric substrate and above the middle metallized patch layer for generating two polarized beams with the middle metallized patch layer;
providing an air layer between the middle dielectric substrate and the top dielectric substrate separating the middle metallized patch layer and the top metallized patch layer;
providing each of the coupling apertures of the ground plane layer with a non-resonant bow-tie shape to enable aperture coupling between the micro-strip feed line circuitry and the patch layers; and
configuring the dual microstrip feed line circuitry to utilize corner-feeding techniques to enable diagonal modes of the middle metallized patch layer and the top metallized patch layer.
21. The method of claim 20, further comprising:
positioning feed lines of the dual microstrip feed line circuitry parallel to each other;
providing each feed line with a matching stub extending towards a center of the middle metallized patch layer; and
spacing the matching stubs from each other.
22. The method of claim 21, further comprising:
providing each matching stub with a tip bending ninety degrees in relation to the matching stub and extending outwards from a center of the bottom dielectric substrate; and
bending the matching stubs forty-five degrees in relation to the first parts of the feed lines.
23. The method of claim 20, further comprising:
providing the bow-tie shape of each of the coupling apertures of the ground plane by a middle part and two end parts, each of the coupling apertures being continuously narrowed towards the middle part with respect to the end parts.
24. The method of claim 20, further comprising:
configuring the coupling apertures in perpendicular alignment with respect to respective matching stubs.
25. The method of claim 20, further comprising:
configuring a middle part of each of the coupling apertures and respective matching stubs to be opposed.
26. The method of claim 20, wherein the bottom dielectric substrate has a thickness of 0.5-1.0 mm and a dielectric constant of 3-4; the dual microstrip feed line circuitry, the ground plane layer, the middle metallized patch layer and the top metallized patch layer each have thickness of 18-35 \u03bcm; the middle dielectric substrate has a thickness of 1-2 mm and a dielectric constant of 2-2.5; the top dielectric substrate has a thickness of 1-2 mm and a dielectric constant of 2-2.5; and the total height of the dual-polarized microstrip patch antenna structure is 12.5-19 mm.
27. The method of claim 20, wherein a surface area of the middle metallized patch layer is 1849-2209 mm2, the surface area of the top metallized patch layer is 2401-2809 mm2, and the surface area of the middle dielectric substrate is 3025-6400 mm2.
28. A base station comprising:
a dual-polarized microstrip patch antenna structure,
wherein the dual polarized microstrip patch antenna structure comprises
a dual microstrip feed line circuitry underneath a bottom dielectric substrate;
a ground plane layer overlying the bottom dielectric substrate, the ground plane layer having coupling apertures etched to the ground plane layer;
a middle dielectric substrate overlying the bottom dielectric substrate and the ground plane layer;
a middle metallized patch layer stacked over the middle dielectric substrate;
a top dielectric substrate over the middle dielectric substrate and the middle metallized patch layer;
a top metallized patch layer stacked underneath the top dielectric substrate and above the middle metallized patch layer for generating two polarized beams with the middle metallized patch layer; and
an air layer between the middle dielectric substrate and the top dielectric substrate separating the middle metallized patch layer and the top metallized patch layer, wherein
the dual microstrip feed line circuitry is configured to utilize corner-feeding techniques to enable diagonal modes of the patch layers, and each of the coupling apertures of the ground plane layer are configured with a non-resonant bow-tie shape to enable aperture coupling between the microstrip feed line circuitry and the middle metallized patch layer and the top metallized patch layer.
29. An apparatus comprising:
assembling means for assembling a dual microstrip feed line circuitry underneath a bottom dielectric substrate;
providing means for providing a ground plane layer over the bottom dielectric substrate, the ground plane layer having coupling aperatures etched to the ground plane layer;
providing means for providing a middle dielectric substrate over the bottom dielectric substrate and the ground plane layer;
assembling means for assembling a middle patch layer over the middle dielectric substrate;
providing means for providing a top dielectric substrate over the middle dielectric substrate and the middle metallized patch layer;
assembling means for assembling a top metallized patch layer underneath the top dielectric substrate and above the middle metallized patch layer for generating two polarized beams with the middle metallized patch layer;
providing means for providing an air layer between the middle dielectric substrate and the top dielectric substrate separating the middle metallized patch layer and the top metallized patch layer;
providing means for providing each of the coupling apertures of the ground plane layer with a non-resonant bow-tie shape to enable aperture coupling between the micro-strip feed line circuitry and the patch layers; and
configuring means for configuring the dual microstrip feed line circuitry to utilize corner-feeding techniques to enable diagonal modes of the middle metallized patch layer and the top metallized patch layer.