1. A variable adaptive mask for use with a physical vapor deposition process, comprising:
a fixed mask portion that comprises a top layer and a bottom layer;
a plurality of channels extending through the fixed mask portion;
a first plurality of wires positioned on the bottom layer, each wire of the first plurality of wires being disposed in a substantially spiral arrangement about a respective channel;
a second plurality of wires positioned on the top layer, each wire of the second plurality of wires being disposed in a substantially spiral arrangement about a respective channel; and
means for mounting the mask in a fixed position relative to a solid target material and a substrate.
2. The mask of claim 1, wherein the channels have a circular profile.
3. The mask of claim 1, wherein the channels have a rectangular profile.
4. The mask of claim 1, wherein the wires generate a magnetic field in the channels when electrical current is passed through the wires.
5. The mask of claim 4, wherein the wires are electrically connected to a computer or integrated circuit such that the magnetic field can be precisely controlled.
6. The mask of claim 1, farther comprising a hard ferromagnetic material placed within the channels.
7. The mask of claim 1, wherein the means for mounting comprises at least one mounting hole in the fixed mask portion.
8. The mask of claim 1, further comprising a calibration scale on the fixed mask portion.
9. A variable adaptive mask for use with a physical vapor deposition process, comprising:
a fixed mask portion including a calibration scale;
a plurality of channels extending through the fixed mask portion;
a plurality of wires positioned on the fixed mask portion, each wire of the plurality of wires being disposed in a substantially spiral arrangement about a respective channel; and
one or more mounting holes for mounting the mask in a fixed position relative to a solid target material and a substrate.
10. The mask of claim 8, wherein the channels are defined by a top layer and a bottom layer of the fixed mask portion.
11. The mask of claim 9, wherein the wires generate a magnetic field in the channels when electrical current is passed through the wires.
12. The mask of claim 11, wherein the wires are electrically connected to a computer or integrated circuit such that the magnetic field can be precisely controlled.
13. The mask of claim 9, further comprising a hard ferromagnetic material placed within the channels.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A micromechanical switch comprising:
a first semiconductor substrate having a frame projecting therefrom;
a hanging bar within the frame on the first substrate and having a first contact electrode at an end thereof;
an insulating layer between the hanging bar and the first semiconductor substrate;
a second semiconductor substrate having conductive tracks therein;
first peripheral spacers on said second substrate cooperating with the frame to define a chamber housing the hanging bar;
a second inputoutput electrode on said second substrate and in alignment with the first contact electrode;
a third starting electrode on said second substrate and in alignment with said hanging bar; and
a second central spacer located between the third starting electrode and said frame and adjoining said hanging bar and electrically connected to the conductive tracks;
the first peripheral spacers, the second inputoutput electrode and the third starting electrode being electrically connected to the conductive tracks.
2. A micromechanical switch according to claim 1, wherein said frame abuts said first peripheral spacers.
3. A micromechanical switch according to claim 1, wherein said frame comprises a conductive material.
4. A micromechanical switch according to claim 3, further comprising an insulating layer coating said frame.
5. A micromechanical switch according to claim 1, wherein said hanging bar comprises a conductive material.
6. A micromechanical switch according to claim 3, further comprising an insulating layer coating said hanging bar.
7. A micromechanical switch according to claim 1, further comprising a conductive sealing layer between the frame and the first peripheral spacers.
8. A micromechanical switch according to claim 1, further comprising:
a return electrode on said first substrate; and
an insulating layer between the return electrode and said first substrate.
9. A micromechanical switch comprising:
a first substrate;
a frame projecting from the first substrate;
a cantilever member within the frame on the first substrate and having a first contact electrode at an end thereof;
a second substrate comprising conductive tracks;
first peripheral spacers on said second substrate cooperating with the frame to define a chamber housing the cantilever member;
a second inputoutput electrode on said second substrate and in alignment with the first contact electrode; and
a second central spacer on said second substrate and adjoining said cantilever member, and being electrically connected to the conductive tracks;
the first peripheral spacers and the second inputoutput electrode being electrically connected to the conductive tracks.
10. A micromechanical switch according to claim 9, wherein said frame abuts said first peripheral spacers.
11. A micromechanical switch according to claim 9, wherein said frame comprises a conductive material.
12. A micromechanical switch according to claim 11, further comprising an insulating layer on said frame.
13. A micromechanical switch according to claim 9, wherein said cantilever member comprises a conductive material.
14. A micromechanical switch according to claim 13, further comprising an insulating layer on said cantilever member.
15. A micromechanical switch according to claim 9, further comprising a conductive sealing layer between the frame and the first peripheral spacers.
16. A micromechanical switch according to claim 9, further comprising:
a return electrode on said first substrate; and
an insulating layer between the return electrode and said first substrate.
17. A micromechanical switch comprising:
a first substrate;
a conductive frame projecting from the first substrate;
a first insulating layer on said conductive frame;
a conductive cantilever member within the conductive frame on the first substrate and having a first contact electrode at an end thereof;
a second insulating layer on said conductive cantilever member;
a second substrate comprising conductive tracks;
first peripheral spacers on said second substrate cooperating with the conductive frame to define a chamber housing the conductive cantilever member;
a second inputoutput electrode on said second substrate and in alignment with the first contact electrode; and
a second central spacer on said second substrate and adjoining said conductive cantilever member, and being electrically connected to the conductive tracks;
the first peripheral spacers and the second inputoutput electrode being electrically connected to the conductive tracks.
18. A micromechanical switch according to claim 17, wherein said conductive frame abuts said first peripheral spacers.
19. A micromechanical switch according to claim 17, further comprising a conductive sealing layer between the conductive frame and the first peripheral spacers.
20. A micromechanical switch according to claim 17, further comprising:
a return electrode on said first substrate; and
a third insulating layer between the return electrode and said first substrate.
21. A micromechanical switch comprising:
a first substrate;
a frame projecting from the first substrate;
a cantilever member within the frame on the first substrate and having a first contact electrode at an end thereof;
a second substrate comprising conductive tracks;
first peripheral spacers on said second substrate cooperating with the frame to define a chamber housing the cantilever member;
a second inputoutput electrode on said second substrate and in alignment with the first contact electrode;
a return electrode on said first substrate; and
an insulating layer between the return electrode and said first substrate;
the first peripheral spacers and the second inputoutput electrode being electrically connected to the conductive tracks.
22. A micromechanical switch according to claim 21, wherein said frame abuts said first peripheral spacers.
23. A micromechanical switch according to claim 21, wherein said frame comprises a conductive material.
24. A micromechanical switch according to claim 21, wherein said cantilever member comprises a conductive material.