1. A method of forming a cooling structure within a multiple die semiconductor structure, comprising
forming a conductive region within a first die of the multiple die semiconductor structure;
forming a first thermoelectric via within the multiple die semiconductor structure, such that it terminates at the conductive region and wherein the first thermoelectric via traverses a second die of the multiple die semiconductor structure;
forming a second thermoelectric via within the multiple die semiconductor structure, such that it terminates at the conductive region and wherein the second thermoelectric via traverses the second die of the multiple die semiconductor structure;
forming a first capture pad connected to the first thermoelectric via;
forming a second capture pad connected to the second thermoelectric via;
depositing a first thermoelectric material in the first thermoelectric via;
depositing a second thermoelectric material in the second thermoelectric via;
depositing an insulator layer on the second die of the multiple die semiconductor structure prior to forming the first thermoelectric via and the second thermoelectric via; and wherein:
depositing the first thermoelectric material in the first thermoelectric via comprises depositing the first thermoelectric material to a level below a top surface of the insulator layer; and wherein:
depositing the second thermoelectric material in the second thermoelectric via comprises depositing the first thermoelectric material to a level below a top surface of the insulator layer;
exposing a portion of the first thermoelectric via and the second thermoelectric via; and
forming a barrier layer on the exposed portion of the first thermoelectric via and the second thermoelectric via.
2. The method of claim 1, wherein the plurality of through-silicon vias are formed prior to forming the first thermoelectric via and the second thermoelectric via.
3. The method of claim 1, wherein the plurality of through-silicon vias are formed after forming the first thermoelectric via and the second thermoelectric via.
4. A method of forming a cooling structure within a multiple die semiconductor structure, comprising
forming a conductive region within a first die of the multiple die semiconductor structure;
forming a first thermoelectric via within the multiple die semiconductor structure, such that it terminates at the conductive region and wherein the first thermoelectric via traverses a second die of the multiple die semiconductor structure;
forming a second thermoelectric via within the multiple die semiconductor structure, such that it terminates at the conductive region and wherein the second thermoelectric via traverses the second die of the multiple die semiconductor structure;
depositing a first thermoelectric material in the first thermoelectric via;
depositing a second thermoelectric material in the second thermoelectric via;
depositing an insulator layer on the second die of the multiple die semiconductor structure prior to forming the first thermoelectric via and the second thermoelectric via; and wherein:
depositing the first thermoelectric material in the first thermoelectric via comprises depositing the first thermoelectric material to a level below a top surface of the insulator layer; and wherein:
depositing the second thermoelectric material in the second thermoelectric via comprises depositing the first thermoelectric material to a level below a top surface of the insulator layer;
exposing a portion of the first thermoelectric via and the second thermoelectric via; and
forming a barrier layer on the exposed portion of the first thermoelectric via and the second thermoelectric via.
5. The method of claim 4, wherein the plurality of through-silicon vias are formed prior to forming the first thermoelectric via and the second thermoelectric via.
6. The method of claim 4, wherein the plurality of through-silicon vias are formed after forming the first thermoelectric via and the second thermoelectric via.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What I claim is:
1. A device operable for injecting a fluid medium from a source of said fluid medium having a fluid output port into an interface between a handgrip and a tubular member, wherein the handgrip comprises an elongate, substantially cylindrical member comprised of an elastomeric material and having a cylindrical recess in an open end thereof, said cylindrical recess defining a cavity, said device comprising:
(a) a handle portion adapted to be grasped by a hand, said handle portion having a proximal end adapted to sealingly engage said fluid outlet port of said source of said fluid medium, a distal end and a first fluid-conducting conduit defining a first axis therebetween;
(b) an insertion tip having a proximal end affixed to and sealingly engaging said distal end of said handle portion, a distal end having an opening therein and a second fluid-conducting conduit in fluid communication with said first fluid-conducting conduit and said opening, said second fluid conducting conduit defining a second axis that is angled at about 90 with respect to to said first axis.
2. The device of claim 1 wherein said distal end of said insertion tip has an arcuate transverse cross-section.
3. The device of claim 1 wherein said handle portion further comprises a valve operable for contolling fluid flow through said first fluid-conducting conduit.
4. The device of claim 2 wherein said handle portion further comprises a valve operable for controlling fluid flow through said second fluid-conducting conduit.
5. A method for installing a handgrip comprising an elongate, substantially cylindrical member comprised of an elastomeric material and having a cylindrical recess in an open end thereof, said cylindrical recess defining a cavity, onto a tubular member comprising the steps of:
(a) inserting an end of said tubular member into said cavity: then
(b) injecting a fluid into said cavity; then
(c) advancing said tubular member into said cavity.
6. A method for removing a handgrip comprising an elongate, substantially cylindrical member comprised of an elastomeric material and having a cylindrical recess in an open end thereof, said cylindrical recess defining a cavity from a tubular member disposed within said cavity comprising the steps of:
a. injecting a fluid into said cavity; then
b. retracting said tubular member from within said cavity.